SCHEMBL7168476

SCHEMBL7168476

CCCCC(C)(CCCC)C(O)(O)OP(=O)(O)OP(=O)(O)O

nearest known ligand 0.45

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
SMPD1 P17405 3/20 0.45
FDPS P14324 12/20 0.38
GGPS1 O95749 7/20 0.38
LPAR3 Q9UBY5 3/20 0.34
LPAR1 Q92633 2/20 0.34
LPAR2 Q9HBW0 2/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4419907 0.81 SMPD1 (0.44) SMPD1FDPSGGPS1LPAR3LPAR1
SCHEMBL7165750 0.81 SMPD1 (0.50) SMPD1FDPSGGPS1LPAR3LPAR1
SCHEMBL5459837 0.75 FDPS (0.47) SMPD1FDPSGGPS1LPAR3LPAR1
SCHEMBL7169863 0.74 SMPD1 (0.53) SMPD1FDPSGGPS1LPAR3LPAR1
SCHEMBL7165754 0.73 SMPD1 (0.41) SMPD1FDPSGGPS1LPAR3LPAR1
Pyrophosphoric Acid SCHEMBL5455638 0.72 FDPS (0.52) SMPD1FDPSGGPS1
SCHEMBL10826888 0.71 LPAR3 (0.39) SMPD1LPAR3LPAR1LPAR2
SCHEMBL27426319 0.70 FDPS (0.38) SMPD1FDPSGGPS1LPAR3LPAR1
SCHEMBL6282200 0.69 FDPS (0.47) SMPD1FDPSGGPS1LPAR3LPAR1
SCHEMBL215087 0.69 SMPD1 (0.55) SMPD1FDPSGGPS1LPAR3LPAR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6569531-B1 Adding multifunctional additive to thermoplastic polyester resin, allowing to react with molecules of resin which is in molten state, molding to produce additive-containing resin molded article TAKIRON CO., LTD. (JP) 2003-05-27 US claimed
EP-1086978-A1 ADDITIVE-CONTAINING MOLDED RESIN AND PROCESS FOR PRODUCING THE SAME Takiron Co., Ltd. (JP) 2001-03-28 EP claimed
US-6569531-B1 Adding multifunctional additive to thermoplastic polyester resin, allowing to react with molecules of resin which is in molten state, molding to produce additive-containing resin molded article TAKIRON CO., LTD. (JP) 2003-05-27 US disclosed
EP-1086978-A1 ADDITIVE-CONTAINING MOLDED RESIN AND PROCESS FOR PRODUCING THE SAME Takiron Co., Ltd. (JP) 2001-03-28 EP disclosed