SCHEMBL7185943

SCHEMBL7185943

CO[Si](C)(OC)c1cccc(C#Cc2ccccc2)c1[Si](C)(OC)OC

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 4/20 0.40
SMN1; SMN2 Q16637 3/20 0.40
KDM4E B2RXH2 3/20 0.40
ALDH1A1 P00352 3/20 0.40
MEN1 O00255 2/20 0.40
CYP1A2 P05177 2/20 0.40
CYP3A4 P08684 2/20 0.40
CYP2C9 P11712 2/20 0.40
HPGD P15428 2/20 0.40
CYP2C19 P33261 2/20 0.40
KMT2A Q03164 2/20 0.40
MAPT P10636 1/20 0.40
HSD17B10 Q99714 1/20 0.40
APP P05067 1/20 0.38
DHFR P00374 1/20 0.36
GRM5 P41594 5/20 0.36
RAB9A P51151 3/20 0.36
TP53 P04637 1/20 0.36
CYP2D6 P10635 1/20 0.36
PKM P14618 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7191185 0.87 NPC1 (0.44) NPC1SMN1; SMN2KDM4EALDH1A1MEN1
SCHEMBL6437480 0.79 NPC1 (0.41) NPC1SMN1; SMN2KDM4EALDH1A1MEN1
SCHEMBL1639909 0.75
SCHEMBL7183857 0.75 NPC1 (0.46) NPC1SMN1; SMN2KDM4EALDH1A1MEN1
SCHEMBL563466 0.72 NPC1 (0.50) NPC1SMN1; SMN2KDM4EALDH1A1MEN1
SCHEMBL1639810 0.70 MAPT (0.35) NPC1SMN1; SMN2KDM4EALDH1A1MEN1
SCHEMBL1639784 0.69
SCHEMBL1639954 0.69 CA4 (0.36) NPC1SMN1; SMN2KDM4EALDH1A1CYP1A2
SCHEMBL30473475 0.69 CA4 (0.36) NPC1SMN1; SMN2KDM4EALDH1A1CYP1A2
SCHEMBL6754426 0.68 APP (0.55) NPC1SMN1; SMN2KDM4EALDH1A1MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1276807-A1 CURABLE SILICONE RESIN COMPOSITION AND REACTIVE SILICON COMPOUNDS Dow Corning Corporation (US) 2003-01-22 EP disclosed
WO-2001083608-A1 CURABLE SILICONE RESIN COMPOSITION AND REACTIVE SILICON COMPOUNDS DOW CORNING CORPORATION (US) 2001-11-08 WO disclosed