SCHEMBL7200668

SCHEMBL7200668

c1ncc(SSc2cnc[nH]2)[nH]1

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.43
FKBP5 Q13451 1/20 0.43
PKM P14618 1/20 0.39
KDM4E B2RXH2 1/20 0.37
POLB P06746 1/20 0.37
RECQL P46063 1/20 0.37
PMP22 Q01453 1/20 0.37
NPSR1 Q6W5P4 1/20 0.37
HRH3 Q9Y5N1 7/20 0.37
TAAR1 Q96RJ0 2/20 0.37
HRH4 Q9H3N8 5/20 0.36
HRH2 P25021 4/20 0.36
HRH1 P35367 2/20 0.36
CYP3A4 P08684 1/20 0.36
IDO1 P14902 1/20 0.36
LMNA P02545 1/20 0.36
MIF P14174 1/20 0.36
TSHR P16473 1/20 0.36
APEX1 P27695 1/20 0.34
SMN1; SMN2 Q16637 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10934277 0.78
SCHEMBL9601465 0.78
SCHEMBL5720505 0.74 ALDH1A1 (0.37) ALDH1A1FKBP5PKMKDM4EPOLB
SCHEMBL5720429 0.72 PKM (0.37) ALDH1A1FKBP5PKMKDM4EPOLB
SCHEMBL5447913 0.69 TAAR1 (0.46) HRH3TAAR1HRH4CYP3A4IDO1
SCHEMBL7285552 0.69
SCHEMBL4683083 0.65 HRH3 (0.35) ALDH1A1PKMNPSR1HRH3HRH4
SCHEMBL8429888 0.65 HRH3 (0.38) ALDH1A1FKBP5PKMHRH3HRH4
SCHEMBL7194641 0.65 IDO1 (0.59) ALDH1A1FKBP5POLBHRH3CYP3A4
SCHEMBL27797065 0.63

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6607653-B1 Tin-copper alloy plating bath, tin-copper-bismuth alloy plating bath or tin-copper-silver alloy plating bath containing a soluble metal compound and a specific sulfur-containing compound. The plating bath of the alloy with DAIWA FINE CHEMICALS CO., LTD. (JP) 2003-08-19 US disclosed