SCHEMBL7195875

SCHEMBL7195875

CCC(=NO)C(=O)c1ccc(SC)cc1

nearest known ligand 0.65

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ HTT P42858 1/20 0.65
▸ PLK1 P53350 1/20 0.44
▸ TAS1R3 Q7RTX0 1/20 0.43
▸ TAS1R1 Q7RTX1 1/20 0.43
▸ HAO1 Q9UJM8 1/20 0.41
▸ MAPT P10636 4/20 0.38
▸ LMNA P02545 3/20 0.38
▸ NPSR1 Q6W5P4 3/20 0.38
▸ KDM4E B2RXH2 2/20 0.38
▸ POLB P06746 1/20 0.38
▸ MEN1 O00255 3/20 0.37
▸ KMT2A Q03164 3/20 0.37
▸ SMN1; SMN2 Q16637 3/20 0.37
▸ EPHX2 P34913 1/20 0.37
▸ NR1H4 Q96RI1 1/20 0.37
▸ ADORA3 P0DMS8 2/20 0.37
▸ ALDH1A1 P00352 4/20 0.36
▸ HPGD P15428 3/20 0.36
▸ RAB9A P51151 2/20 0.36
▸ TSHR P16473 2/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7195870 1.00 HTT (0.65) HTTPLK1TAS1R3TAS1R1HAO1
SCHEMBL7194873 0.88 HTT (0.67) HTTTAS1R3TAS1R1LMNANPSR1
SCHEMBL20935052 0.88 HTT (0.67) HTTTAS1R3TAS1R1LMNANPSR1
SCHEMBL7194878 0.88 HTT (0.67) HTTTAS1R3TAS1R1LMNANPSR1
SCHEMBL7197261 0.83 HTT (0.45) HTTPLK1TAS1R3TAS1R1HAO1
SCHEMBL7197264 0.83 HTT (0.45) HTTPLK1TAS1R3TAS1R1HAO1
SCHEMBL29387003 0.82 HTT (0.59) HTTMAPTLMNASMN1; SMN2ALDH1A1
SCHEMBL1478455 0.80 HTT (0.42) HTTPLK1TAS1R3TAS1R1HAO1
SCHEMBL1478456 0.80 HTT (0.42) HTTPLK1TAS1R3TAS1R1HAO1
SCHEMBL11372121 0.79 HTT (1.00) HTTMAPTLMNANPSR1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122072433-A Photosensitive resin composition for black resist, method for producing resin composition, light-shielding film, optical filter, touch panel, and display device 日铁化学材料株式会社 2026-05-22 — — CN disclosed
CN-113050372-B Photosensitive resin composition for black resist, light shielding film, color filter, touch panel, and display device 日铁化学材料株式会社 2026-05-12 — — CN disclosed
CN-115551915-B Alkali-soluble resin containing polymerizable unsaturated group, process for producing the same, photosensitive resin composition, and cured product thereof 日铁化学材料株式会社 2025-06-03 — — CN disclosed
CN-112162462-B Photosensitive resin composition for touch screen, cured film thereof, and touch screen having cured film thereof 日铁化学材料株式会社 2025-04-08 — — CN disclosed
CN-119192537-A Unsaturated group-containing polymerizable resin, curable resin composition, resin cured film, semiconductor package, and display device 日铁化学材料株式会社 2024-12-27 — — CN disclosed
CN-110515268-B Photosensitive resin composition, cured product of the same, and display device containing the cured product 日铁化学材料株式会社 2024-12-06 — — CN disclosed
CN-112538157-B Epoxy acrylate resin, alkali-soluble resin, process for producing the same, curable photosensitive resin composition, and cured product thereof 日铁化学材料株式会社 2024-11-12 — — CN disclosed
CN-118732393-A Photosensitive resin composition, method for producing cured film, substrate with cured film, display device, and sensor 日铁化学材料株式会社 2024-10-01 — — CN disclosed
WO-2024186169-A1 ACRYLATE-BASED RESIN COMPOSITION AND PREPARATION METHOD THEREFOR 국도화학 주식회사 2024-09-12 — — WO disclosed
CN-118530443-A Unsaturated group-containing polymerizable resin, curable resin composition, laminate, and method for producing and treating laminate 日铁化学材料株式会社 2024-08-23 — — CN disclosed
CN-116789912-A Curable resin composition, resin cured film, semiconductor package, and display device 日铁化学材料株式会社 2023-09-22 — — CN disclosed
CN-116360215-A Photosensitive resin composition for black resist, process for producing the same, light shielding film, color filter, touch panel, and display device 日铁化学材料株式会社 2023-06-30 — — CN disclosed
CN-115903385-A Photosensitive resin composition, cured film, color filter, touch panel, and display device 日铁化学材料株式会社 2023-04-04 — — CN disclosed
CN-115877660-A Photosensitive resin composition, resin cured film, semiconductor package, and printed wiring board 日铁化学材料株式会社 2023-03-31 — — CN disclosed
CN-115704928-A Cured film for information display device, composition for transparent cured film, and information display device 日铁化学材料株式会社 2023-02-17 — — CN disclosed
CN-115551915-A Polymerizable unsaturated group-containing alkali-soluble resin and method for producing same, and photosensitive resin composition and cured product thereof 日铁化学材料株式会社 2022-12-30 — — CN disclosed
CN-115308994-A Photosensitive resin composition for black resist, cured film and method for producing the same, color filter and partition wall 日铁化学材料株式会社 2022-11-08 — — CN disclosed
CN-115141552-A Adhesive layer forming composition, laminate, method for producing laminate, and method for treating laminate 日铁化学材料株式会社 2022-10-04 — — CN disclosed
CN-115145114-A Photosensitive resin composition for light-shielding film, and light-shielding film, color filter and display device using same 日铁化学材料株式会社 2022-10-04 — — CN disclosed
US-6596445-B1 Initiators for photopolymerization of radically polymerizable compounds CIBA SPECIALTY CHEMICALS CORPORATION 2003-07-22 — — US disclosed
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