SCHEMBL7203635

SCHEMBL7203635

C1CSCCSCCNCCSCCSC1

nearest known ligand 0.35

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
CXCR4 P61073 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.33
ALDH1A1 P00352 1/20 0.33
HIF1A Q16665 1/20 0.31
MAPT P10636 1/20 0.31
PDE4A P27815 1/20 0.31
KDR P35968 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17119216 0.90 CXCR4 (0.47) CXCR4SMN1; SMN2ALDH1A1
SCHEMBL19621386 0.89 HIF1A (0.39) CXCR4SMN1; SMN2ALDH1A1HIF1AMAPT
Thiomorpholine SCHEMBL27610943 0.89 HIF1A (0.39) CXCR4SMN1; SMN2ALDH1A1HIF1AMAPT
SCHEMBL9994097 0.89 HIF1A (0.39) CXCR4SMN1; SMN2ALDH1A1HIF1AMAPT
SCHEMBL15668579 0.89 HIF1A (0.39) CXCR4SMN1; SMN2ALDH1A1HIF1AMAPT
SCHEMBL1615244 0.89 HIF1A (0.39) CXCR4SMN1; SMN2ALDH1A1HIF1AMAPT
SCHEMBL12100700 0.87
SCHEMBL11392517 0.87 ALDH1A1 (0.41) CXCR4SMN1; SMN2ALDH1A1HIF1AMAPT
SCHEMBL138572 0.87
SCHEMBL12882833 0.87 CXCR4 (0.41) CXCR4SMN1; SMN2ALDH1A1HIF1AMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113150572-B Prepreg for asphalt waterproof coiled material and preparation method thereof 科顺防水科技股份有限公司 2022-05-31 CN claimed
CN-113150572-B Prepreg for asphalt waterproof coiled material and preparation method thereof 科顺防水科技股份有限公司 2022-05-31 CN disclosed
CN-113150572-A Prepreg for asphalt waterproof coiled material and preparation method thereof 科顺防水科技股份有限公司 2021-07-23 CN disclosed
US-6607653-B1 Tin-copper alloy plating bath, tin-copper-bismuth alloy plating bath or tin-copper-silver alloy plating bath containing a soluble metal compound and a specific sulfur-containing compound. The plating bath of the alloy with DAIWA FINE CHEMICALS CO., LTD. (JP) 2003-08-19 US disclosed