SCHEMBL7059289

SCHEMBL7059289

CC(=Cc1ccccc1)c1cccc(O)c1O

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.41
TSHR P16473 1/20 0.41
AKR1C3 P42330 1/20 0.41
BRD4 O60885 1/20 0.41
CREBBP Q92793 1/20 0.41
BCHE P06276 1/20 0.40
MAPT P10636 1/20 0.40
CYP2C19 P33261 1/20 0.40
CA1 P00915 2/20 0.39
CA2 P00918 2/20 0.39
HPGD P15428 2/20 0.39
CA6 P23280 2/20 0.39
ADAMTS4 O75173 1/20 0.39
EGFR P00533 1/20 0.39
LMNA P02545 1/20 0.39
FYN P06241 1/20 0.39
MMP2 P08253 1/20 0.39
MMP9 P14780 1/20 0.39
ALOX15 P16050 1/20 0.39
MMP8 P22894 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11203024 0.86 MAPT (0.47) ALDH1A1TSHRAKR1C3BRD4CREBBP
SCHEMBL10973737 0.86 MAPT (0.47) ALDH1A1TSHRAKR1C3BRD4CREBBP
SCHEMBL30495367 0.86 MAPT (0.47) ALDH1A1TSHRAKR1C3BRD4CREBBP
SCHEMBL7715071 0.82 TSHR (0.52) ALDH1A1TSHRAKR1C3BRD4CREBBP
SCHEMBL7756202 0.80 ALDH1A1 (0.47) ALDH1A1TSHRAKR1C3CA1CA2
SCHEMBL9393740 0.80 ALDH1A1 (0.47) ALDH1A1TSHRAKR1C3CA1CA2
SCHEMBL9114636 0.79 ESR1 (0.47) BCHEMAPTCYP2C19NR1H4MEN1
SCHEMBL6442923 0.78 ALDH1A1 (0.41) ALDH1A1TSHRAKR1C3BRD4CREBBP
SCHEMBL6063974 0.76 MEN1 (0.43) ALDH1A1AKR1C3BCHEMAPTCYP2C19
SCHEMBL9253307 0.76 ESR1 (0.57) ALDH1A1MAPTHPGDLMNAALOX15

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 62 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106715535-B Silane-functionalized compounds and compositions thereof 瀚森公司 2020-01-17 CN claimed
CN-102686632-A Process for manufacturing a product derived from epichlorohydrin SOLVAY 2012-09-19 CN claimed
CN-101061577-A Flip chip system and preparation method thereof INTEL CORP (US) 2007-10-24 CN claimed
EP-0927148-A3 PREPARATION OF 4,4'-DIHYDROXY-ALPHA-ALKYLSTILBENE WITH REDUCED DIMER FORMATION MICHIGAN MOLECULAR INSTITUTE (US) 2002-11-20 EP claimed
EP-0927148-B1 PREPARATION OF 4,4'-DIHYDROXY-ALPHA-ALKYLSTILBENE WITH REDUCED DIMER FORMATION MICHIGAN MOLECULAR INST (US) 2001-03-07 EP claimed
EP-0927148-A2 PREPARATION OF 4,4'-DIHYDROXY-ALPHA-ALKYLSTILBENE WITH REDUCED DIMER FORMATION THE DOW CHEMICAL COMPANY (US) 1999-07-07 EP claimed
US-5840376-A A BULK MOLDINGS COMPRISING A CURED THERMOSET POLYEPOXIDES WITH ENHANCING TENSILE MODULUS THE REGENTS OF THE UNIVERSITY OF CALIFORNIA (US) 1998-11-24 US claimed
WO-1998046696-A1 HIGH MAGNETIC FIELD PROCESSING OF LIQUID CRYSTALLINE POLYMERS THE REGENTS OF THE UNIVERSITY OF CALIFORNIA (US) 1998-10-22 WO claimed
EP-0708796-B1 PROCESS FOR PREPARING COMPOSITES BASED ON ORIENTED MESOGENIC THERMOSET RESINS DOW CHEMICAL CO (US) 1998-05-27 EP claimed
WO-1998011042-A2 PREPARATION OF 4,4'-DIHYDROXY-ALPHA-ALKYLSTILBENE WITH REDUCED DIMER FORMATION THE DOW CHEMICAL COMPANY (US) 1998-03-19 WO claimed
US-5723692-A Preparation of 4,4'-dihydroxy-'alkylstiblbene with reduced dimer formation THE DOW CHEMICAL COMPANY (US) 1998-03-03 US claimed
US-5578740-A Process for preparation of epoxy compounds essentially free of organic halides THE DOW CHEMICAL COMPANY (US) 1996-11-26 US claimed
EP-0708796-A1 PROCESS FOR PREPARING COMPOSITES BASED ON ORIENTED MESOGENIC THERMOSET RESINS THE DOW CHEMICAL COMPANY (US) 1996-05-01 EP claimed
EP-0670855-A1 NITRO OR NITROSO GROUP TERMINATED MESOGENIC EPOXY RESIN ADDUCTS THE DOW CHEMICAL COMPANY (US) 1995-09-13 EP claimed
WO-1995002631-A1 PROCESS FOR PREPARING COMPOSITES BASED ON ORIENTED MESOGENIC THERMOSET RESINS THE DOW CHEMICAL COMPANY (US) 1995-01-26 WO claimed
WO-1994012555-A1 NITRO OR NITROSO GROUP TERMINATED MESOGENIC EPOXY RESIN ADDUCTS THE DOW CHEMICAL COMPANY (US) 1994-06-09 WO claimed
US-5248360-A Saturating fiber substrates with curable thermosetting resin, arranging substrates into desired configuration, curing with application of heat and pressure THE DOW CHEMICAL COMPANY (US) 1993-09-28 US claimed
WO-2017066929-A1 MODIFIED EPOXY RESIN AND CURABLE RESIN COMPOSITION COMPRISING SAME DOW GLOBAL TECHNOLOGIES LLC (US) 2017-04-27 WO disclosed
EP-0352718-A2 Partially fluorinated compounds and polymers E.I. DU PONT DE NEMOURS AND COMPANY (US) 1990-01-31 EP disclosed
US-4412059-A High modulus cholesteric mesophase polymers DUKE UNIVERSITY (US) 1983-10-25 US disclosed