SCHEMBL7207055

SCHEMBL7207055

c1ccc(-c2cc3ccccc3nc2SSc2nc3ccccc3cc2-c2ccccn2)nc1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 8/20 0.44
SMN1; SMN2 Q16637 6/20 0.44
NPC1 O15118 6/20 0.44
TP53 P04637 5/20 0.44
RAB9A P51151 5/20 0.44
ALDH1A1 P00352 4/20 0.44
TSHR P16473 2/20 0.44
HSD17B10 Q99714 2/20 0.44
LMNA P02545 4/20 0.42
CCR1 P32246 3/20 0.42
CCR5 P51681 3/20 0.42
CCR8 P51685 3/20 0.42
METAP1 P53582 3/20 0.42
CYP1A2 P05177 2/20 0.42
POLB P06746 1/20 0.42
BLM P54132 1/20 0.42
HIF1A Q16665 1/20 0.42
DOHH Q9BU89 1/20 0.42
P4HTM Q9NXG6 1/20 0.42
HPGD P15428 4/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27205058 0.87 KDM4E (0.41) KDM4ESMN1; SMN2NPC1TP53RAB9A
SCHEMBL28765720 0.79 KDM4E (0.56) KDM4ESMN1; SMN2NPC1TP53RAB9A
SCHEMBL28962070 0.78 NPC1 (0.53) KDM4ESMN1; SMN2NPC1TP53RAB9A
SCHEMBL8915214 0.78 KDM4E (0.50) KDM4ESMN1; SMN2NPC1TP53RAB9A
Acridine SCHEMBL28454794 0.74 ALDH1A1 (0.62) KDM4ESMN1; SMN2NPC1TP53RAB9A
SCHEMBL29982775 0.74 BTK (0.51) KDM4ESMN1; SMN2NPC1TP53RAB9A
SCHEMBL30161832 0.74 BTK (0.51) KDM4ESMN1; SMN2NPC1TP53RAB9A
SCHEMBL30271293 0.73 KDM4E (0.50) KDM4ESMN1; SMN2NPC1TP53RAB9A
SCHEMBL10336899 0.73 KDM4E (0.50) KDM4ESMN1; SMN2NPC1TP53RAB9A
SCHEMBL31556386 0.73 KDM4E (0.50) KDM4ESMN1; SMN2ALDH1A1MAPTCYP2C9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6607653-B1 Tin-copper alloy plating bath, tin-copper-bismuth alloy plating bath or tin-copper-silver alloy plating bath containing a soluble metal compound and a specific sulfur-containing compound. The plating bath of the alloy with DAIWA FINE CHEMICALS CO., LTD. (JP) 2003-08-19 US disclosed