Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL14063010 | 1.00 | MGLL (0.38) | MGLLHRH3 | |
| SCHEMBL131333 | 0.92 | TDP1 (0.38) | MGLL | |
| SCHEMBL7765145 | 0.91 | MGLL (0.48) | MGLL | |
| SCHEMBL14062638 | 0.89 | S1PR1 (0.39) | MGLL | |
| SCHEMBL14062723 | 0.89 | MAOB (0.42) | — | |
| SCHEMBL14062562 | 0.89 | MAOB (0.42) | — | |
| SCHEMBL14063096 | 0.88 | MGLL (0.33) | MGLL | |
| SCHEMBL9843341 | 0.85 | MEN1 (0.39) | MGLL | |
| SCHEMBL13990310 | 0.85 | MGLL (0.42) | MGLL | |
| SCHEMBL14063027 | 0.84 | TDP1 (0.42) | MGLL |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 62 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| JP-2102217-A | — | — | None | — | — | JP | disclosed |
| EP-4206292-B1 | MULTILAYER ELECTRONIC COMPONENT | SAMSUNG ELECTRO MECH (KR) | 2026-03-11 | — | — | EP | disclosed |
| EP-4703449-A1 | THERMALLY CONDUCTIVE COMPOSITION, TWO-COMPONENT CURABLE THERMALLY CONDUCTIVE MATERIAL, SUPPLY FORM OF TWO-COMPONENT CURABLE THERMALLY CONDUCTIVE MATERIAL, AND BATTERY MODULE | Sekisui Chemical Co., Ltd. (JP) | 2026-03-04 | — | — | EP | disclosed |
| EP-4660243-A1 | CURABLE COMPOSITION AND THERMALLY CONDUCTIVE MEMBER | Sekisui Chemical Co., Ltd. (JP) | 2025-12-10 | — | — | EP | disclosed |
| EP-4660241-A1 | THERMALLY CONDUCTIVE RESIN COMPOSITION AND THERMALLY CONDUCTIVE MEMBER | Sekisui Chemical Co., Ltd. (JP) | 2025-12-10 | — | — | EP | disclosed |
| US-12198858-B2 | Multilayer electronic component | SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) | 2025-01-14 | — | — | US | disclosed |
| CN-114830268-B | Slurry for forming varistor, cured product thereof, and varistor | 纳美仕有限公司 | 2024-11-26 | — | — | CN | disclosed |
| WO-2024162414-A1 | THERMALLY CONDUCTIVE RESIN COMPOSITION AND THERMALLY CONDUCTIVE MEMBER | 積水化学工業株式会社 | 2024-08-08 | — | — | WO | disclosed |
| US-11935673-B2 | Varistor forming paste, cured product thereof, and varistor | NAMICS CORPORATION (JP) | 2024-03-19 | — | — | US | disclosed |
| US-11866635-B2 | Thermosetting material and cured product | SEKISUI CHEMICAL CO., LTD. (JP) | 2024-01-09 | — | — | US | disclosed |
| US-7956136-B2 | Resin composition for semiconductor encapsulation and semiconductor device | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2011-06-07 | — | — | US | disclosed |
| EP-2316897-A1 | INSULATING SHEET AND LAMINATED STRUCTURE | Sekisui Chemical Co., Ltd. (JP) | 2011-05-04 | — | — | EP | disclosed |
| EP-2312593-A1 | INSULATING SHEET AND MULTILAYER STRUCTURE | Sekisui Chemical Co., Ltd. (JP) | 2011-04-20 | — | — | EP | disclosed |
| US-20110021665-A1 | RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE | KURODA HIROFUMI | 2011-01-27 | — | — | US | disclosed |
| US-20100297453-A1 | INSULATING SHEET AND MULTILAYER STRUCTURE | SEKISUI CHEMICAL CO., LTD. (JP) | 2010-11-25 | — | — | US | disclosed |
| US-20090096114-A1 | Epoxy Resin Composition and Semiconductor Device | KOTANI TAKAHIRO | 2009-04-16 | — | — | US | disclosed |
| US-7425354-B2 | Photopolymerizable liquid crystal composition, its polymer or polymer composition, and optical compensation element | CHISSO CORPORATION (JP) | 2008-09-16 | — | — | US | disclosed |
| US-20080097010-A1 | resin composition for semiconductor encapsulation realizing excellent soldering resistance and flame resistance and having excellent flowability and curing properties, and a semiconductor device. The invention has solved the object by a resin composition for semiconductor encapsulation | SUMITOMO BAKELITE COMPANY, LTD (JP) | 2008-04-24 | — | — | US | disclosed |
| US-20060157872-A1 | Epoxy resin composition and semiconductor device | KOTANI TAKAHIRO | 2006-07-20 | — | — | US | disclosed |
| JP-H02102217-A | EPOXY RESIN COMPOSITION | TORAY IND INC | 1990-04-13 | — | — | JP | disclosed |