Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL701366 | 0.93 | — | — | |
| SCHEMBL329326 | 0.93 | — | — | |
| SCHEMBL7155635 | 0.80 | — | — | |
| SCHEMBL3891838 | 0.80 | — | — | |
| SCHEMBL1452160 | 0.80 | — | — | |
| SCHEMBL702746 | 0.77 | — | — | |
| SCHEMBL8606533 | 0.72 | — | — | |
| SCHEMBL730610 | 0.71 | — | — | |
| SCHEMBL31248582 | 0.71 | — | — | |
| SCHEMBL9766200 | 0.68 | ALDH1A1 (0.42) | ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6716770-B2 | Vapor deposition using organosilicon compound and fluorohydrocarbon plasma; dielectric | AIR PRODUCTS AND CHEMICALS, INC. | 2004-04-06 | — | — | US | claimed |
| US-20030049460-A1 | Low dielectric constant material and method of processing by CVD | AIR PRODUCTS AND CHEMICALS, INC. | 2003-03-13 | — | — | US | claimed |
| EP-1260606-A2 | Low dielectric constant material and method of processing by cvd | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2002-11-27 | — | — | EP | claimed |
| EP-3231892-B1 | MECHANICAL ENHANCEMENT OF DENSE AND POROUS ORGANOSILICATE MATERIALS BY UV EXPOSURE | VERSUM MAT US LLC (US) | 2020-08-05 | — | — | EP | disclosed |
| EP-3231892-A1 | MECHANICAL ENHANCEMENT OF DENSE AND POROUS ORGANOSILICATE MATERIALS BY UV EXPOSURE | Versum Materials US, LLC (US) | 2017-10-18 | — | — | EP | disclosed |
| EP-1457583-B1 | Mechanical enhancement of dense and porous organosilicate materials by UV exposure | AIR PROD & CHEM (US) | 2017-05-31 | — | — | EP | disclosed |
| EP-1482070-B1 | MECHANICAL ENHANCER ADDITIVES FOR LOW DIELECTRIC FILMS | AIR PROD & CHEM (US) | 2015-11-11 | — | — | EP | disclosed |
| EP-1420439-B1 | Non-thermal process for forming porous low dielectric constant films | AIR PROD & CHEM (US) | 2012-08-29 | — | — | EP | disclosed |
| US-8137764-B2 | organosilicate film formed by plasma-enhanced chemical vapor deposition from a first silicon-containing precursor that comprises from 3 to 4 Si O bonds per Si atom, from 0 to 1 of Si H, Si Br, and Si Cl bonds per Si atom and a second silicon-containing precursor comprises at least one Si C bond per Si | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2012-03-20 | — | — | US | disclosed |
| US-7932188-B2 | Mechanical enhancement of dense and porous organosilicate materials by UV exposure | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2011-04-26 | — | — | US | disclosed |
| EP-2306499-A2 | Non-thermal process for forming porous low dielectric constant films | Air Products and Chemicals, Inc. (US) | 2011-04-06 | — | — | EP | disclosed |
| US-20040175957-A1 | Mechanical enhancement of dense and porous organosilicate materials by UV exposure | VERSUM MATERIALS US, LLC | 2004-09-09 | — | — | US | disclosed |
| EP-1428906-A1 | Low dielectric constant material and method of processing by CVD | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2004-06-16 | — | — | EP | disclosed |
| US-20040096593-A1 | Non-thermal process for forming porous low dielectric constant films | VERSUM MATERIALS US, LLC | 2004-05-20 | — | — | US | disclosed |
| US-20040096672-A1 | Non-thermal process for forming porous low dielectric constant films | VERSUM MATERIALS US, LLC | 2004-05-20 | — | — | US | disclosed |
| EP-1420439-A2 | Non-thermal process for forming porous low dielectric constant films | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2004-05-19 | — | — | EP | disclosed |
| US-6716770-B2 | Vapor deposition using organosilicon compound and fluorohydrocarbon plasma; dielectric | AIR PRODUCTS AND CHEMICALS, INC. | 2004-04-06 | — | — | US | disclosed |
| US-20030162034-A1 | Low dielectric constant material and method of processing by CVD | AIR PRODUCTS AND CHEMICALS, INC. | 2003-08-28 | — | — | US | disclosed |
| US-20030049460-A1 | Low dielectric constant material and method of processing by CVD | AIR PRODUCTS AND CHEMICALS, INC. | 2003-03-13 | — | — | US | disclosed |
| EP-1260606-A2 | Low dielectric constant material and method of processing by cvd | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2002-11-27 | — | — | EP | disclosed |