Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 10/20 | 0.63 |
| ▸ | GAA | P10253 | 7/20 | 0.63 |
| ▸ | MEN1 | O00255 | 5/20 | 0.63 |
| ▸ | KMT2A | Q03164 | 5/20 | 0.63 |
| ▸ | MAPT | P10636 | 5/20 | 0.63 |
| ▸ | SMN1; SMN2 | Q16637 | 4/20 | 0.63 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.63 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.63 |
| ▸ | RECQL | P46063 | 2/20 | 0.63 |
| ▸ | THRB | P10828 | 2/20 | 0.63 |
| ▸ | BLM | P54132 | 1/20 | 0.63 |
| ▸ | MCL1 | Q07820 | 1/20 | 0.63 |
| ▸ | NR4A1 | P22736 | 1/20 | 0.58 |
| ▸ | HSD17B10 | Q99714 | 4/20 | 0.48 |
| ▸ | ALOX15 | P16050 | 3/20 | 0.48 |
| ▸ | ALOX12 | P18054 | 3/20 | 0.48 |
| ▸ | HPGD | P15428 | 2/20 | 0.48 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.48 |
| ▸ | MITF | O75030 | 1/20 | 0.46 |
| ▸ | GFER | P55789 | 1/20 | 0.46 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29464083 | 1.00 | ALDH1A1 (0.63) | ALDH1A1GAAMEN1KMT2AMAPT | |
| SCHEMBL17267881 | 1.00 | ALDH1A1 (0.63) | ALDH1A1GAAMEN1KMT2AMAPT | |
| SCHEMBL335539 | 0.98 | ALDH1A1 (0.65) | ALDH1A1GAAMEN1KMT2AMAPT | |
| SCHEMBL29935746 | 0.98 | ALDH1A1 (0.65) | ALDH1A1GAAMEN1KMT2AMAPT | |
| SCHEMBL29462465 | 0.98 | ALDH1A1 (0.65) | ALDH1A1GAAMEN1KMT2AMAPT | |
| SCHEMBL6853379 | 0.94 | ALDH1A1 (0.57) | ALDH1A1GAAMEN1KMT2AMAPT | |
| SCHEMBL564763 | 0.94 | ALDH1A1 (0.58) | ALDH1A1GAAMEN1KMT2AMAPT | |
| SCHEMBL564984 | 0.94 | MEN1 (0.58) | ALDH1A1GAAMEN1KMT2AMAPT | |
| SCHEMBL565006 | 0.92 | MEN1 (0.55) | ALDH1A1GAAMEN1KMT2AMAPT | |
| Hydrochloric Acid SCHEMBL8352006 | 0.90 | MEN1 (0.58) | ALDH1A1GAAMEN1KMT2AMAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 63 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9975996-B2 | Positive photosensitive resin composition and polyhydroxyamide resin | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2018-05-22 | — | — | US | claimed |
| US-20160185905-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND POLYHYDROXYAMIDE RESIN | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2016-06-30 | — | — | US | claimed |
| US-6875554-B2 | Positive photosensitive polyimide resin composition | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2005-04-05 | — | — | US | claimed |
| US-20260104641-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-04-16 | — | — | US | disclosed |
| EP-4660704-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2025-12-10 | — | — | EP | disclosed |
| US-20250355350-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-11-20 | — | — | US | disclosed |
| EP-4650874-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-11-19 | — | — | EP | disclosed |
| EP-4636485-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2025-10-22 | — | — | EP | disclosed |
| EP-4636011-A1 | POLYMER, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-10-22 | — | — | EP | disclosed |
| EP-4553100-A1 | POLYMER, POSITIVE AND NEGATIVE PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-05-14 | — | — | EP | disclosed |
| US-20250147420-A1 | Polymer, Positive And Negative Photosensitive Resin Compositions, Patterning Process, Method For Forming Cured Film, Interlayer Insulating Film, Surface Protective Film, And Electronic Component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-05-08 | — | — | US | disclosed |
| EP-1431822-A1 | POSITIVE PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION | Nissan Chemical Industries, Ltd. (JP) | 2004-06-23 | — | — | EP | disclosed |
| US-20040062969-A1 | Polybenzazole compound having sulfo group and/or phosphono group, resin composition containing the same, molded resin, slid polymer electrolyte film, solid electrolyte film/electrode catalyst layer composite, and process for producing the composite | TOYO BOSEKI KABUSHIKI KAISHA (JP) | 2004-04-01 | — | — | US | disclosed |
| US-6677099-B1 | POLYAMIDEIMIDE DEVELOPED BY AN AQUEOUS ALKALINE SOLUTION AND WHICH IS EXCELLENT IN THE DEVELOPABILITY AND THE ADHESION TO A SUBSTRATE | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2004-01-13 | — | — | US | disclosed |
| EP-1354907-A1 | POLYBENZAZOLE COMPOUND HAVING SULFO GROUP AND/OR PHOSPHONO GROUP, RESIN COMPOSITION CONTAINING THE SAME, MOLDED RESIN, SOLID POLYMER ELECTROLYTE FILM, SOLID ELECTROLYTE FILM/ELECTRODE CATALYST LAYER COMPOSITE, AND PROCESS FOR PRODUCING THE COMPOSITE | Toyo Boseki Kabushiki Kaisha (JP) | 2003-10-22 | — | — | EP | disclosed |
| EP-1329769-A1 | POSITIVE PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION | Nissan Chemical Industries, Ltd. (JP) | 2003-07-23 | — | — | EP | disclosed |
| EP-1241527-A1 | POSITIVE TYPE PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION | Nissan Chemical Industries, Ltd. (JP) | 2002-09-18 | — | — | EP | disclosed |
| EP-0424940-B1 | Positive photosensitive polyimide resin composition | NISSAN CHEMICAL IND LTD (JP) | 1998-01-14 | — | — | EP | disclosed |
| US-5288588-A | Containing diamine substituted with phenolic hydroxyl, carboxyl, thiophenol and/or sulfonic groups | NISSAN CHEMICAL INDUSTRIES LTD. (JP) | 1994-02-22 | — | — | US | disclosed |
| EP-0424940-A2 | Positive photosensitive polyimide resin composition | NISSAN CHEMICAL INDUSTRIES LTD. (JP) | 1991-05-02 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20260104641-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | ARCN1, PRDM9, LBR | ALDH1A1 3706/4885GAA 4327/4885MEN1 4037/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.