SCHEMBL343185

SCHEMBL343185

CC(C)(c1ccc(N)c(C(=O)O)c1)c1ccc(N)c(C(=O)O)c1

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 4/20 0.57
KMT2A Q03164 3/20 0.57
GFER P55789 1/20 0.57
RXFP1 Q9HBX9 1/20 0.57
TDP1 Q9NUW8 4/20 0.55
MCL1 Q07820 2/20 0.55
MEN1 O00255 2/20 0.55
USP2 O75604 1/20 0.55
POLB P06746 1/20 0.55
MAPT P10636 1/20 0.55
THRB P10828 1/20 0.55
PKM P14618 1/20 0.55
APEX1 P27695 1/20 0.55
RECQL P46063 1/20 0.55
BLM P54132 1/20 0.55
GLA P06280 1/20 0.53
KEAP1 Q14145 1/20 0.53
ALDH1A1 P00352 3/20 0.52
CDC25B P30305 2/20 0.52
CASP6 P55212 1/20 0.52

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29671067 1.00 KDM4E (0.57) KDM4EKMT2AGFERRXFP1TDP1
SCHEMBL5376427 0.93 KDM4E (0.50) KDM4EKMT2AGFERRXFP1TDP1
SCHEMBL1827375 0.89 KMT2A (0.57) KDM4EKMT2AGFERRXFP1TDP1
SCHEMBL31149852 0.86 KDM4E (0.70) KDM4EKMT2AGFERRXFP1TDP1
SCHEMBL1348760 0.86 KDM4E (0.70) KDM4EKMT2AGFERRXFP1TDP1
SCHEMBL711243 0.85 ALDH1A1 (0.68) KDM4EKMT2AGFERRXFP1TDP1
SCHEMBL29671061 0.85 ALDH1A1 (0.68) KDM4EKMT2AGFERRXFP1TDP1
SCHEMBL5441710 0.84 KDM4E (0.61) KDM4EKMT2AGFERRXFP1TDP1
SCHEMBL712638 0.82 BRAF (0.48) KDM4EKMT2AGFERRXFP1TDP1
SCHEMBL105948 0.82 TDP1 (0.56) KDM4EKMT2ATDP1MEN1USP2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 339 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2220034-B1 AROMATIC ALDIMINES AND POLYURETHANE COMPOSITIONS WHICH CONTAIN ALDIMINE SIKA TECHNOLOGY AG (CH) 2015-12-23 EP claimed
EP-2220034-A1 AROMATIC ALDIMINES AND POLYURETHANE COMPOSITIONS WHICH CONTAIN ALDIMINE Sika Technology AG (CH) 2010-08-25 EP claimed
WO-2009062985-A1 AROMATIC ALDIMINES AND POLYURETHANE COMPOSITIONS WHICH CONTAIN ALDIMINE SIKA TECHNOLOGY AG (CH) 2009-05-22 WO claimed
EP-4721971-A1 METHOD OF SEPARATING BONDED ARTICLES Henkel AG & Co. KGaA (DE) 2026-04-08 EP disclosed
EP-4721970-A1 BONDED STRUCTURE COMPRISING AN ELECTROCHEMICALLY DEBONDABLE ADHESIVE LAYER Henkel AG & Co. KGaA (DE) 2026-04-08 EP disclosed
EP-4717746-A1 ONE COMPONENT (1K) COMPOSITION BASED ON EPOXIDE COMPOUNDS Henkel AG & Co. KGaA (DE) 2026-04-01 EP disclosed
US-12590207-B2 Epoxy composition comprising a bio-based epoxy compound HENKEL AG & CO. KGAA (DE) 2026-03-31 US disclosed
US-20260088410-A1 ELECTRONICS ASSEMBLY HAVING ELECTROCHEMICALLY DEBONDABLE COMPONENTS HENKEL AG & CO KGAA (DE) 2026-03-26 US disclosed
EP-4714984-A1 DUAL CURE STRUCTURAL ADHESIVE COMPOSITION Henkel AG & Co. KGaA (DE) 2026-03-25 EP disclosed
US-20260078284-A1 DEBONDABLE ADHESIVE TAPE HENKEL AG & CO KGAA (DE) 2026-03-19 US disclosed
EP-4663713-A1 BONDED STRUCTURE COMPRISING AN THERMALLY DEBONDABLE ADHESIVE FILM Henkel AG & Co. KGaA (DE) 2025-12-17 EP disclosed
US-20030026998-A1 Atomic oxygen-resistant film UBE INDUSTRIES, LTD. (JP) 2003-02-06 US disclosed
US-6468639-B2 PLATING RESISTANT AND PROTECTIVE INSULATING FILM IS ACHIEVED WITH A COATING MATERIAL OF A SINGLE TYPE OF INSULATING MATERIAL UBE INDUSTRIES, LTD. (JP) 2002-10-22 US disclosed
US-6461738-B2 HEAT AND SOLVENT RESISTANCE UBE INDUSTRIES, INC. (JP) 2002-10-08 US disclosed
US-20020076548-A1 SINGLE-APPLICATION POLYIMIDOSILOXANE-BASED COATING MATERIAL AND CURED FILM UBE INDUSTRIES, LTD. (JP) 2002-06-20 US disclosed
US-6372859-B1 MAKING A PASTE BY MIXING A SOLUTION OF HEAT-RESISTANT RESIN A IN A SOLVENT, FINE PARTICLES OF RESIN B INSOLUBLE IN THE SOLVENT BUT SOLUBLE UPON HEATING; HEATING TO DISSOLVE; COOLING TO DEPOSIT OR DISPERSE THE PARTICLES; CURING HITACHI CHEMICAL COMPANY, LTD. (JP) 2002-04-16 US disclosed
US-20020001763-A1 Photosensitive resin compositions, insulating films, and processes for formation of the films UBE INDUSTRIES, LTD. 2002-01-03 US disclosed
US-20010056174-A1 Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide KANEKA CORPORATION (JP) 2001-12-27 US disclosed
US-20010020081-A1 Polyimide-based insulating film composition, insulating film and insulating film-forming method UBE INDUSTRIES, LTD. (JP) 2001-09-06 US disclosed
EP-0984051-A1 HEAT-RESISTANT ADHESIVES AND SEMICONDUCTOR DEVICES PRODUCED THEREWITH HITACHI CHEMICAL COMPANY, LTD. (JP) 2000-03-08 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260078284-A1 DEBONDABLE ADHESIVE TAPE CDH1, EPHX2, DSG1 KDM4E 293/4885KMT2A 1733/4885GFER 25/4885
US-12590207-B2 Epoxy composition comprising a bio-based epoxy compound ITGA6, O60361, ITGB6 KDM4E 2304/4885KMT2A 2283/4885GFER 730/4885
US-20260088410-A1 ELECTRONICS ASSEMBLY HAVING ELECTROCHEMICALLY DEBONDABLE COMPONENTS EPCAM, CDH1, ITGA4 KDM4E 212/4885KMT2A 2215/4885GFER 236/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.