Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GAA | P10253 | 2/20 | 0.33 |
| ▸ | P4HB | P07237 | 1/20 | 0.33 |
| ▸ | HTT | P42858 | 1/20 | 0.33 |
| ▸ | ALOX15 | P16050 | 2/20 | 0.33 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.33 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.33 |
| ▸ | MMP2 | P08253 | 1/20 | 0.31 |
| ▸ | MMP14 | P50281 | 1/20 | 0.31 |
| ▸ | TSHR | P16473 | 1/20 | 0.31 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.30 |
| ▸ | MEN1 | O00255 | 1/20 | 0.30 |
| ▸ | POLB | P06746 | 1/20 | 0.30 |
| ▸ | MAPT | P10636 | 1/20 | 0.30 |
| ▸ | RAB9A | P51151 | 1/20 | 0.30 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5453330 | 0.80 | FFAR4 (0.35) | — | |
| SCHEMBL1119475 | 0.79 | MAOA (0.41) | GAACYP3A4HSD17B10MMP2TSHR | |
| SCHEMBL1270081 | 0.78 | MAOB (0.46) | GAACYP3A4TSHRKDM4EMEN1 | |
| SCHEMBL1119437 | 0.77 | MAOB (0.41) | GAACYP3A4MEN1POLBMAPT | |
| SCHEMBL8741878 | 0.69 | MAOB (0.30) | — | |
| SCHEMBL8741834 | 0.69 | TACR1 (0.36) | TSHR | |
| Ammonia Solution, Strong SCHEMBL8741833 | 0.69 | — | — | |
| SCHEMBL564952 | 0.67 | LTA4H (0.59) | GAAALOX15CYP3A4HSD17B10MMP2 | |
| SCHEMBL30233344 | 0.67 | LTA4H (0.59) | GAAALOX15CYP3A4HSD17B10MMP2 | |
| SCHEMBL8432974 | 0.66 | GRM5 (0.49) | GAAHTTHSD17B10KDM4EMEN1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8124173-B2 | Process for packaging electronic devices | UBE INDUSTRIES, LTD. (JP) | 2012-02-28 | — | — | US | disclosed |
| US-20090092748-A1 | ELECTRONIC DEVICE PACKAGING AND CURABLE RESIN COMPOSITION | UBE INDUSTRIES, LTD. (JP) | 2009-04-09 | — | — | US | disclosed |
| US-7141614-B2 | Photosensitive resin composition and photosensitive films and laminates made by using the same | KANEKA CORPORATION (JP) | 2006-11-28 | — | — | US | disclosed |
| US-20040265731-A1 | Photosensitive resin composition and photosensitive films and laminates made by using the same | KANEKA CORPORATION (JP) | 2004-12-30 | — | — | US | disclosed |
| US-20040132888-A1 | Electronic device packaging and curable resin composition | UBE INDUSTRIES, LTD. (JP) | 2004-07-08 | — | — | US | disclosed |