SCHEMBL718922

SCHEMBL718922

[CH2]CCC1CCC2OC12

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1149309 0.86
SCHEMBL285120 0.85
SCHEMBL720158 0.80
SCHEMBL9647348 0.76
SCHEMBL15504683 0.74
SCHEMBL15315784 0.71 SIGMAR1 (0.31)
SCHEMBL15315789 0.71 SIGMAR1 (0.31)
SCHEMBL7089291 0.70
SCHEMBL7089295 0.70
SCHEMBL6344634 0.69 KDM4E (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 90 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20200278611-A1 A METHOD OF PREPARING A PLANAR OPTICAL WAVEGUIDE ASSEMBLY DOW SILICONES CORP (US) 2020-09-03 US claimed
EP-3194501-B1 3D PRINTING METHOD UTILIZING A PHOTOCURABLE SILICONE COMPOSITION DOW SILICONES CORP (US) 2024-07-10 EP disclosed
CN-118103453-A Silicone-polyolefin hybrid elastomer 陶氏环球技术有限责任公司 2024-05-28 CN disclosed
US-20240158580-A1 CURABLE SILICONE COMPOSITION DOW SILICONES CORP (US) 2024-05-16 US disclosed
EP-4359454-A1 DUAL CURABLE SILICONE COMPOSITION Dow Silicones Corporation (US) 2024-05-01 EP disclosed
CN-116057110-B Curable silicone composition and cured product thereof 美国陶氏有机硅公司 2024-03-08 CN disclosed
EP-4065262-B1 STATIC MIXER AND ADDITIVE MANUFACTURING SYSTEM COMPRISING THE STATIC MIXER DOW SILICONES CORP (US) 2024-01-31 EP disclosed
US-20240018308-A1 CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF DOW SILICONES CORP (US) 2024-01-18 US disclosed
EP-4301814-A1 CURABLE SILICONE COMPOSITION Dow Silicones Corporation (US) 2024-01-10 EP disclosed
CN-117355549-A Dual cure silicone composition 美国陶氏有机硅公司 2024-01-05 CN disclosed
EP-2201063-A1 REINFORCED SILICONE RESIN FILM AND NANOFIBER-FILLED SILICONE COMPOSITION Dow Corning Corporation (US) 2010-06-30 EP disclosed
EP-2154183-A1 Coated substrates and methods for their preparation Dow Corning Corporation (US) 2010-02-17 EP disclosed
WO-2009111190-A1 SILICONE COMPOSITION, SILICONE ADHESIVE, COATED AND LAMINATED SUBSTRATES DOW CORNING CORPORATION (US) 2009-09-11 WO disclosed
US-20090130463-A1 Inorganic barrier coating such as hydrogenated silicon oxycarbide, and a cured polysiloxane having pendant radiation senstivie groups as interfacial coating; superior resistance to environmental elements, particularly water vapor and oxygen; use with electronic devices DOW CORNING CORPORATION 2009-05-21 US disclosed
US-20090110917-A1 Electronic Package and Method of Preparing Same DOW CORNING CORPORATION 2009-04-30 US disclosed
WO-2009048694-A1 REINFORCED SILICONE RESIN FILM AND NANOFIBER-FILLED SILICONE COMPOSITION DOW CORNING CORPORATION (US) 2009-04-16 WO disclosed
EP-2024998-A1 ELECTRONIC PACKAGE AND METHOD OF PREPARING SAME Dow Corning Corporation (US) 2009-02-18 EP disclosed
EP-1963409-A2 COATED SUBSTRATES AND METHODS FOR THEIR PREPARATION Dow Corning Corporation (US) 2008-09-03 EP disclosed
WO-2007145711-A1 ELECTRONIC PACKAGE AND METHOD OF PREPARING SAME DOW CORNING CORPORATION (US) 2007-12-21 WO disclosed
WO-2007044181-A2 COATED SUBSTRATES AND METHODS FOR THEIR PREPARATION DOW CORNING CORPORATION (US) 2007-04-19 WO disclosed