SCHEMBL7206604

SCHEMBL7206604

Clc1cccc(SSSSc2cccc(Cl)n2)n1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP1A2 P05177 4/20 0.46
MEN1 O00255 3/20 0.46
KMT2A Q03164 3/20 0.46
CYP3A4 P08684 3/20 0.41
TSHR P16473 2/20 0.41
ALDH1A1 P00352 5/20 0.36
L3MBTL1 Q9Y468 2/20 0.34
HTR3E A5X5Y0 3/20 0.33
HTR3B O95264 3/20 0.33
HTR3A P46098 3/20 0.33
HTR3D Q70Z44 3/20 0.33
HTR3C Q8WXA8 3/20 0.33
NFE2L2 Q16236 1/20 0.33
CYP2C19 P33261 2/20 0.32
CYP2C9 P11712 1/20 0.32
HPGD P15428 1/20 0.32
ALOX12 P18054 1/20 0.32
HIF1A Q16665 1/20 0.32
HSD17B10 Q99714 1/20 0.32
TDP1 Q9NUW8 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21572414 0.78
SCHEMBL22863027 0.76
SCHEMBL845552 0.76
SCHEMBL11149965 0.76 L3MBTL1 (0.44) CYP1A2MEN1KMT2ACYP3A4TSHR
SCHEMBL58195 0.73
SCHEMBL1619947 0.71 MEN1 (0.56) CYP1A2MEN1KMT2AALDH1A1L3MBTL1
SCHEMBL11684703 0.71 MAPT (0.59) CYP1A2MEN1KMT2ACYP3A4TSHR
SCHEMBL11149234 0.71 CYP1A2 (0.46) CYP1A2MEN1KMT2ACYP3A4TSHR
SCHEMBL2131248 0.71 MEN1 (0.42) CYP1A2MEN1KMT2ACYP3A4TSHR
SCHEMBL12879681 0.71 KMT2A (0.42) CYP1A2MEN1KMT2ACYP3A4TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11939691-B2 Tin or tin alloy electroplating bath, and electronic component having electrodeposit formed thereon using the plating bath ISHIHARA CHEMICAL CO., LTD. (JP) 2024-03-26 US disclosed
US-6607653-B1 Tin-copper alloy plating bath, tin-copper-bismuth alloy plating bath or tin-copper-silver alloy plating bath containing a soluble metal compound and a specific sulfur-containing compound. The plating bath of the alloy with DAIWA FINE CHEMICALS CO., LTD. (JP) 2003-08-19 US disclosed