⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3381262 | 0.75 | — | — | |
| SCHEMBL3382093 | 0.75 | THRB (0.30) | — | |
| SCHEMBL3385705 | 0.74 | — | — | |
| SCHEMBL3385453 | 0.74 | — | — | |
| SCHEMBL18550208 | 0.74 | — | — | |
| SCHEMBL475144 | 0.71 | TSHR (0.43) | — | |
| SCHEMBL3381956 | 0.70 | — | — | |
| SCHEMBL7538527 | 0.70 | — | — | |
| SCHEMBL16738135 | 0.67 | ALDH1A1 (0.39) | — | |
| SCHEMBL47990 | 0.67 | SOAT1 (0.42) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 80 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116355379-A | Polyphenyl ether resin composite material and preparation method thereof | 南方科技大学 | 2023-06-30 | — | — | CN | claimed |
| JP-7242704-A | — | — | None | — | — | JP | disclosed |
| US-20240227256-A1 | THERMOSETTING COMPOSITION FOR INJECTION MOLDING, METHOD FOR PRODUCING MOLDED ARTICLE USING THE SAME, AND CURED PRODUCT | IDEMITSU KOSAN CO.,LTD. (JP) | 2024-07-11 | — | — | US | disclosed |
| US-20240208116-A1 | THERMOSETTING COMPOSITION FOR INJECTION MOLDING, METHOD FOR PRODUCING MOLDED ARTICLE USING THE SAME, AND CURED PRODUCT | IDEMITSU KOSAN CO.,LTD. (JP) | 2024-06-27 | — | — | US | disclosed |
| US-20240199782-A1 | THERMOSETTING COMPOSITION, METHOD FOR PRODUCING MOLDED ARTICLE USING THE SAME, AND CURED PRODUCT | IDEMITSU KOSAN CO.,LTD. (JP) | 2024-06-20 | — | — | US | disclosed |
| CN-113906061-B | Copolymer and composite resin | 株式会社日本触媒 | 2024-06-18 | — | — | CN | disclosed |
| CN-118139905-A | Thermosetting resin composition, resin sheet, metal foil with resin, metal-clad laminate, and printed wiring board | 松下知识产权经营株式会社 | 2024-06-04 | — | — | CN | disclosed |
| CN-118119651-A | Method for producing low-silanol polyorganosiloxanes | 瓦克化学股份公司 | 2024-05-31 | — | — | CN | disclosed |
| CN-117924789-A | Thermal expansion microsphere and preparation method and application thereof | 万华化学集团股份有限公司 | 2024-04-26 | — | — | CN | disclosed |
| CN-117795001-A | Thermoplastic elastomer composition | MCPP创新有限公司 | 2024-03-29 | — | — | CN | disclosed |
| EP-2463316-A1 | ACRYLATE COMPOSITION | Idemitsu Kosan Co., Ltd. (JP) | 2012-06-13 | — | — | EP | disclosed |
| US-20120142867-A1 | ACRYLATE COMPOSITION | IDEMITSU KOSAN CO., LTD. (JP) | 2012-06-07 | — | — | US | disclosed |
| US-20120053287-A1 | RESIN COMPOSITION FOR INSULATING LAYER | SUMITOMO CHEMICAL COMPANY, LTD (JP) | 2012-03-01 | — | — | US | disclosed |
| EP-1032497-B1 | INKJET PRINTING MEDIUM COMPRISING CROSSLINKED PRINTING SURFACE | HEWLETT PACKARD CO (US) | 2002-02-06 | — | — | EP | disclosed |
| US-6183844-B1 | MULTILAYER COATINGS FOR PRINTING WITH SUBSTRATES AND ABSORBANT COATINGS AND PARTICLES | HEWLETT-PACKARD COMPANY | 2001-02-06 | — | — | US | disclosed |
| EP-1032497-A1 | INKJET PRINTING MEDIUM COMPRISING CROSSLINKED PRINTING SURFACE | Hewlett-Packard Company, A Delaware Corporation (US) | 2000-09-06 | — | — | EP | disclosed |
| WO-2000035677-A1 | INKJET PRINTING MEDIUM COMPRISING MULTIPLE COATINGS | PPG INDUSTRIES OHIO, INC. (US) | 2000-06-22 | — | — | WO | disclosed |
| WO-1999021724-A1 | INKJET PRINTING MEDIUM COMPRISING CROSSLINKED PRINTING SURFACE | PPG INDUSTRIES OHIO, INC. (US) | 1999-05-06 | — | — | WO | disclosed |
| JP-H07242704-A | PREPARATION OF THERMOPLASTIC COPOLYMER | DENKI KAGAKU KOGYO KK | 1995-09-19 | — | — | JP | disclosed |
| US-5231195-A | Monomers for opthalmic lenses | PPG INDUSTRIES, INC. (US) | 1993-07-27 | — | — | US | disclosed |