Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8613885 | 0.91 | CYP2D6 (0.38) | CYP2D6CYP2C19 | |
| SCHEMBL7696963 | 0.90 | CYP2D6 (0.33) | CYP2D6CYP2C19 | |
| SCHEMBL7872949 | 0.86 | KDM4E (0.37) | — | |
| SCHEMBL9317520 | 0.86 | CYP2D6 (0.35) | CYP2D6CYP2C19 | |
| SCHEMBL32689218 | 0.85 | CYP2D6 (0.41) | CYP2D6CYP2C19 | |
| SCHEMBL5837266 | 0.85 | CYP2D6 (0.34) | CYP2D6CYP2C19 | |
| SCHEMBL7872748 | 0.85 | — | — | |
| SCHEMBL7638350 | 0.82 | CYP2D6 (0.39) | CYP2D6CYP2C19 | |
| SCHEMBL5837166 | 0.82 | CYP2D6 (0.33) | CYP2D6CYP2C19 | |
| SCHEMBL32688908 | 0.81 | CYP2D6 (0.38) | CYP2D6CYP2C19 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 40 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6866984-B2 | ArF photoresist copolymers | HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. (KR) | 2005-03-15 | — | — | US | claimed |
| US-20040131968-A1 | Containing 2-hydroxyethyl-5-norbornene-2-carboxylate units; etch and heat resistance; substrate adhesiveness; tetramethylammonium hydroxide solution development; polymer and monomer synthesis | HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. (KR) | 2004-07-08 | — | — | US | claimed |
| US-6608158-B2 | High transparency at 193 nm wavelength, provides increased etching resistance; formed without 5-norbonen-2-carboxylate monomers which do not have offensive odors of the free acid | HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. (KR) | 2003-08-19 | — | — | US | claimed |
| US-20020068803-A1 | Copolymer resin, preparation thereof, and photoresist using the same | HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. (KR) | 2002-06-06 | — | — | US | claimed |
| US-6368770-B1 | CARBOXY NORBORNENE COMPOUND | HYUNDAI ELECTRONICS INDUSTRIES CO. LTD. (KR) | 2002-04-09 | — | — | US | claimed |
| US-6348296-B1 | COPOLYMER CONSISTING OF 2,3-DI-TERT-BUTYL-5-NORBORNENE-2,3-DICARBOXYLATE, ANOTHER NORBORNENE MONOMER, AND MALEIC ANHYDRIDE | HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. (KR) | 2002-02-19 | — | — | US | claimed |
| US-6165672-A | Maleimide or alicyclic olefin-based monomers, copolymer resin of these monomers and photoresist using the resin | HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. (KR) | 2000-12-26 | — | — | US | claimed |
| JP-10218947-A | — | — | None | — | — | JP | disclosed |
| US-20230416591-A1 | DUAL CURE SYSTEM FOR THE CHEMICAL FASTENING OF AN ANCHORING MEANS IN A BOREHOLE | HILTI AKTIENGESELLSCHAFT (LI) | 2023-12-28 | — | — | US | disclosed |
| EP-4244271-A1 | DUAL CURE SYSTEM FOR CHEMICALLY FASTENING ANCHORING MEANS IN A DRILL HOLE | Hilti Aktiengesellschaft (LI) | 2023-09-20 | — | — | EP | disclosed |
| WO-2022101025-A1 | DUAL CURE SYSTEM FOR CHEMICALLY FASTENING ANCHORING MEANS IN A DRILL HOLE | HILTI AKTIENGESELLSCHAFT (LI) | 2022-05-19 | — | — | WO | disclosed |
| EP-3995524-A1 | DUAL CURE SYSTEM FOR THE CHEMICAL FIXATION OF AN ANCHORING AGENT IN A DRILLED HOLE | Hilti Aktiengesellschaft (LI) | 2022-05-11 | — | — | EP | disclosed |
| EP-3995525-A1 | MONOMER WITH TWO POLYMERISABLE GROUPS (FOR ROMP AND FOR RADICAL POLYMERISATION) AND ITS USE | Hilti Aktiengesellschaft (LI) | 2022-05-11 | — | — | EP | disclosed |
| US-6348296-B1 | COPOLYMER CONSISTING OF 2,3-DI-TERT-BUTYL-5-NORBORNENE-2,3-DICARBOXYLATE, ANOTHER NORBORNENE MONOMER, AND MALEIC ANHYDRIDE | HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. (KR) | 2002-02-19 | — | — | US | disclosed |
| US-20010031420-A1 | Partially crosslinked polymer for bilayer photoresist | HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. (KR) | 2001-10-18 | — | — | US | disclosed |
| US-6258508-B1 | PHOTORESISTS | KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) | 2001-07-10 | — | — | US | disclosed |
| EP-1078945-A2 | Polymer for use in a photoresist composition | SAMSUNG ELECTRONICS CO. LTD. (KR) | 2001-02-28 | — | — | EP | disclosed |
| US-6165672-A | Maleimide or alicyclic olefin-based monomers, copolymer resin of these monomers and photoresist using the resin | HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. (KR) | 2000-12-26 | — | — | US | disclosed |
| US-6103450-A | Photosensitive polymer, dissolution inhibitor and chemically amplified photoresist composition containing the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2000-08-15 | — | — | US | disclosed |
| JP-H10218947-A | PHOTOSENSITIVE FILM COPOLYMER, ITS PRODUCTION, PHOTOSENSITIVE FILM, ITS PRODUCTION, METHOD FOR SYNTHESIZING MONOMER, PRODUCTION OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE | HYUNDAI ELECTRON IND CO LTD | 1998-08-18 | — | — | JP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20230416591-A1 | DUAL CURE SYSTEM FOR THE CHEMICAL FASTENING OF AN ANCHORING MEANS IN A BOREHOLE | DUOX2, COASY, OSBP | CYP2D6 1207/4885CYP2C19 585/4885 |
| US-20010031420-A1 | Partially crosslinked polymer for bilayer photoresist | LCP1, ARPC4, PARP14 | CYP2D6 3468/4885CYP2C19 2509/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.