Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ADRB2 | P07550 | 1/20 | 0.38 |
| ▸ | ADRB1 | P08588 | 1/20 | 0.38 |
| ▸ | ADRB3 | P13945 | 1/20 | 0.38 |
| ▸ | TSHR | P16473 | 2/20 | 0.33 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.32 |
| ▸ | CA1 | P00915 | 1/20 | 0.31 |
| ▸ | CA2 | P00918 | 1/20 | 0.31 |
| ▸ | LMNA | P02545 | 1/20 | 0.30 |
| ▸ | ATM | Q13315 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL706280 | 0.83 | HSD17B10 (0.35) | — | |
| SCHEMBL11250053 | 0.80 | ADRB2 (0.35) | ADRB2ADRB1ADRB3TSHRCYP3A4 | |
| SCHEMBL2772303 | 0.80 | ADRB2 (0.35) | ADRB2ADRB1ADRB3TSHRCYP3A4 | |
| SCHEMBL27624796 | 0.79 | ADRB2 (0.38) | ADRB2ADRB1ADRB3TSHRCYP3A4 | |
| SCHEMBL5833766 | 0.78 | ADRB2 (0.33) | ADRB2ADRB1ADRB3TSHRCYP3A4 | |
| SCHEMBL5833537 | 0.77 | ADRB2 (0.36) | ADRB2ADRB1ADRB3TSHRCYP3A4 | |
| SCHEMBL5834028 | 0.77 | ADRB2 (0.32) | ADRB2ADRB1ADRB3 | |
| SCHEMBL8666602 | 0.77 | ADRB2 (0.32) | ADRB2ADRB1ADRB3 | |
| SCHEMBL2247508 | 0.75 | TSHR (0.35) | ADRB2ADRB1ADRB3TSHRALDH1A1 | |
| SCHEMBL29240648 | 0.73 | ADRB2 (0.30) | ADRB2ADRB1ADRB3 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-105622800-B | A kind of catalytic component and its catalyst system for olefinic polyreaction | 中国石油化工股份有限公司 | 2017-12-19 | — | — | CN | disclosed |
| CN-103185905-B | Antireflection film and optical element | TOTATSU CORP. (JP) | 2015-12-23 | — | — | CN | disclosed |
| EP-2128897-B1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LTD (JP) | 2015-05-06 | — | — | EP | disclosed |
| EP-2540759-B1 | Thermosetting resin composition and cured product of the same | DAINIPPON INK & CHEMICALS (JP) | 2014-08-06 | — | — | EP | disclosed |
| EP-2436734-B1 | THERMOSETTING RESIN COMPOSITE AND CURED PRODUCT THEREOF | DAINIPPON INK & CHEMICALS (JP) | 2014-07-23 | — | — | EP | disclosed |
| US-8716209-B2 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2014-05-06 | — | — | US | disclosed |
| CN-102449069-B | Thermosetting resin composite and cured product thereof | DAINIPPON INK & CHEMICALS | 2014-02-12 | — | — | CN | disclosed |
| EP-2671920-A1 | THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, AND INTERLAYER ADHESIVE FILM FOR PRINTED WIRING BOARD | DIC Corporation (JP) | 2013-12-11 | — | — | EP | disclosed |
| US-20130309489-A1 | THERMOSETTING RESIN COMPOSITION, CURED PRODUCT OF THE SAME, AND INTERLAMINAR ADHESIVE FILM USED FOR PRINTED WIRING BOARD | DIC CORPORATION (JP) | 2013-11-21 | — | — | US | disclosed |
| CN-103370371-A | Thermosetting resin composition, cured product thereof, and interlayer adhesive film for printed wiring board | DAINIPPON INK & CHEMICALS | 2013-10-23 | — | — | CN | disclosed |
| US-20100137626-A1 | ORGANIC SILANE COMPOUND FOR FORMING SI-CONTAINING FILM BY PLASMA CVD AND METHOD FOR FORMING SI-CONTAINING FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-06-03 | — | — | US | disclosed |
| US-7659357-B2 | Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed | FUJITSU LIMITED (JP) | 2010-02-09 | — | — | US | disclosed |
| US-20100007031-A1 | AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| EP-2128897-A1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Fujitsu Limited (JP) | 2009-12-02 | — | — | EP | disclosed |
| US-20070026689-A1 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2007-02-01 | — | — | US | disclosed |
| US-7005532-B2 | Process of producing alkoxysilanes | TOAGOSEI CO., LTD. (JP) | 2006-02-28 | — | — | US | disclosed |
| US-20060024980-A1 | Silica-based film, method of forming the same, composition for forming insulating film for semiconductor device, interconnect structure, and semiconductor device | JSR CORPORATION (JP) | 2006-02-02 | — | — | US | disclosed |
| US-20050020845-A1 | Process of producing alkoxysilanes | TOAGOSEI CO., LTD. (JP) | 2005-01-27 | — | — | US | disclosed |
| EP-1428828-A1 | PROCESS FOR PREPARATION OF ALKOXYSILANES | TOAGOSEI CO., LTD. (JP) | 2004-06-16 | — | — | EP | disclosed |
| US-4541838-A | Fuel compositions | ETHYL CORPORATION (US) | 1985-09-17 | — | — | US | disclosed |