SCHEMBL7205313

SCHEMBL7205313

c1ccc2nc(SSc3cnc4ccccc4n3)cnc2c1

nearest known ligand 0.64

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HPGD P15428 2/20 0.64
HTT P42858 2/20 0.64
SMN1; SMN2 Q16637 5/20 0.56
NPC1 O15118 4/20 0.56
RAB9A P51151 4/20 0.56
KDM4E B2RXH2 2/20 0.55
GAA P10253 1/20 0.55
NPSR1 Q6W5P4 1/20 0.51
RXFP1 Q9HBX9 1/20 0.51
PDE10A Q9Y233 1/20 0.50
GPR3 P46089 1/20 0.46
MAPT P10636 3/20 0.46
ALDH1A1 P00352 3/20 0.45
ALOX15 P16050 1/20 0.45
HSD17B10 Q99714 1/20 0.45
KMT2A Q03164 2/20 0.45
LMNA P02545 1/20 0.45
POLB P06746 1/20 0.45
ADORA3 P0DMS8 1/20 0.44
ADORA2A P29274 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29163011 0.82 HTT (0.60) HPGDHTTSMN1; SMN2NPC1RAB9A
SCHEMBL13768213 0.82 HPGD (0.60) HPGDHTTSMN1; SMN2NPC1RAB9A
SCHEMBL30129312 0.79 HPGD (1.00) HPGDHTTSMN1; SMN2NPC1RAB9A
SCHEMBL14805655 0.77 HPGD (0.55) HPGDHTTSMN1; SMN2NPC1RAB9A
SCHEMBL10988973 0.77 HPGD (0.55) HPGDHTTSMN1; SMN2NPC1RAB9A
SCHEMBL18796102 0.74 HTT (0.61) HPGDHTTSMN1; SMN2NPC1RAB9A
SCHEMBL11269801 0.74 HPGD (0.51) HPGDHTTSMN1; SMN2NPC1RAB9A
SCHEMBL5188972 0.73 KDM4E (0.51) HPGDHTTSMN1; SMN2NPC1RAB9A
SCHEMBL12990926 0.73 KDM4E (0.59) HPGDHTTSMN1; SMN2NPC1RAB9A
SCHEMBL18239245 0.73 KDM4E (0.55) HPGDHTTSMN1; SMN2NPC1RAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11939691-B2 Tin or tin alloy electroplating bath, and electronic component having electrodeposit formed thereon using the plating bath ISHIHARA CHEMICAL CO., LTD. (JP) 2024-03-26 US disclosed
US-6607653-B1 Tin-copper alloy plating bath, tin-copper-bismuth alloy plating bath or tin-copper-silver alloy plating bath containing a soluble metal compound and a specific sulfur-containing compound. The plating bath of the alloy with DAIWA FINE CHEMICALS CO., LTD. (JP) 2003-08-19 US disclosed
US-3937718-A CARBOXYLIC ACIDS, ALCOHOLS, TERTIERY PHOSPHINES, DISULFIDES, SULFENIC ACID ESTER SANKYO COMPANY LIMITED (JA) 1976-02-10 US disclosed