SCHEMBL707751

SCHEMBL707751

CC[Si](CCCC[Si](CC)(OC(C)=O)OC(C)=O)(OC(C)=O)OC(C)=O

nearest known ligand 0.35

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.35
LMNA P02545 1/20 0.35
HSD17B10 Q99714 1/20 0.35
KDM4E B2RXH2 1/20 0.32
MAPK1 P28482 1/20 0.32
HIF1A Q16665 1/20 0.32
PAOX Q6QHF9 3/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL701705 0.95 ALDH1A1 (0.35) ALDH1A1LMNAHSD17B10KDM4EMAPK1
SCHEMBL705906 0.90 ALDH1A1 (0.38) ALDH1A1LMNAHSD17B10
SCHEMBL27730767 0.89 ALDH1A1 (0.31) ALDH1A1LMNAHSD17B10
SCHEMBL15643185 0.89 PAOX (0.41) ALDH1A1LMNAHSD17B10PAOX
SCHEMBL27658713 0.86 ALDH1A1 (0.35) ALDH1A1LMNAHSD17B10PAOX
SCHEMBL133195 0.85 ALDH1A1 (0.41) ALDH1A1LMNAHSD17B10
SCHEMBL706745 0.84 ALDH1A1 (0.38) ALDH1A1LMNAHSD17B10KDM4EMAPK1
SCHEMBL704468 0.84 ALDH1A1 (0.43) ALDH1A1LMNAHSD17B10PAOX
SCHEMBL27722851 0.84 ALDH1A1 (0.33) ALDH1A1LMNAHSD17B10KDM4EMAPK1
SCHEMBL6699196 0.82 PAOX (0.33) ALDH1A1LMNAHSD17B10PAOX

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8124239-B2 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2012-02-28 US disclosed
US-20100155121-A1 SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME FUJITSU LIMITED (JP) 2010-06-24 US disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed