SCHEMBL7200641

SCHEMBL7200641

c1ccc2c(c1)SCCNCCSc1ccccc1SCCNCCS2

nearest known ligand 0.65

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
RYR2 Q92736 2/20 0.65
ALDH1A1 P00352 2/20 0.56
MEN1 O00255 2/20 0.56
GAA P10253 2/20 0.56
KMT2A Q03164 2/20 0.56
HTR2C P28335 2/20 0.40
KCNH2 Q12809 1/20 0.39
HPGD P15428 2/20 0.36
NPSR1 Q6W5P4 1/20 0.36
KDM1A O60341 2/20 0.35
SIGMAR1 Q99720 3/20 0.34
OPRM1 P35372 1/20 0.34
HTR3E A5X5Y0 1/20 0.34
HTR3B O95264 1/20 0.34
ADRB1 P08588 1/20 0.34
HTR3A P46098 1/20 0.34
HTR3D Q70Z44 1/20 0.34
HTR3C Q8WXA8 1/20 0.34
SLC18A3 Q16572 1/20 0.34
NOTUM Q6P988 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL255970 0.80 ALDH1A1 (0.48) RYR2ALDH1A1MEN1GAAKMT2A
SCHEMBL31001736 0.80 ALDH1A1 (0.48) RYR2ALDH1A1MEN1GAAKMT2A
SCHEMBL2589907 0.80 RYR2 (1.00) RYR2ALDH1A1MEN1GAAKMT2A
Hydrochloric Acid SCHEMBL5849939 0.78 RYR2 (0.96) RYR2ALDH1A1MEN1GAAKMT2A
Piperazine SCHEMBL28173098 0.75 RYR2 (0.60) RYR2ALDH1A1MEN1GAAKMT2A
SCHEMBL2160748 0.75 HPGD (0.47) RYR2ALDH1A1MEN1GAAKMT2A
SCHEMBL3556450 0.73 GAA (0.96) RYR2ALDH1A1MEN1GAAKMT2A
SCHEMBL29364653 0.73 GAA (0.96) RYR2ALDH1A1MEN1GAAKMT2A
SCHEMBL88911 0.73 GAA (0.96) RYR2ALDH1A1MEN1GAAKMT2A
SCHEMBL23813034 0.72 ALDH1A1 (0.43) RYR2ALDH1A1MEN1GAAKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6607653-B1 Tin-copper alloy plating bath, tin-copper-bismuth alloy plating bath or tin-copper-silver alloy plating bath containing a soluble metal compound and a specific sulfur-containing compound. The plating bath of the alloy with DAIWA FINE CHEMICALS CO., LTD. (JP) 2003-08-19 US disclosed