Ammonia Solution, Strong

Ammonia Solution, Strong

SCHEMBL7197481

C=CCC(CC=C)(C(=O)O)C(C(=O)O)S(=O)(=O)O.N.N

nearest known ligand 0.33

Full drug profile on Sugi Atlas →

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.33
TSHR P16473 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL88776 0.98 ALDH1A1 (0.33) ALDH1A1TSHR
SCHEMBL1801980 0.85
SCHEMBL3373610 0.84 HTT (0.33) ALDH1A1TSHR
SCHEMBL1802046 0.83 ALDH1A1 (0.30) ALDH1A1TSHR
SCHEMBL4805557 0.81 ZDHHC20 (0.33) ALDH1A1TSHR
SCHEMBL3662934 0.81 ZDHHC20 (0.33) ALDH1A1TSHR
SCHEMBL5527387 0.77
SCHEMBL4350824 0.77 TSHR (0.37) ALDH1A1TSHR
SCHEMBL4537064 0.75 ALDH1A1 (0.30) ALDH1A1TSHR
SCHEMBL155620 0.73 CHRM1 (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-1118589-A None JP disclosed
JP-2040316-A None JP disclosed
WO-2020137359-A1 KIT FOR CLEANING AGENT AND METHOD FOR PREPARING CLEANING AGENT 富士フイルムエレクトロニクスマテリアルズ株式会社 2020-07-02 WO disclosed
EP-2475000-B1 PROCESSING AGENT COMPOSITION FOR SEMICONDUCTOR SURFACE AND METHOD FOR PROCESSING SEMICONDUCTOR SURFACE USING SAME WAKO PURE CHEM IND LTD (JP) 2015-07-01 EP disclosed
US-9034810-B2 Processing agent composition for semiconductor surface and method for processing semiconductor surface using same WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2015-05-19 US disclosed
US-9006164-B2 Resist remover composition and method for removing resist using the composition WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2015-04-14 US disclosed
EP-2474862-B1 COMPOSITION FOR REMOVING A RESIST ON A SEMICONDUCTOR SUBSTRATE AND METHOD FOR REMOVING RESIST USING THE COMPOSITION WAKO PURE CHEM IND LTD (JP) 2015-02-25 EP disclosed
EP-2474862-A1 RESIST REMOVER COMPOSITION AND METHOD FOR REMOVING RESIST USING THE COMPOSITION Wako Pure Chemical Industries, Ltd. (JP) 2012-07-11 EP disclosed
EP-2475000-A1 PROCESSING AGENT COMPOSITION FOR SEMICONDUCTOR SURFACE AND METHOD FOR PROCESSING SEMICONDUCTOR SURFACE USING SAME Wako Pure Chemical Industries, Ltd. (JP) 2012-07-11 EP disclosed
US-20120172274-A1 RESIST REMOVER COMPOSITION AND METHOD FOR REMOVING RESIST USING THE COMPOSITION WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2012-07-05 US disclosed
EP-0839448-A1 Pesticidal composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1998-05-06 EP disclosed
EP-0411823-B1 Thermoplastic polymer compositions containing melt-rheology modifiers ROHM & HAAS (US) 1996-02-07 EP disclosed
US-5352500-A High molecular weight acrylic polymers for blow molding ROHM AND HAAS COMPANY (US) 1994-10-04 US disclosed
US-5302429-A Thermoplastic polymer compositions containing high molecular weight poly(vinyl aromatic) melt-rheology modifiers ROHM AND HAAS COMPANY (US) 1994-04-12 US disclosed
EP-0328273-B1 Use of melt-rheology modifiers in thermoplastic polymer compositions ROHM & HAAS (US) 1994-01-05 EP disclosed
US-5102952-A Blend with high molecular weight vinyl aromatic polymers ROHM AND HAAS COMPANY (US) 1992-04-07 US disclosed
EP-0411823-A1 Thermoplastic polymer compositions containing melt-rheology modifiers ROHM AND HAAS COMPANY (US) 1991-02-06 EP disclosed
JP-H0240316-A SHAMPOO COMPOSITION UNILEVER NV 1990-02-09 JP disclosed
EP-0328273-A2 Use of melt-rheology modifiers in thermoplastic polymer compositions ROHM AND HAAS COMPANY (US) 1989-08-16 EP disclosed
JP-H01118589-A PREVENTION OF DUSTING OF PETROLEUM COKE NIPPON OIL & FATS CO LTD 1989-05-11 JP disclosed