Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | APP | P05067 | 1/20 | 0.60 |
| ▸ | MAPT | P10636 | 3/20 | 0.46 |
| ▸ | CYP1A2 | P05177 | 3/20 | 0.43 |
| ▸ | GRM5 | P41594 | 1/20 | 0.43 |
| ▸ | CYP1A1 | P04798 | 1/20 | 0.43 |
| ▸ | CYP1B1 | Q16678 | 1/20 | 0.43 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.41 |
| ▸ | CYP2C9 | P11712 | 2/20 | 0.41 |
| ▸ | CYP2C19 | P33261 | 2/20 | 0.41 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.41 |
| ▸ | NPC1 | O15118 | 2/20 | 0.41 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.41 |
| ▸ | MEN1 | O00255 | 1/20 | 0.41 |
| ▸ | HPGD | P15428 | 1/20 | 0.41 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.41 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.41 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.41 |
| ▸ | KCNH2 | Q12809 | 2/20 | 0.40 |
| ▸ | LMNA | P02545 | 1/20 | 0.40 |
| ▸ | HTT | P42858 | 1/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9861764 | 0.95 | APP (0.55) | APPMAPTCYP1A2GRM5CYP1A1 | |
| SCHEMBL4196157 | 0.93 | APP (0.57) | APPMAPTCYP1A2GRM5CYP1A1 | |
| SCHEMBL2492685 | 0.82 | APP (0.50) | APPMAPTCYP1A2GRM5CYP1A1 | |
| SCHEMBL30394466 | 0.82 | APP (0.50) | APPMAPTCYP1A2GRM5CYP1A1 | |
| SCHEMBL25383897 | 0.82 | MAPT (0.50) | APPMAPTCYP1A2GRM5CYP1A1 | |
| Diphenylacetylene SCHEMBL21271527 | 0.81 | APP (0.80) | APPMAPTCYP1A2GRM5CYP1A1 | |
| SCHEMBL3796509 | 0.81 | APP (0.80) | APPMAPTCYP1A2GRM5CYP3A4 | |
| Diphenylacetylene SCHEMBL27926128 | 0.81 | APP (0.80) | APPMAPTCYP1A2GRM5CYP1A1 | |
| Diphenylacetylene SCHEMBL960609 | 0.78 | APP (1.00) | APPMAPTCYP1A2GRM5CYP3A4 | |
| Diphenylacetylene SCHEMBL29188592 | 0.78 | APP (1.00) | APPMAPTCYP1A2GRM5CYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6646081-B2 | Useful in making low dielectric constant insulating layers in microelectronic devices | DOW GLOBAL TECHNOLOGIES INC. | 2003-11-11 | — | — | US | claimed |
| EP-1244724-A1 | POLYARYLENE COMPOSITIONS WITH ENHANCED MODULUS PROFILES | Dow Global Technologies, Inc. (US) | 2002-10-02 | — | — | EP | claimed |
| WO-2001038417-A1 | POLYARYLENE COMPOSITIONS WITH ENHANCED MODULUS PROFILES | DOW GLOBAL TECHNOLOGIES INC. (US) | 2001-05-31 | — | — | WO | claimed |
| US-4097460-A | DIPHENYLACETYLENE, DIPHENYLBUTADIYNE, MOLDING MATERIALS FOR HIGH TEMPERATURE APPLICATIONS | HERCULES INCORPORATED (US) | 1978-06-27 | — | — | US | claimed |
| US-4070333-A | AROMATIZATION CATALYST, ADDITION POLYMERIZATION | HERCULES INCORPORATED (US) | 1978-01-24 | — | — | US | claimed |
| WO-1991009066-A1 | HIGH CARBON RESINS AND FOAMS | HYPERION CATALYSIS INTERNATIONAL, INC. (US) | 1991-06-27 | — | — | WO | disclosed |
| US-4690962-A | BLEND OF ACETYLENIC OLIGOMER WITH PLASTICIZER AND TOUGHNESS AGENTS | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1987-09-01 | — | — | US | disclosed |
| US-4592944-A | Integrated circuit chip sealed with a protective coating | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1986-06-03 | — | — | US | disclosed |
| EP-0095048-A2 | Oligomer coated electronic circuit component and method of coating | International Business Machines Corporation (US) | 1983-11-30 | — | — | EP | disclosed |
| EP-0000385-B1 | THERMOSETTING COMPOSITIONS BASED ON POLYARYLACETYLENES AND SUBSTITUTED POLYPHENYLENE OXIDES AND RESINS OBTAINED BY CURING THEM | HERCULES INCORPORATED (US) | 1981-08-26 | — | — | EP | disclosed |
| US-4144218-A | MOLDING MATERIALS | HERCULES INCORPORATED (US) | 1979-03-13 | — | — | US | disclosed |
| EP-0000385-A1 | Thermosetting compositions based on polyarylacetylenes and substituted polyphenylene oxides and resins obtained by curing them | HERCULES INCORPORATED (US) | 1979-01-24 | — | — | EP | disclosed |
| US-4097460-A | DIPHENYLACETYLENE, DIPHENYLBUTADIYNE, MOLDING MATERIALS FOR HIGH TEMPERATURE APPLICATIONS | HERCULES INCORPORATED (US) | 1978-06-27 | — | — | US | disclosed |
| US-4070333-A | AROMATIZATION CATALYST, ADDITION POLYMERIZATION | HERCULES INCORPORATED (US) | 1978-01-24 | — | — | US | disclosed |
| US-4026859-A | AROMATIZATION CATALYST | HERCULES INCORPORATED (US) | 1977-05-31 | — | — | US | disclosed |
| US-4026860-A | AROMATIZATION CATALYST | HERCULES INCORPORATED (US) | 1977-05-31 | — | — | US | disclosed |
| US-4026861-A | AROMATIZATION CATALYST | HERCULES INCORPORATED (US) | 1977-05-31 | — | — | US | disclosed |
| US-3993711-A | THERMOSETTING RESINS; COUPLING AGENTS; CARBOXYLATED PREPOLYMER | HERCULES INCORPORATED (US) | 1976-11-23 | — | — | US | disclosed |
| US-3931093-A | CURING | HERCULES INCORPORATED (US) | 1976-01-06 | — | — | US | disclosed |