SCHEMBL7207052

SCHEMBL7207052

c1ccc(SSc2ccc3ccccc3n2)nc1

nearest known ligand 0.63

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
EHMT2 Q96KQ7 1/20 0.63
EHMT1 Q9H9B1 1/20 0.63
APOBEC3G Q9HC16 1/20 0.63
ALDH1A1 P00352 4/20 0.47
GRM5 P41594 1/20 0.46
KCNH2 Q12809 1/20 0.46
KDM4E B2RXH2 5/20 0.44
RXFP1 Q9HBX9 5/20 0.44
PRNP P04156 4/20 0.44
RAB9A P51151 5/20 0.41
NPSR1 Q6W5P4 4/20 0.41
NPC1 O15118 4/20 0.41
MAPK10 P53779 2/20 0.41
TP53 P04637 2/20 0.41
HPGD P15428 2/20 0.41
SMN1; SMN2 Q16637 2/20 0.41
HTT P42858 1/20 0.41
HSD17B10 Q99714 1/20 0.41
L3MBTL1 Q9Y468 1/20 0.41
ATG4B Q9Y4P1 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2098479 0.86 RXFP1 (0.53) ALDH1A1KDM4ERXFP1PRNPRAB9A
SCHEMBL7204328 0.80 APOBEC3G (0.81) EHMT2EHMT1APOBEC3GALDH1A1KDM4E
SCHEMBL7208721 0.80 APOBEC3G (0.81) EHMT2EHMT1APOBEC3GALDH1A1KDM4E
SCHEMBL21174 0.79 EHMT2 (1.00) EHMT2EHMT1APOBEC3GALDH1A1KDM4E
SCHEMBL29349787 0.79 EHMT2 (1.00) EHMT2EHMT1APOBEC3GALDH1A1KDM4E
SCHEMBL27972393 0.79 EHMT2 (1.00) EHMT2EHMT1APOBEC3GALDH1A1KDM4E
Pyrimidine SCHEMBL6822462 0.79 RXFP1 (0.45) ALDH1A1KDM4ERXFP1PRNPRAB9A
SCHEMBL11326601 0.78 RXFP1 (0.50) ALDH1A1KDM4ERXFP1PRNPRAB9A
Ammonia Solution, Strong SCHEMBL421495 0.77 EHMT2 (0.94) EHMT2EHMT1APOBEC3GALDH1A1KDM4E
Hydrochloric Acid SCHEMBL10707236 0.77 EHMT2 (0.94) EHMT2EHMT1APOBEC3GALDH1A1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11939691-B2 Tin or tin alloy electroplating bath, and electronic component having electrodeposit formed thereon using the plating bath ISHIHARA CHEMICAL CO., LTD. (JP) 2024-03-26 US disclosed
US-6607653-B1 Tin-copper alloy plating bath, tin-copper-bismuth alloy plating bath or tin-copper-silver alloy plating bath containing a soluble metal compound and a specific sulfur-containing compound. The plating bath of the alloy with DAIWA FINE CHEMICALS CO., LTD. (JP) 2003-08-19 US disclosed