Hydrochloric Acid

Hydrochloric Acid

SCHEMBL7189002

CC1=CC2=C(CCCC2)C1[Zr+2](C1C(C)=CC2=C1CCCC2)=[Si](c1ccccc1)c1ccccc1.[Cl-].[Cl-]

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

ACHEBDKRB2CHRM1CHRM2CHRM3CHRNA1CHRNB1CHRNDCHRNECHRNGGUCY1A1GUCY1A2GUCY1B1GUCY1B2NAMPTPTAFRSLC10A2SLC6A2SLC6A3TACR1dacAdacBdacCftsImrcAmrcBmrdA

The experimentally established mechanism targets of Hydrochloric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0982328-B1 Propylene resin compositions, process for the preparation thereof, and use thereof. IDEMITSU PETROCHEMICAL CO (JP) 2003-07-23 EP disclosed
US-20020072569-A1 Polyolefin resin modifier, polyolefin resin composition and oriented polyolefin film IDEMITSU PETROCHEMICAL CO., LTD. 2002-06-13 US disclosed
US-6339128-B1 PACKAGING, THICKNESS ACCURACY OF THE FORMED FILM AND STRETCHABILITY IDEMITSU PETROCHEMICAL CO., LTD. (JP) 2002-01-15 US disclosed
US-6268063-B1 BLEND OF POLYPROPYLENE AND ETHYLENE-PROPYLENE COPOLYMER;FLEXIBILITY, RADIATION TRANSPARENT TOKUYAMA CORPORATION (JP) 2001-07-31 US disclosed
EP-1041114-A1 Polyolefin resin modifier, polyolefin resin composition and oriented polyolefin film TOKUYAMA CORPORATION (JP) 2000-10-04 EP disclosed
EP-0982328-A1 Propylene resin compositions, process for the preparation thereof, and use thereof. TOKUYAMA CORPORATION (JP) 2000-03-01 EP disclosed