SCHEMBL7195604

SCHEMBL7195604

CCO[SiH](CCCCN)OCC.CCO[Si](CCCN)(OCC)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18544200 0.94
SCHEMBL8053449 0.89
SCHEMBL28266511 0.87
SCHEMBL21647352 0.86
SCHEMBL4435111 0.86 LMNA (0.33)
SCHEMBL29216810 0.85
SCHEMBL8006198 0.85
SCHEMBL37812 0.84 DNM1 (0.38)
SCHEMBL28029181 0.84 CYP1A2 (0.32)
SCHEMBL483441 0.82 DNM1 (0.42)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20210032408-A1 POLYSILOXANE RESIN, COATING COMPOSITION COMPRISING THE SAME, AND APPLICATION THEREOF ETERNAL MATERIALS CO., LTD. (TW) 2021-02-04 US claimed
US-6555187-B1 Mixture of specified physical properties of an epoxy resin, rubber-like polymer fine particles, inorganic filler, curing agent; use in single layer press hot bonding system, high productivity and humidity resistant MITSUI CHEMICALS, INC. (JP) 2003-04-29 US disclosed