SCHEMBL7130298

SCHEMBL7130298

O=C1NC(=O)c2c1cccc2C(c1cccc2c1C(=O)NC2=O)(C(F)(F)F)C(F)(F)F

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CES1 P23141 1/20 0.45
GSK3B P49841 1/20 0.43
KDM4E B2RXH2 1/20 0.41
ALDH1A1 P00352 1/20 0.41
GAA P10253 1/20 0.41
HPGD P15428 1/20 0.41
HSD17B10 Q99714 1/20 0.41
PARP1 P09874 4/20 0.41
STK10 O94804 8/20 0.41
SLK Q9H2G2 8/20 0.41
CASP3 P42574 3/20 0.38
CASP7 P55210 2/20 0.38
CASP2 P42575 1/20 0.38
CASP6 P55212 1/20 0.38
CASP8 Q14790 1/20 0.38
CHEK1 O14757 1/20 0.38
WEE1 P30291 1/20 0.38
POLB P06746 2/20 0.35
MEN1 O00255 1/20 0.35
RGS12 O14924 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30360556 0.85 CES1 (0.56) CES1GSK3BKDM4EALDH1A1GAA
SCHEMBL2156113 0.78 KDM4E (0.47) CES1GSK3BKDM4EALDH1A1GAA
SCHEMBL8827920 0.75 KDM4E (0.45) CES1GSK3BKDM4EALDH1A1GAA
SCHEMBL16754925 0.74 GSK3B (0.62) GSK3BKDM4EALDH1A1GAAHPGD
SCHEMBL544762 0.73 ALOX15 (0.41) CES1TDP1
Bicarbonate SCHEMBL23581765 0.72 KDM4E (0.50) GSK3BKDM4EALDH1A1GAAHPGD
SCHEMBL9510827 0.71 GSK3B (0.44) CES1GSK3BKDM4EALDH1A1GAA
SCHEMBL29198817 0.71 GSK3B (0.39) CES1GSK3BKDM4EALDH1A1GAA
SCHEMBL1080129 0.71 GSK3B (0.52) GSK3BKDM4EALDH1A1GAAHPGD
SCHEMBL29578942 0.71 GSK3B (0.52) GSK3BKDM4EALDH1A1GAAHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5212261-A LATENT, HEAT-CURABLE EPOXY RESIN COMPOSITIONS CONTAINING METAL CARBOXYLATE CURING SYSTEMS HENKEL RESEARCH CORPORATION (US) 1993-05-18 US claimed
WO-1992011307-A1 LATENT, HEAT-CURABLE EPOXY RESIN COMPOSITIONS CONTAINING METAL CARBOXYLATE CURING SYSTEMS HENKEL RESEARCH CORPORATION (US) 1992-07-09 WO claimed
US-6665479-B2 Polymeric devices including optical waveguide laser and optical amplifier SHAYDA TECHNOLOGIES, INC. 2003-12-16 US disclosed
US-6661942-B1 Different optical nonlinear second-order polymer layers with chromogen attached; electrooptics, communication TRANS PHOTONICS, LLC 2003-12-09 US disclosed
WO-2002071557-A2 POLYMERIC WAVEGUIDE LASER AND AMPLIFIER SHAYDA TECHNOLOGIES, INC. (US) 2002-09-12 WO disclosed
EP-1203220-A2 BIOSENSORS WITH POLYMERIC OPTICAL WAVEGUIDES Shayda technologies, Inc. (US) 2002-05-08 EP disclosed
US-20020009274-A1 Novel polymeric devices including optical waveguide laser and optical amplifier GOVERNMENT OF THE U.S. OF AMERICA 2002-01-24 US disclosed
WO-2001006240-A9 BIOSENSORS WITH POLYMERIC OPTICAL WAVEGUIDES SHAYDA TECHNOLOGIES INC (US) 2001-07-19 WO disclosed
WO-2001006240-A1 BIOSENSORS WITH POLYMERIC OPTICAL WAVEGUIDES SHAYDA TECHNOLOGIES, INC. (US) 2001-01-25 WO disclosed
US-5212261-A LATENT, HEAT-CURABLE EPOXY RESIN COMPOSITIONS CONTAINING METAL CARBOXYLATE CURING SYSTEMS HENKEL RESEARCH CORPORATION (US) 1993-05-18 US disclosed
WO-1992011307-A1 LATENT, HEAT-CURABLE EPOXY RESIN COMPOSITIONS CONTAINING METAL CARBOXYLATE CURING SYSTEMS HENKEL RESEARCH CORPORATION (US) 1992-07-09 WO disclosed
EP-0402632-A2 Aromatic polyimide silanol compounds, precursors and polymers thereof Hughes Aircraft Company (US) 1990-12-19 EP disclosed
US-4864047-A Aminophenoxyphosphazenes and process for producing same THE DOW CHEMICAL COMPANY (US) 1989-09-05 US disclosed
US-4745206-A Aminophenoxyphosphazenes and a process for producing same THE DOW CHEMICAL COMPANY (US) 1988-05-17 US disclosed