SCHEMBL7124322

SCHEMBL7124322

CCCO[Si](OCCC)(OCCC)c1ccc(N)cc1

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 5/20 0.39
ALDH1A1 P00352 4/20 0.39
GAA P10253 4/20 0.39
MEN1 O00255 3/20 0.39
KMT2A Q03164 3/20 0.39
KDM4E B2RXH2 2/20 0.39
USP2 O75604 1/20 0.39
TP53 P04637 1/20 0.39
POLB P06746 1/20 0.39
CASP1 P29466 1/20 0.39
HTT P42858 1/20 0.39
CASP7 P55210 1/20 0.39
ATM Q13315 1/20 0.39
TDP1 Q9NUW8 5/20 0.39
TSHR P16473 3/20 0.39
CYP3A4 P08684 5/20 0.37
LMNA P02545 3/20 0.37
CYP1A2 P05177 3/20 0.37
CYP2C9 P11712 1/20 0.37
CYP2C19 P33261 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL430190 0.89 ALDH1A1 (0.31) ALDH1A1MEN1KMT2ALMNA
SCHEMBL21409752 0.88 CYP3A4 (0.46) MAPTALDH1A1GAAKMT2AKDM4E
SCHEMBL21409757 0.87 TSHR (0.40) MAPTALDH1A1GAAMEN1KMT2A
SCHEMBL483106 0.83 TDP1 (0.46) MAPTALDH1A1GAAMEN1KMT2A
SCHEMBL9804106 0.82 MAPT (0.38) MAPTALDH1A1GAAMEN1KMT2A
SCHEMBL8954017 0.82 MAPT (0.38) MAPTALDH1A1GAAMEN1KMT2A
SCHEMBL7851854 0.82 TDP1 (0.37) MAPTALDH1A1MEN1KMT2AKDM4E
SCHEMBL106488 0.81 ACHE (0.35) ALDH1A1MEN1KMT2APOLBTDP1
SCHEMBL28057609 0.80 CSNK2A1 (0.41)
SCHEMBL17529776 0.79 SMN1; SMN2 (0.34) MAPTALDH1A1MEN1KMT2AKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 55 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20210017420-A1 STRUCTURE BODY, SENSOR, AND METHOD FOR PRODUCING STRUCTURE BODY DENSO CORPORATION (JP) 2021-01-21 US claimed
WO-2019193943-A1 STRUCTURE BODY, SENSOR, AND STRUCTURE BODY PRODUCTION METHOD 株式会社デンソー 2019-10-10 WO claimed
EP-0330456-B1 Preparation of silicon-containing polyimide precursor and cured polyimides obtained therefrom CHISSO CORP (JP) 1994-09-07 EP claimed
EP-0216007-B1 PROCESS FOR PRODUCING ORGANIC SILICON-TERMINATED POLYIMIDE PRECURSOR AND POLYIMIDE HITACHI, LTD. (JP) 1991-03-13 EP claimed
US-4748228-A Process for producing organic silicon-terminated polyimide precursor and polyimide HITACHI. LTD. (JP) 1988-05-31 US claimed
EP-0216007-A2 Process for producing organic silicon-terminated polyimide precursor and polyimide HITACHI, LTD. (JP) 1987-04-01 EP claimed
US-11485877-B2 Structure body, sensor, and method for producing structure body DENSO CORPORATION (JP) 2022-11-01 US disclosed
US-20210017420-A1 STRUCTURE BODY, SENSOR, AND METHOD FOR PRODUCING STRUCTURE BODY DENSO CORPORATION (JP) 2021-01-21 US disclosed
US-20210017420-A1 STRUCTURE BODY, SENSOR, AND METHOD FOR PRODUCING STRUCTURE BODY DENSO CORPORATION (JP) 2021-01-21 US disclosed
CN-111886278-A Triazine ring-containing polymer, resin composition, cured film, and solid-state imaging element 东丽株式会社 2020-11-03 CN disclosed
WO-2019193943-A1 STRUCTURE BODY, SENSOR, AND STRUCTURE BODY PRODUCTION METHOD 株式会社デンソー 2019-10-10 WO disclosed
WO-2019188475-A1 TRIAZINE-RING-CONTAINING POLYMER, RESIN COMPOSITION, CURED FILM, AND SOLID-STATE IMAGING ELEMENT 東レ株式会社 2019-10-03 WO disclosed
US-6664021-B1 Acid generator and silicon-containing polyimide ester precursor comprising partially esterified silicon-containing polyamic ester; radiating with light CHISSO CORPORATION (JP) 2003-12-16 US disclosed
EP-0337698-A2 Photosensitive Polymer Chisso Corporation (JP) 1989-10-18 EP disclosed
EP-0330456-A1 Preparation of silicon-containing polyimide precursor and cured polyimides obtained therefrom CHISSO CORPORATION (JP) 1989-08-30 EP disclosed
US-4748228-A Process for producing organic silicon-terminated polyimide precursor and polyimide HITACHI. LTD. (JP) 1988-05-31 US disclosed
US-4686147-A SILICONE CONTAINING POLYIMIDES INSULATION LAYER HITACHI, LTD. (JP) 1987-08-11 US disclosed
EP-0216007-A2 Process for producing organic silicon-terminated polyimide precursor and polyimide HITACHI, LTD. (JP) 1987-04-01 EP disclosed
US-3950308-A POLYAMIDES, POLYIMIDES, POLYAMIDE-IMIDES CIBA-GEIGY CORPORATION (US) 1976-04-13 US disclosed
US-3948835-A POLYAMIDE, POLYAMIDE-ACID OR POLYAMIDE-AMIDE-ACIDS CIBA-GEIGY CORPORATION (US) 1976-04-06 US disclosed