Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAPT | P10636 | 5/20 | 0.73 |
| ▸ | MEN1 | O00255 | 3/20 | 0.73 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.73 |
| ▸ | SMN1; SMN2 | Q16637 | 3/20 | 0.73 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.73 |
| ▸ | LMNA | P02545 | 1/20 | 0.73 |
| ▸ | OPRK1 | P41145 | 1/20 | 0.73 |
| ▸ | GFER | P55789 | 1/20 | 0.45 |
| ▸ | POLB | P06746 | 2/20 | 0.44 |
| ▸ | ESR1 | P03372 | 1/20 | 0.41 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.41 |
| ▸ | PDK2 | Q15119 | 6/20 | 0.41 |
| ▸ | TSHR | P16473 | 1/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.37 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.37 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.37 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.37 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.37 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.37 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30771578 | 0.91 | MEN1 (0.57) | MAPTMEN1KMT2ASMN1; SMN2KDM4E | |
| SCHEMBL6538799 | 0.91 | MEN1 (0.57) | MAPTMEN1KMT2ASMN1; SMN2KDM4E | |
| SCHEMBL29128950 | 0.86 | MAPT (0.79) | MAPTMEN1KMT2ASMN1; SMN2KDM4E | |
| SCHEMBL29426418 | 0.86 | MAPT (1.00) | MAPTMEN1KMT2ASMN1; SMN2KDM4E | |
| SCHEMBL29392989 | 0.86 | MAPT (1.00) | MAPTMEN1KMT2ASMN1; SMN2KDM4E | |
| SCHEMBL105428 | 0.86 | MAPT (1.00) | MAPTMEN1KMT2ASMN1; SMN2KDM4E | |
| Ammonia Solution, Strong SCHEMBL7052845 | 0.84 | MEN1 (0.96) | MAPTMEN1KMT2ASMN1; SMN2KDM4E | |
| Ammonia Solution, Strong SCHEMBL2046821 | 0.84 | MEN1 (0.96) | MAPTMEN1KMT2ASMN1; SMN2KDM4E | |
| SCHEMBL7051590 | 0.83 | MAPT (0.67) | MAPTMEN1KMT2ASMN1; SMN2KDM4E | |
| SCHEMBL17819277 | 0.82 | MAPT (0.92) | MAPTMEN1KMT2ASMN1; SMN2KDM4E |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2900726-B1 | RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN | HEXCEL COMPOSITES LTD (GB) | 2020-04-08 | — | — | EP | claimed |
| EP-2900726-A2 | RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN | Hexcel Composites Limited (GB) | 2015-08-05 | — | — | EP | claimed |
| US-20150210847-A1 | RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN | HEXCEL COMPOSITES LIMITED (GB) | 2015-07-30 | — | — | US | claimed |
| EP-0203828-B1 | EPOXY RESIN CURING AGENT, CURING PROCESS AND COMPOSITION CONTAINING IT | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1990-03-28 | — | — | EP | claimed |
| US-4684678-A | POLYEPOXIDES OF HIGH GLASS TRANSITION TEMPERATURE AND DUCTILITY | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1987-08-04 | — | — | US | claimed |
| EP-0203828-A1 | Epoxy resin curing agent, curing process and composition containing it | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1986-12-03 | — | — | EP | claimed |
| US-20210292545-A1 | PREPREG | TORAY INDUSTRIES, INC. (JP) | 2021-09-23 | — | — | US | disclosed |
| EP-3842481-A1 | PREPREG | Toray Industries, Inc. (JP) | 2021-06-30 | — | — | EP | disclosed |
| EP-3652244-A1 | RESIN COMPOSITION | Hexcel Composites Limited (GB) | 2020-05-20 | — | — | EP | disclosed |
| EP-2900726-B1 | RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN | HEXCEL COMPOSITES LTD (GB) | 2020-04-08 | — | — | EP | disclosed |
| CN-110914355-A | Resin composition | 赫克塞尔合成有限公司 | 2020-03-24 | — | — | CN | disclosed |
| WO-2020040200-A1 | PREPREG | 東レ株式会社 | 2020-02-27 | — | — | WO | disclosed |
| WO-2019011982-A1 | RESIN COMPOSITION | HEXCEL COMPOSITES LIMITED (GB) | 2019-01-17 | — | — | WO | disclosed |
| EP-0283134-B1 | EPOXY ADHESIVE FILM FOR ELECTRONIC APPLICATIONS | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1992-07-08 | — | — | EP | disclosed |
| WO-1991018957-A1 | REWORKABLE ADHESIVE FOR ELECTRONIC APPLICATIONS | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1991-12-12 | — | — | WO | disclosed |
| EP-0203828-B1 | EPOXY RESIN CURING AGENT, CURING PROCESS AND COMPOSITION CONTAINING IT | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1990-03-28 | — | — | EP | disclosed |
| EP-0283134-A2 | Epoxy adhesive film for electronic applications | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1988-09-21 | — | — | EP | disclosed |
| US-4769399-A | Epoxy adhesive film for electronic applications | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1988-09-06 | — | — | US | disclosed |
| US-4684678-A | POLYEPOXIDES OF HIGH GLASS TRANSITION TEMPERATURE AND DUCTILITY | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1987-08-04 | — | — | US | disclosed |
| EP-0203828-A1 | Epoxy resin curing agent, curing process and composition containing it | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1986-12-03 | — | — | EP | disclosed |