SCHEMBL721404

SCHEMBL721404

Nc1ccc(Oc2ccccc2C(c2ccccc2Oc2ccc(N)cc2)(C(F)(F)F)C(F)(F)F)cc1

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NCOA1 Q15788 1/20 0.49
NCOA3 Q9Y6Q9 1/20 0.49
MAOA P21397 2/20 0.47
ALDH1A1 P00352 7/20 0.43
TDP1 Q9NUW8 2/20 0.43
CYP3A4 P08684 1/20 0.43
TSHR P16473 1/20 0.43
MAPT P10636 4/20 0.40
MEN1 O00255 3/20 0.40
KMT2A Q03164 3/20 0.40
SMN1; SMN2 Q16637 2/20 0.40
GAA P10253 2/20 0.40
MITF O75030 1/20 0.40
GFER P55789 1/20 0.40
NLRP1 Q9C000 1/20 0.40
NOD2 Q9HC29 1/20 0.40
LTA4H P09960 1/20 0.40
PTGS2 P35354 1/20 0.40
NPC1 O15118 2/20 0.40
RAB9A P51151 2/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7218477 0.92 NCOA1 (0.43) NCOA1NCOA3MAOAALDH1A1TDP1
SCHEMBL10390912 0.91 MAOA (0.46) NCOA1NCOA3MAOAALDH1A1TDP1
SCHEMBL1683859 0.90 MAOB (0.50) NCOA1NCOA3MAOAALDH1A1TDP1
SCHEMBL8761225 0.89 NCOA1 (0.40) NCOA1NCOA3MAOAALDH1A1TDP1
SCHEMBL8762166 0.87 NCOA1 (0.39) NCOA1NCOA3MAOAALDH1A1TDP1
SCHEMBL8762685 0.87 NCOA1 (0.39) NCOA1NCOA3MAOAALDH1A1TDP1
SCHEMBL10391880 0.87 MAOA (0.46) NCOA1NCOA3MAOAALDH1A1TDP1
SCHEMBL28956109 0.86 NCOA1 (0.38) NCOA1NCOA3MAOAALDH1A1TDP1
SCHEMBL8762371 0.86 AR (0.39) NCOA1NCOA3MAOAALDH1A1TDP1
SCHEMBL28956106 0.86 NCOA1 (0.38) NCOA1NCOA3MAOAALDH1A1TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 319 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114929474-B Flexible metal-clad laminate with microstrip line structure 株式会社钟化 2025-01-07 CN claimed
CN-117327276-A Micro-crosslinking type transparent polyimide film and preparation method thereof 中国科学院化学研究所 2024-01-02 CN claimed
CN-114379176-B Low-dielectric polyimide composite sheet and preparation method thereof 哈尔滨工程大学 2023-08-22 CN claimed
CN-114716825-B Polyimide composite material and preparation and application thereof 中国地质大学(北京) 2023-04-18 CN claimed
CN-111918907-B Polyimide film for preparing flexible metal foil laminate and flexible metal foil laminate comprising same 聚酰亚胺先端材料有限公司 2023-04-04 CN claimed
CN-113072702-B Colorless transparent copolymerized polyimide film and preparation method thereof 上海大学(浙江·嘉兴)新兴产业研究院 2023-03-10 CN claimed
CN-113347783-B Adhesive-free single-sided board, preparation method thereof and adhesive-free double-sided board comprising same 广东生益科技股份有限公司 2023-02-28 CN claimed
CN-114907567-B Negative photosensitive polyimide composition capable of being developed by alkali liquor 广东工业大学 2023-02-21 CN claimed
CN-115201284-A Capacitive humidity sensor and preparation method thereof 广州奥松电子股份有限公司 2022-10-18 CN claimed
CN-115201283-A High-temperature-resistant high-humidity-resistant humidity sensor and preparation method thereof 广州奥松电子股份有限公司 2022-10-18 CN claimed
CN-111057237-A Polyimide microsphere and preparation method thereof 华南理工大学 2020-04-24 CN claimed
EP-3335224-B1 PASTE AND PROCESS FOR FORMING A SOLDERABLE POLYIMIDE BASED POLYMER THICK FILM CONDUCTOR DU PONT (US) 2019-06-12 EP claimed
US-20180236408-A1 A PREPARATION METHOD FOR TRIPTYL POLYMER SEPARATION MEMBRANE NANJING TECH UNIVERSITY (CN) 2018-08-23 US claimed
EP-3323500-A1 MANUFACTURING METHOD FOR TRIPTYCENE POLYMER CARRIER FILM Nanjing Tech University (CN) 2018-05-23 EP claimed
US-20170043435-A1 PASTE AND PROCESS FOR FORMING A SOLDERABLE POLYIMIDE-BASED POLYMER THICK FILM CONDUCTOR MICROMAX (US) HOLDINGS LLC 2017-02-16 US claimed
US-20170044382-A1 PROCESS FOR FORMING A SOLDERABLE POLYIMIDE-BASED POLYMER THICK FILM CONDUCTOR DU PONT (US) 2017-02-16 US claimed
US-20150228374-A1 THERMALLY CONDUCTIVE ELECTRONIC SUBSTRATES AND METHODS RELATING THERETO E. I. DU PONT DE NEMOURS AND COMPANY 2015-08-13 US claimed
EP-1326138-B1 NEGATIVE PHOTOSENSITIVE POLYIMIDE COMPOSITION AND METHOD OF FORMING IMAGE FROM THE SAME PI R & D CO LTD (JP) 2014-11-05 EP claimed
US-6627377-B1 Soluble in organic solvents, which excels in adhesiveness, heat resistance, mechanical properties and flexibility, which shows properties of alkali-soluble highly sensitive positive-type photoresist PI R&D CO., LTD. (JP) 2003-09-30 US claimed
EP-1024407-A1 POSITIVE PHOTOSENSITIVE POLYIMIDE COMPOSITION PI R & D Co Ltd (JP) 2000-08-02 EP claimed