SCHEMBL724249

SCHEMBL724249

Cn1cc(-c2ccccc2)nc1-c1ccccc1

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PDE3B Q13370 1/20 0.55
PDE3A Q14432 1/20 0.55
KDM4E B2RXH2 8/20 0.49
ALDH1A1 P00352 7/20 0.49
SMN1; SMN2 Q16637 6/20 0.49
NPC1 O15118 6/20 0.49
RAB9A P51151 6/20 0.49
HPGD P15428 5/20 0.49
TP53 P04637 4/20 0.49
HSD17B10 Q99714 4/20 0.49
TSHR P16473 3/20 0.49
PKM P14618 3/20 0.49
KMT2A Q03164 2/20 0.49
CDK5 Q00535 1/20 0.49
CDK5R1 Q15078 1/20 0.49
MAPT P10636 3/20 0.47
CASP1 P29466 1/20 0.47
CASP7 P55210 1/20 0.47
NPSR1 Q6W5P4 1/20 0.47
LMNA P02545 2/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17279787 0.90 PDE3B (0.48) PDE3BPDE3AKDM4EALDH1A1SMN1; SMN2
SCHEMBL2834854 0.87 PDE3B (0.49) PDE3BPDE3AKDM4EALDH1A1SMN1; SMN2
SCHEMBL6272208 0.84 PDE10A (0.49) PDE3BPDE3AKDM4EALDH1A1RAB9A
SCHEMBL2843366 0.84 HPGDS (0.54) PDE3BPDE3ASMN1; SMN2NPC1RAB9A
SCHEMBL1303977 0.84 PTGS2 (0.63) PDE3BPDE3AKDM4EALDH1A1KMT2A
SCHEMBL8830111 0.83 KDM4E (0.49) KDM4EALDH1A1SMN1; SMN2NPC1RAB9A
SCHEMBL15305295 0.82 PDE3B (0.48) PDE3BPDE3AKDM4EALDH1A1SMN1; SMN2
SCHEMBL10099635 0.81 NR1H3 (0.47) PDE3BPDE3ASMN1; SMN2NPC1RAB9A
SCHEMBL6468885 0.81 SMN1; SMN2 (0.45) PDE3BPDE3AKDM4EALDH1A1SMN1; SMN2
SCHEMBL19529677 0.80 PTGS1 (0.61) PDE3BPDE3AKDM4EALDH1A1SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 56 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025106697-A1 BIO-BASED COMPOSITIONS FOR PHOTORESISTS AND PATTERNING HUSTAD PHILLIP DENE (US) 2025-05-22 WO disclosed
US-20250068079-A1 BIO-BASED SOLVENTS FOR NEGATIVE TONE DEVELOPMENT HUSTAD PHILLIP DENE (US) 2025-02-27 US disclosed
CN-119173819-A Bio-based solvent for negative imaging 菲利普·德内·于斯塔德 2024-12-20 CN disclosed
WO-2024107979-A1 BIO-BASED SOLVENTS FOR NEGATIVE TONE DEVELOPMENT HUSTAD PHILLIP DENE (US) 2024-05-23 WO disclosed
EP-2439070-B1 Infrared-sensitive positive-working image forming material, planographic printing plate precursor, and method for manufacturing a planographic printing plate FUJIFILM CORP (JP) 2019-07-17 EP disclosed
EP-2387735-B1 NONPOLYMERIC BINDERS FOR SEMICONDUCTOR SUBSTRATE COATINGS FUJIFILM ELECTRONIC MAT USA INC (US) 2019-03-13 EP disclosed
US-9040219-B2 Image forming material, planographic printing plate precursor, and method for manufacturing a planographic printing plate FUJIFILM CORPORATION (JP) 2015-05-26 US disclosed
US-9034557-B2 Chemically amplified positive photoresist composition FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2015-05-19 US disclosed
US-8535872-B2 Thermally cured underlayer for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2013-09-17 US disclosed
US-20120178871-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION DE BINOD B (US) 2012-07-12 US disclosed
US-20030134221-A1 Positive resist composition FUJI PHOTO FILM CO., LTD. 2003-07-17 US disclosed
US-6537718-B2 Compounds generate an acid upon irradiation with actinic rays FUJI PHOTO FILM CO., LTD. (JP) 2003-03-25 US disclosed
US-20020172886-A1 Positive photoresist composition FUJI PHOTO FILM CO., LTD. 2002-11-21 US disclosed
US-6376152-B2 MIXTURE OF A COMPOUND WHICH GENERATES AN ACID UPON RADIATION, RESIN AND NITROGEN-CONTAINING COMPOUND FUJI PHOTO FILM CO., LTD. (JP) 2002-04-23 US disclosed
US-20020028409-A1 Positive resist laminate FUJI PHOTO FILM CO., LTD. 2002-03-07 US disclosed
US-20020012866-A1 Positive photoresist composition FUJIFILM CORPORATION (JP) 2002-01-31 US disclosed
US-20010021479-A1 Positive photoresist composition FUJIFILM CORPORATION (JP) 2001-09-13 US disclosed
US-20010008739-A1 Positive photoresist composition for exposure to far ultraviolet ray FUJIFILM CORPORATION (JP) 2001-07-19 US disclosed
US-6207343-B1 RESIN CONTAINING GROUPS WHICH DECOMPOSE BY THE ACTION OF AN ACID TO ENHANCE ITS SOLUBILITY IN AN ALKALINE DEVELOPING SOLUTION AND A COMPOUND WHICH GENERATES AN ACID UPON IRRADIATION WITH ACTINIC RAYS OR RADIATION FUJI PHOTO FILM CO., LTD. (JP) 2001-03-27 US disclosed
EP-0190457-A1 Derivatives of 3-methyl-imidazo [4,5-c]pyrazole having therapeutic activity and a process for the preparation theref CAMILLO CORVI S.p.A. (IT) 1986-08-13 EP disclosed