SCHEMBL712300

SCHEMBL712300

Nc1cc(O)c(-c2cc(O)c(N)cc2O)cc1O

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALOX15 P16050 6/20 0.50
HSD17B10 Q99714 6/20 0.50
CYP3A4 P08684 2/20 0.50
ALDH1A1 P00352 9/20 0.46
ALOX12 P18054 4/20 0.46
HPGD P15428 3/20 0.46
MAPK1 P28482 2/20 0.46
SMN1; SMN2 Q16637 2/20 0.46
MAPT P10636 7/20 0.46
KDM4E B2RXH2 5/20 0.46
PKM P14618 3/20 0.46
HIF1A Q16665 2/20 0.46
CYP1A2 P05177 1/20 0.46
CYP2D6 P10635 1/20 0.46
G6PD P11413 1/20 0.46
CYP2C9 P11712 1/20 0.46
CYP2C19 P33261 1/20 0.46
CCR6 P51684 1/20 0.46
NPSR1 Q6W5P4 1/20 0.46
GAA P10253 8/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL107865 0.87 ALOX15 (0.53) ALOX15HSD17B10CYP3A4ALDH1A1ALOX12
SCHEMBL19100122 0.84 ALDH1A1 (0.46) ALOX15HSD17B10CYP3A4ALDH1A1ALOX12
SCHEMBL8853115 0.83 HSD17B10 (0.38) ALOX15HSD17B10CYP3A4ALDH1A1ALOX12
Hydrochloric Acid SCHEMBL10940130 0.83 ALDH1A1 (0.50) ALOX15HSD17B10CYP3A4ALDH1A1ALOX12
Bromide SCHEMBL11509608 0.83 ALDH1A1 (0.50) ALOX15HSD17B10CYP3A4ALDH1A1ALOX12
Hydrochloric Acid SCHEMBL2455855 0.83 ALDH1A1 (0.50) ALOX15HSD17B10CYP3A4ALDH1A1ALOX12
SCHEMBL26450307 0.82 HSD17B10 (0.65) ALOX15HSD17B10CYP3A4ALDH1A1ALOX12
SCHEMBL26450325 0.82 ALDH1A1 (0.59) ALOX15HSD17B10CYP3A4ALDH1A1ALOX12
SCHEMBL632486 0.80 ALDH1A1 (0.48) ALOX15HSD17B10CYP3A4ALDH1A1ALOX12
SCHEMBL2026680 0.80 PTK2 (0.57) ALOX15HSD17B10CYP3A4ALDH1A1ALOX12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 78 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10511025-B2 Electrode manufacturing method UBE INDUSTRIES, LTD. (JP) 2019-12-17 US disclosed
EP-2204484-B1 POLYIMIDE FIBER MASS, SOUND ABSORBING MATERIAL, HEAT INSULATION MATERIAL, FLAME-RETARDANT MAT, FILTER CLOTH, HEAT-RESISTANT CLOTHING, NONWOVEN FABRIC, HEAT INSULATION/SOUND ABSORBING MATERIAL FOR AIRCRAFT, AND HEAT-RESISTANT BAG FILTER KANEKA CORP (JP) 2019-05-15 EP disclosed
US-10292262-B2 Reinforcing-plate-integrated flexible printed circuit board KANEKA CORPORATION (JP) 2019-05-14 US disclosed
US-10045433-B2 Conductive-layer-integrated flexible printed circuit board KANEKA CORPORATION (JP) 2018-08-07 US disclosed
US-9957390-B2 Resin composition for pigment-containing insulating film, and use thereof KANEKA CORPORATION (JP) 2018-05-01 US disclosed
US-9835942-B2 Photosensitive resin composition and use thereof KANEKA CORPORATION (JP) 2017-12-05 US disclosed
US-20170290141-A1 CONDUCTIVE-LAYER-INTEGRATED FLEXIBLE PRINTED CIRCUIT BOARD KANEKA CORPORATION 2017-10-05 US disclosed
US-9723708-B2 Conductive-layer-integrated flexible printed circuit board KANEKA CORPORATION (JP) 2017-08-01 US disclosed
US-20170194645-A1 ELECTRODE MANUFACTURING METHOD UBE INDUSTRIES, LTD. (JP) 2017-07-06 US disclosed
US-9685654-B2 Method for producing electrode UBE INDUSTRIES, LTD. (JP) 2017-06-20 US disclosed
US-6605353-B2 Polyimide derived from a dianhydride and diamine having hydroxyl or carboxyl groups, which are modified with a diepoxide or unsaturated group-containing epoxide; curable; heat resistance, dielectric, film-forming KANEKA CORPORATION (JP) 2003-08-12 US disclosed
US-20030026998-A1 Atomic oxygen-resistant film UBE INDUSTRIES, LTD. (JP) 2003-02-06 US disclosed
US-6468639-B2 PLATING RESISTANT AND PROTECTIVE INSULATING FILM IS ACHIEVED WITH A COATING MATERIAL OF A SINGLE TYPE OF INSULATING MATERIAL UBE INDUSTRIES, LTD. (JP) 2002-10-22 US disclosed
US-6461738-B2 HEAT AND SOLVENT RESISTANCE UBE INDUSTRIES, INC. (JP) 2002-10-08 US disclosed
US-20020076548-A1 SINGLE-APPLICATION POLYIMIDOSILOXANE-BASED COATING MATERIAL AND CURED FILM UBE INDUSTRIES, LTD. (JP) 2002-06-20 US disclosed
US-20020001763-A1 Photosensitive resin compositions, insulating films, and processes for formation of the films UBE INDUSTRIES, LTD. 2002-01-03 US disclosed
US-20010056174-A1 Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide KANEKA CORPORATION (JP) 2001-12-27 US disclosed
US-20010020081-A1 Polyimide-based insulating film composition, insulating film and insulating film-forming method UBE INDUSTRIES, LTD. (JP) 2001-09-06 US disclosed
US-6117510-A SUPPORT FILMS WITH POLYIMIDOSILOXANE COPOLYMER COATINGS UBE INDUSTRIES, LTD. (JP) 2000-09-12 US disclosed
US-5643986-A STORAGE STABLE, PROTECTIVE FILMS UBE INDUSTRIES, LTD. (JP) 1997-07-01 US disclosed