SCHEMBL714870

SCHEMBL714870

[GeH2-].[GeH2-].[GeH2-].[GeH2-].[GeH2-].[Ta+5]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29356972 0.71
SCHEMBL30828689 0.71
SCHEMBL2401691 0.71
SCHEMBL5877574 0.50
Potassium Ion SCHEMBL11651980 0.50
Fluoride Ion SCHEMBL309897 0.50
Water SCHEMBL284820 0.50
SCHEMBL1902881 0.50
SCHEMBL4843471 0.50
SCHEMBL3292029 0.50

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 50 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11777016-B2 Method of forming backside power rails TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2023-10-03 US claimed
US-20220336641-A1 Method of Forming Backside Power Rails TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2022-10-20 US claimed
US-12581717-B2 Frontside and backside epi contact INTEL CORPORATION (US) 2026-03-17 US disclosed
US-20260068214-A1 Integrated Assemblies having Transistors Configured for High-Voltage Applications, and Methods of Forming Integrated Assemblies MICRON TECHNOLOGY, INC. (US) 2026-03-05 US disclosed
US-12490452-B2 Integrated assemblies having transistors configured for high-voltage applications, and methods of forming integrated assemblies MICRON TECHNOLOGY, INC. (US) 2025-12-02 US disclosed
US-20250351478-A1 HYBRID NANOSTRUCTURE SCHEME AND METHODS FOR FORMING THE SAME TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2025-11-13 US disclosed
US-12451399-B2 Integrated thermal solution to enable operation of embedded processors in sub-zero temperatures INTEL CORPORATION (US) 2025-10-21 US disclosed
US-20250098237-A1 HYBRID NANOSTRUCTURE SCHEME AND METHODS FOR FORMING THE SAME TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2025-03-20 US disclosed
CN-119300409-A Semiconductor structure, forming method thereof and transistor 台湾积体电路制造股份有限公司 2025-01-10 CN disclosed
US-20240379807-A1 METAL SOURCE/DRAIN FEATURES TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) 2024-11-14 US disclosed
CN-113054026-B Semiconductor device and method of forming the same 台湾积体电路制造股份有限公司 2024-08-23 CN disclosed
US-20210305393-A1 Metal Source/Drain Features TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) 2021-09-30 US disclosed
US-11133223-B2 Selective epitaxy TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) 2021-09-28 US disclosed
CN-113054026-A Semiconductor device and method of forming the same 台湾积体电路制造股份有限公司 2021-06-29 CN disclosed
US-20210020522-A1 Selective Epitaxy TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) 2021-01-21 US disclosed
CN-112242356-A Semiconductor device and method for manufacturing the same 台湾积体电路制造股份有限公司 2021-01-19 CN disclosed
US-8395215-B2 Germanium field effect transistors and fabrication thereof TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2013-03-12 US disclosed
US-20120112282-A1 Germanium Field Effect Transistors and Fabrication Thereof TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) 2012-05-10 US disclosed
US-8124513-B2 Germanium field effect transistors and fabrication thereof TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) 2012-02-28 US disclosed
US-20100237444-A1 Germanium Field Effect Transistors and Fabrication Thereof TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2010-09-23 US disclosed