SCHEMBL7051590

SCHEMBL7051590

CCNc1ccc(C2(c3ccc(N)cc3)c3ccccc3-c3ccccc32)cc1

nearest known ligand 0.67

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 3/20 0.67
MEN1 O00255 2/20 0.67
KMT2A Q03164 2/20 0.67
LMNA P02545 2/20 0.67
KDM4E B2RXH2 1/20 0.67
OPRK1 P41145 1/20 0.67
SMN1; SMN2 Q16637 1/20 0.67
POLB P06746 2/20 0.42
ESR1 P03372 1/20 0.39
ESR2 Q92731 1/20 0.39
MAOA P21397 1/20 0.36
MAOB P27338 1/20 0.36
GAA P10253 1/20 0.35
RAB9A P51151 1/20 0.35
ADRA2A P08913 2/20 0.35
ADRA2B P18089 1/20 0.35
ADRA2C P18825 1/20 0.35
L3MBTL1 Q9Y468 2/20 0.34
ALDH1A1 P00352 1/20 0.34
CYP1A2 P05177 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7052319 0.92 LMNA (0.52) MAPTMEN1KMT2ALMNAKDM4E
SCHEMBL7048388 0.86 LMNA (0.46) MAPTMEN1KMT2ALMNAKDM4E
SCHEMBL29579333 0.86 LMNA (0.46) MAPTMEN1KMT2ALMNAKDM4E
SCHEMBL7050425 0.83 MAPT (0.73) MAPTMEN1KMT2ALMNAKDM4E
SCHEMBL29128950 0.82 MAPT (0.79) MAPTMEN1KMT2ALMNAKDM4E
SCHEMBL105428 0.82 MAPT (1.00) MAPTMEN1KMT2ALMNAKDM4E
SCHEMBL29392989 0.82 MAPT (1.00) MAPTMEN1KMT2ALMNAKDM4E
SCHEMBL29426418 0.82 MAPT (1.00) MAPTMEN1KMT2ALMNAKDM4E
SCHEMBL29579600 0.80 LMNA (0.41) MAPTMEN1KMT2ALMNAKDM4E
SCHEMBL7050458 0.80 LMNA (0.41) MAPTMEN1KMT2ALMNAKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2900726-B1 RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN HEXCEL COMPOSITES LTD (GB) 2020-04-08 EP claimed
EP-2900726-A2 RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN Hexcel Composites Limited (GB) 2015-08-05 EP claimed
US-20150210847-A1 RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN HEXCEL COMPOSITES LIMITED (GB) 2015-07-30 US claimed
EP-0203828-B1 EPOXY RESIN CURING AGENT, CURING PROCESS AND COMPOSITION CONTAINING IT MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1990-03-28 EP claimed
US-4684678-A POLYEPOXIDES OF HIGH GLASS TRANSITION TEMPERATURE AND DUCTILITY MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1987-08-04 US claimed
EP-0203828-A1 Epoxy resin curing agent, curing process and composition containing it MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1986-12-03 EP claimed
US-20210292545-A1 PREPREG TORAY INDUSTRIES, INC. (JP) 2021-09-23 US disclosed
EP-3842481-A1 PREPREG Toray Industries, Inc. (JP) 2021-06-30 EP disclosed
CN-112543783-A Prepreg 东丽株式会社 2021-03-23 CN disclosed
EP-3652244-A1 RESIN COMPOSITION Hexcel Composites Limited (GB) 2020-05-20 EP disclosed
EP-2900726-B1 RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN HEXCEL COMPOSITES LTD (GB) 2020-04-08 EP disclosed
CN-110914355-A Resin composition 赫克塞尔合成有限公司 2020-03-24 CN disclosed
WO-2020040200-A1 PREPREG 東レ株式会社 2020-02-27 WO disclosed
US-5728755-A EXHIBIT TACK AND GOOD SHELF LIFE, LITTLE RESIN MIGRATION AND GLASS TRANSITION TEMPERATURE SIMILAR TO THOSE CURED NEAT MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1998-03-17 US disclosed
WO-1997011112-A1 EPOXY RESIN COMPOSITIONS, PREPREGS, CURED COMPOSITES, AND METHODS OF MAKING THE SAME MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1997-03-27 WO disclosed
US-5432010-A Binder resin for resin transfer molding preforms, preforms made therewith, and a method for preparing such preforms MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1995-07-11 US disclosed
US-5369192-A Aromatic epoxide with bis(aminophenyl)fluorene compound curing agent MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1994-11-29 US disclosed
EP-0203828-B1 EPOXY RESIN CURING AGENT, CURING PROCESS AND COMPOSITION CONTAINING IT MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1990-03-28 EP disclosed
US-4684678-A POLYEPOXIDES OF HIGH GLASS TRANSITION TEMPERATURE AND DUCTILITY MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1987-08-04 US disclosed
EP-0203828-A1 Epoxy resin curing agent, curing process and composition containing it MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1986-12-03 EP disclosed