SCHEMBL7048133

SCHEMBL7048133

C=CC(=O)NC(O)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9807131 0.81 TSHR (0.52)
SCHEMBL12200013 0.79 TSHR (0.56)
SCHEMBL8891489 0.79 TSHR (0.56)
SCHEMBL7693766 0.79 TSHR (0.56)
SCHEMBL1472003 0.79
SCHEMBL514984 0.78 TSHR (0.50)
SCHEMBL1761096 0.77 TSHR (0.48)
SCHEMBL3683866 0.76 TSHR (0.52)
SCHEMBL363847 0.76 TSHR (0.52)
SCHEMBL451042 0.76 TSHR (0.52)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250162296-A1 MULTILAYER FILM TORAY INDUSTRIES, INC. (JP) 2025-05-22 US disclosed
EP-4541587-A1 MULTILAYER FILM Toray Industries, Inc. (JP) 2025-04-23 EP disclosed
CN-119768741-A Positive photosensitive resin composition 日产化学株式会社 2025-04-04 CN disclosed
CN-119604817-A Positive photosensitive resin composition 日产化学株式会社 2025-03-11 CN disclosed
CN-119212870-A Laminated film 东丽株式会社 2024-12-27 CN disclosed
CN-118192168-A Photosensitive resin composition 日产化学株式会社 2024-06-14 CN disclosed
CN-110537146-B Photosensitive resin composition 日产化学株式会社 2024-03-15 CN disclosed
WO-2023243692-A1 MULTILAYER FILM 東レ株式会社 2023-12-21 WO disclosed
CN-110573963-B Photosensitive resin composition 日产化学株式会社 2023-10-24 CN disclosed
US-9878523-B2 Laminated film TORAY INDUSTRIES, INC. (JP) 2018-01-30 US disclosed
US-4994133-A Impregnating substrate with unsaturated polyester; curing KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1991-02-19 US disclosed
US-4698367-A FOOD PACKAGES SEKISUI KASEIHIN KOGYO KABUSHIKI KAISHA (JP) 1987-10-06 US disclosed
US-4632961-A DISPERSING AMPHOTERIC RESIN NIPPON PAINT CO., LTD. (JP) 1986-12-30 US disclosed
US-4571279-A CELLULOSIC SUBSTRATE CROSSLINKED WITH UNSATURATED POLYESTER BY N-METHYLOL COMPOUND KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1986-02-18 US disclosed
EP-0031852-B1 PROCESS AND APPARATUS FOR CONTINUOUS PRODUCTION OF LAMINATES KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1985-11-21 EP disclosed
US-4451317-A Continuous process for producing reinforced resin laminates KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1984-05-29 US disclosed
US-4372800-A Continuous process for producing reinforced resin laminates KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1983-02-08 US disclosed
EP-0031852-A1 PROCESS AND APPARATUS FOR CONTINUOUS PRODUCTION OF LAMINATES KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1981-07-15 EP disclosed
US-4139672-A UNDERVOATING, ELECTROCOATING, INTERMEDIATE COAT CONTAINING METAL FARBOXYLIC ACID MITSUI TOATSU CHEMICALS, INC. (JP) 1979-02-13 US disclosed
US-4048136-A ACRYLIC RESINS, ENCAPSULATED METAL POWDERS, ALUMINUM MITSUI TOATSU KAGAKU KABUSHIKI KAISHA (MITSUI TOATSU CHEM., INC.) (JA) 1977-09-13 US disclosed