SCHEMBL730198

SCHEMBL730198

C=C(C)C(=O)OCC(C)OOC(=O)C(=C)C

nearest known ligand 0.68

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
TSHR P16473 4/20 0.68
ALDH1A1 P00352 2/20 0.41
THRB P10828 1/20 0.40
POLB P06746 1/20 0.30
APEX1 P27695 1/20 0.30
HTT P42858 1/20 0.30
TDP1 Q9NUW8 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1905184 0.84 THRB (0.54) TSHRALDH1A1THRBPOLBAPEX1
SCHEMBL9067398 0.84 TSHR (0.61) TSHRALDH1A1THRB
SCHEMBL4331907 0.82 TSHR (0.76) TSHRALDH1A1THRBPOLBAPEX1
SCHEMBL24562 0.81 TSHR (1.00) TSHRALDH1A1THRBPOLBAPEX1
SCHEMBL20718881 0.81 TSHR (0.57) TSHRALDH1A1THRBPOLBAPEX1
SCHEMBL13078882 0.80 TSHR (0.61) TSHRALDH1A1THRB
SCHEMBL761374 0.80 TSHR (0.73) TSHRALDH1A1THRBPOLBAPEX1
SCHEMBL1336820 0.80 TSHR (0.73) TSHRALDH1A1THRBPOLBAPEX1
SCHEMBL160208 0.80 TSHR (0.73) TSHRALDH1A1THRBPOLBAPEX1
SCHEMBL9082422 0.79 TSHR (0.95) TSHRALDH1A1THRBPOLBAPEX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115044096-B Antibacterial polymer composite material 嘉瑞塑胶科技有限公司 2023-08-15 CN claimed
CN-115044096-B Antibacterial polymer composite material 嘉瑞塑胶科技有限公司 2023-08-15 CN disclosed
US-20230001633-A1 METHOD FOR MANUFACTURING THREE-DIMENSIONAL MODELED OBJECT, AND THREE-DIMENSIONAL MODELING DEVICE Konica Minolta, Inc. (JP) 2023-01-05 US disclosed
CN-110194889-B Method for preparing modified thermoplastic plastic and product with microorganism adhesion resistance and composition for preparing modified thermoplastic plastic 嘉丰工业科技(惠州)有限公司 2022-11-15 CN disclosed
US-11390769-B2 Ink jet printing method, primer ink composition, and ink jet ink composition SEIKO EPSON CORPORATION 2022-07-19 US disclosed
US-11329288-B2 Secondary battery negative electrode binder composition, secondary battery negative electrode, and secondary battery MITSUBISHI CHEMICAL CORPORATION (JP) 2022-05-10 US disclosed
US-20200377750-A1 Ink Jet Printing Method, Primer Ink Composition, And Ink Jet Ink Composition SEIKO EPSON CORPORATION (JP) 2020-12-03 US disclosed
EP-2940085-B1 ACRYLIC RESIN EMULSION FOR WATER-BASED INKJET INKS, AND WATER-BASED INKJET INK COMPOSITION PRODUCED USING SAME JAPAN COATING RESIN CORP (JP) 2020-09-02 EP disclosed
US-20200207996-A1 INK JET INK COMPOSITION, INK JET PRINTING METHOD, AND INK JET PRINTING APPARATUS SEIKO EPSON CORPORATION (JP) 2020-07-02 US disclosed
CN-106103604-B Coating compositions and methods for sound and vibration damping and water resistance PPG工业俄亥俄公司 2019-03-22 CN disclosed
US-20120178841-A1 THERMALLY DISAPPEARING RESIN PARTICLE OOMURA TAKAHIRO (JP) 2012-07-12 US disclosed
US-8138252-B2 Hollow polyether particles which decompose at low temperature; nondeforming, noncracking binder for ceramics SEKISUI CHEMICAL CO., LTD. (JP) 2012-03-20 US disclosed
US-8038843-B2 Use of a mineral-material steric dispersing agent in water, aqueous dispersion thus obtained and use thereof in paper making COATEX S.A.S. (FR) 2011-10-18 US disclosed
US-20100314061-A1 USE OF A MINERAL-MATERIAL STERIC DISPERSING AGENT IN WATER, AQUEOUS DISPERSION THUS OBTAINED AND USE THEREOF IN PAPER MAKING COATEX S.A.S. (FR) 2010-12-16 US disclosed
US-7727811-B2 Pressure-sensitive adhesive sheet for processing semiconductor wafer or semiconductor substrate NITTO DENKO CORPORATION (JP) 2010-06-01 US disclosed
US-20080269394-A1 Thermally Disappearing Resin Particle SEKISUI CHEMICAL CO., LTD. (JP) 2008-10-30 US disclosed
EP-1862482-A1 THERMALLY DISAPPEARING RESIN PARTICLE Sekisui Chemical Co., Ltd. (JP) 2007-12-05 EP disclosed
US-20070264498-A1 PRESSURE-SENSITIVE ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR WAFER OR SEMICONDUCTOR SUBSTRATE NITTO DENKO CORPORATION (JP) 2007-11-15 US disclosed
EP-1854856-A1 Pressure-sensitive adhesive sheet for processing semiconductor wafer or semiconductor substrate NITTO DENKO CORPORATION (JP) 2007-11-14 EP disclosed
US-4717738-A HIGH RIGIDITY, MECHANICAL STRENGTH, HEAT RESISTANCE SANYO CHEMICAL INDUSTRIES, LTD. (JP) 1988-01-05 US disclosed