Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 7/20 | 0.68 |
| ▸ | KDM4E | B2RXH2 | 7/20 | 0.68 |
| ▸ | HPGD | P15428 | 1/20 | 0.68 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.68 |
| ▸ | CFTR | P13569 | 1/20 | 0.47 |
| ▸ | TDP1 | Q9NUW8 | 6/20 | 0.47 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.47 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.47 |
| ▸ | PPM1B | O75688 | 1/20 | 0.46 |
| ▸ | IDO1 | P14902 | 1/20 | 0.44 |
| ▸ | KMT2A | Q03164 | 6/20 | 0.42 |
| ▸ | GFER | P55789 | 1/20 | 0.42 |
| ▸ | RXFP1 | Q9HBX9 | 1/20 | 0.42 |
| ▸ | CHEK1 | O14757 | 1/20 | 0.41 |
| ▸ | FYN | P06241 | 1/20 | 0.41 |
| ▸ | PDGFRB | P09619 | 1/20 | 0.41 |
| ▸ | PIM1 | P11309 | 1/20 | 0.41 |
| ▸ | FGFR1 | P11362 | 1/20 | 0.41 |
| ▸ | FLT1 | P17948 | 1/20 | 0.41 |
| ▸ | GRK5 | P34947 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29671061 | 1.00 | ALDH1A1 (0.68) | ALDH1A1KDM4EHPGDHSD17B10CFTR | |
| SCHEMBL105277 | 0.89 | ALDH1A1 (0.68) | ALDH1A1KDM4EHPGDHSD17B10CFTR | |
| SCHEMBL31273443 | 0.89 | ALDH1A1 (0.68) | ALDH1A1KDM4EHPGDHSD17B10CFTR | |
| SCHEMBL29671067 | 0.85 | KDM4E (0.57) | ALDH1A1KDM4EHPGDHSD17B10TDP1 | |
| SCHEMBL343185 | 0.85 | KDM4E (0.57) | ALDH1A1KDM4EHPGDHSD17B10TDP1 | |
| SCHEMBL28006029 | 0.82 | ALDH1A1 (0.60) | ALDH1A1KDM4EHPGDHSD17B10CFTR | |
| SCHEMBL20552355 | 0.82 | ALDH1A1 (0.60) | ALDH1A1KDM4EHPGDHSD17B10CFTR | |
| SCHEMBL215701 | 0.82 | ALDH1A1 (0.60) | ALDH1A1KDM4EHPGDHSD17B10CFTR | |
| SCHEMBL105948 | 0.82 | TDP1 (0.56) | ALDH1A1KDM4EHPGDHSD17B10TDP1 | |
| SCHEMBL29441322 | 0.82 | TDP1 (0.56) | ALDH1A1KDM4EHPGDHSD17B10TDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 95 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114174422-B | Resin composition and use thereof | DIC株式会社 | 2024-04-30 | — | — | CN | disclosed |
| CN-116830039-A | Photosensitive resin composition, photosensitive resin sheet, cured product, hollow structure, electronic component, and elastic wave filter | 东丽株式会社 | 2023-09-29 | — | — | CN | disclosed |
| WO-2023153390-A1 | PHOTOSENSITIVE RESIN SHEET, CURED FILM, AND MULTILAYER WIRING SUBSTRATE | 東レ株式会社 | 2023-08-17 | — | — | WO | disclosed |
| WO-2022201909-A1 | RESIN COMPOSITION, HOT-MELT MOLDED ARTICLE, AND MOLDING METHOD | コニカミノルタ株式会社 | 2022-09-29 | — | — | WO | disclosed |
| WO-2022181764-A1 | MULTILAYER STRUCTURE AND FLEXIBLE PRINTED WIRING BOARD | 太陽インキ製造株式会社 | 2022-09-01 | — | — | WO | disclosed |
| WO-2022163610-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN SHEET, CURED PRODUCT, HOLLOW STRUCTURE, ELECTRONIC COMPONENT, AND ELASTIC WAVE FILTER | 東レ株式会社 | 2022-08-04 | — | — | WO | disclosed |
| US-20220155684-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN SHEET, METHOD FOR PRODUCING HOLLOW STRUCTURE, AND ELECTRONIC COMPONENT | TORAY INDUSTRIES, INC. (JP) | 2022-05-19 | — | — | US | disclosed |
| CN-114174422-A | Resin composition, semiconductor sealing material using same, and dipping base material, circuit board, build-up film, prepreg, carbon fiber composite material, solder resist, dry film, and printed wiring board | DIC株式会社 | 2022-03-11 | — | — | CN | disclosed |
| EP-3933906-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN SHEET, METHOD FOR PRODUCING HOLLOW STRUCTURE, AND ELECTRONIC COMPONENT | Toray Industries, Inc. (JP) | 2022-01-05 | — | — | EP | disclosed |
| CN-113646882-A | Photosensitive resin composition, photosensitive resin sheet, method for producing hollow structure, and electronic component | 东丽株式会社 | 2021-11-12 | — | — | CN | disclosed |
| US-20030082925-A1 | Comprises polyamideetherimide or polyether amide; for use as coating material, adhesive and stress releasing material; controlled elasticity; dielectrics; electronics | HITACHI CHEMICAL CO., LTD. (JP) | 2003-05-01 | — | — | US | disclosed |
| US-20030026998-A1 | Atomic oxygen-resistant film | UBE INDUSTRIES, LTD. (JP) | 2003-02-06 | — | — | US | disclosed |
| US-6468639-B2 | PLATING RESISTANT AND PROTECTIVE INSULATING FILM IS ACHIEVED WITH A COATING MATERIAL OF A SINGLE TYPE OF INSULATING MATERIAL | UBE INDUSTRIES, LTD. (JP) | 2002-10-22 | — | — | US | disclosed |
| US-6461738-B2 | HEAT AND SOLVENT RESISTANCE | UBE INDUSTRIES, INC. (JP) | 2002-10-08 | — | — | US | disclosed |
| US-20020076548-A1 | SINGLE-APPLICATION POLYIMIDOSILOXANE-BASED COATING MATERIAL AND CURED FILM | UBE INDUSTRIES, LTD. (JP) | 2002-06-20 | — | — | US | disclosed |
| US-6372859-B1 | MAKING A PASTE BY MIXING A SOLUTION OF HEAT-RESISTANT RESIN A IN A SOLVENT, FINE PARTICLES OF RESIN B INSOLUBLE IN THE SOLVENT BUT SOLUBLE UPON HEATING; HEATING TO DISSOLVE; COOLING TO DEPOSIT OR DISPERSE THE PARTICLES; CURING | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2002-04-16 | — | — | US | disclosed |
| US-20020001763-A1 | Photosensitive resin compositions, insulating films, and processes for formation of the films | UBE INDUSTRIES, LTD. | 2002-01-03 | — | — | US | disclosed |
| US-20010056174-A1 | Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide | KANEKA CORPORATION (JP) | 2001-12-27 | — | — | US | disclosed |
| US-20010020081-A1 | Polyimide-based insulating film composition, insulating film and insulating film-forming method | UBE INDUSTRIES, LTD. (JP) | 2001-09-06 | — | — | US | disclosed |
| EP-0984051-A1 | HEAT-RESISTANT ADHESIVES AND SEMICONDUCTOR DEVICES PRODUCED THEREWITH | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2000-03-08 | — | — | EP | disclosed |