Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3288566 | 0.79 | FFAR3 (0.36) | CD81 | |
| SCHEMBL4631289 | 0.78 | ALDH1A1 (0.32) | — | |
| SCHEMBL16499878 | 0.77 | CD81 (0.32) | CD81 | |
| SCHEMBL16499876 | 0.77 | CD81 (0.32) | CD81 | |
| SCHEMBL1271391 | 0.76 | PTGS1 (0.34) | CD81 | |
| SCHEMBL5897818 | 0.76 | PTGS1 (0.34) | CD81 | |
| SCHEMBL3287496 | 0.76 | PTGS1 (0.34) | CD81 | |
| SCHEMBL1074553 | 0.75 | PTGS1 (0.32) | — | |
| SCHEMBL3292362 | 0.74 | PTGS1 (0.33) | CD81 | |
| SCHEMBL3291244 | 0.74 | PTGS1 (0.33) | CD81 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 50 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12443101-B2 | Cured coating film | TAIYO HOLDINGS CO., LTD. (JP) | 2025-10-14 | — | — | US | disclosed |
| US-12313973-B2 | Insulating layer for multilayer printed circuit board, multilayer printed circuit board comprising same, and method for producing same | LG CHEM, LTD. (KR) | 2025-05-27 | — | — | US | disclosed |
| EP-4502077-A1 | CURED PRODUCT, PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, AND PRINTED WIRING BOARD | TAIYO HOLDINGS CO., LTD. (JP) | 2025-02-05 | — | — | EP | disclosed |
| US-12043754-B2 | Two-component type curable resin composition, product, dry film, cured product, and printed wiring board | TAIYO HOLDINGS CO., LTD. (JP) | 2024-07-23 | — | — | US | disclosed |
| CN-114729215-B | Curable composition for inkjet, cured product, and flexible printed circuit board | 律胜科技股份有限公司 | 2023-11-10 | — | — | CN | disclosed |
| US-20220390844-A1 | CURED COATING FILM | TAIYO INK MFG. CO., LTD. (JP) | 2022-12-08 | — | — | US | disclosed |
| US-20220325126-A1 | INSULATING FILM FOR ELECTRONIC COMPONENTS AND METHOD OF PRODUCING INSULATING FILM FOR ELECTRONIC COMPONENTS | TAIYO INK MFG. CO., LTD. (JP) | 2022-10-13 | — | — | US | disclosed |
| US-20220325128-A1 | TWO-COMPONENT TYPE CURABLE RESIN COMPOSITION, PRODUCT, DRY FILM, CURED PRODUCT, AND PRINTED WIRING BOARD | TAIYO INK MFG. CO., LTD. (JP) | 2022-10-13 | — | — | US | disclosed |
| US-20220279663-A1 | INSULATING LAYER FOR MULTILAYER PRINTED CIRCUIT BOARD, MULTILAYER PRINTED CIRCUIT BOARD COMPRISING SAME, AND METHOD FOR PRODUCING SAME | LG CHEM, LTD. (KR) | 2022-09-01 | — | — | US | disclosed |
| US-11361878-B2 | Method for manufacturing insulating film and semiconductor package | LG CHEM, LTD. (KR) | 2022-06-14 | — | — | US | disclosed |
| US-20120125672-A1 | PHOTOCURABLE RESIN COMPOSITION | TAIYO HOLDINGS CO., LTD. (JP) | 2012-05-24 | — | — | US | disclosed |
| US-20120111620-A1 | PHOTOCURABLE RESIN COMPOSITION | TAIYO HOLDINGS CO., LTD. (JP) | 2012-05-10 | — | — | US | disclosed |
| US-20120070780-A1 | PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM SOLDER RESIST, AND CIRCUIT BOARD | LG CHEM, LTD. (KR) | 2012-03-22 | — | — | US | disclosed |
| US-20120048594-A1 | PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE FILM, PHOTOSENSITIVE LAMINATE, METHOD OF FORMING A PERMANENT PATTERN, AND PRINTED BOARD | FUJIFILM CORPORATION (JP) | 2012-03-01 | — | — | US | disclosed |
| US-20110091811-A1 | DOUBLE-LAYERED PATTERNABLE ADHESIVE FILM, METHOD OF FORMING THE SAME, AND METHOD OF FORMING PATTERNABLE ADHESIVE LAYER USING THE SAME | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2011-04-21 | — | — | US | disclosed |
| US-20100112474-A1 | PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE FILM, METHOD FOR FORMING A PERMANENT PATTERN, AND PRINTED BOARD | FUJIFILM CORPORATION (JP) | 2010-05-06 | — | — | US | disclosed |
| US-20080268374-A1 | Photosensitive Composition, Pattern Forming Material, Photosensitive Laminate, Pattern Forming Apparatus, and Pattern Forming Process | FUJIFILM CORPORATION (JP) | 2008-10-30 | — | — | US | disclosed |
| EP-1780599-A1 | PHOTOSENSITIVE COMPOSITION, PATTERN FORMING MATERIAL, PHOTOSENSITIVE LAMINATE, PATTERN FORMING APPARATUS AND METHOD OF PATTERN FORMATION | FUJIFILM Corporation (JP) | 2007-05-02 | — | — | EP | disclosed |
| WO-2006004171-A1 | PHOTOSENSITIVE FILM, PROCESS FOR PRODUCING THE SAME, PROCESS FOR FORMING PERMANENT PATTERN | FUJI PHOTO FILM CO., LTD. (JP) | 2006-01-12 | — | — | WO | disclosed |
| WO-2005093793-A1 | PROCESS FOR FORMING PERMANENT PATTERN | FUJI PHOTO FILM CO., LTD. (JP) | 2005-10-06 | — | — | WO | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20220279663-A1 | INSULATING LAYER FOR MULTILAYER PRINTED CIRCUIT BOARD, MULTILAYER PRINTED CIRCUIT BOARD COMPRISING SAME, AND METHOD FOR PRODUCING SAME | MMAB, BMI1, EZH2 | CD81 1221/4885EPHX1 2808/4885 |
| US-12313973-B2 | Insulating layer for multilayer printed circuit board, multilayer printed circuit board comprising same, and method for producing same | MMAB, BMI1, EZH2 | CD81 1221/4885EPHX1 2808/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.