SCHEMBL749593

SCHEMBL749593

CCCCCCCCOC(=O)CC(O)C(=O)OCCCCCCCC.[SnH4]

nearest known ligand 0.70

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 1/20 0.66
NPSR1 Q6W5P4 2/20 0.51
RAD52 P43351 1/20 0.51
MAPT P10636 2/20 0.51
MAPK1 P28482 1/20 0.51
L3MBTL1 Q9Y468 1/20 0.51
FAAH O00519 2/20 0.50
DGKA P23743 1/20 0.50
HTR2C P28335 1/20 0.49
EPHX1 P07099 1/20 0.47
TSHR P16473 2/20 0.46
PRSS1 P07477 1/20 0.44
PRSS2 P07478 1/20 0.44
PRSS3 P35030 1/20 0.44
HCAR2 Q8TDS4 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2231096 1.00 NAAA (0.66) NAAANPSR1RAD52MAPTMAPK1
SCHEMBL1055187 1.00 NAAA (0.66) NAAANPSR1RAD52MAPTMAPK1
SCHEMBL1053266 1.00 NAAA (0.66) NAAANPSR1RAD52MAPTMAPK1
SCHEMBL33595 1.00 NAAA (0.66) NAAANPSR1RAD52MAPTMAPK1
SCHEMBL9099483 1.00 NAAA (0.66) NAAANPSR1RAD52MAPTMAPK1
SCHEMBL9242191 1.00 NAAA (0.66) NAAANPSR1RAD52MAPTMAPK1
SCHEMBL9099743 1.00 NAAA (0.66) NAAANPSR1RAD52MAPTMAPK1
SCHEMBL1069145 1.00 NAAA (0.66) NAAANPSR1RAD52MAPTMAPK1
SCHEMBL3911129 1.00 NAAA (0.66) NAAANPSR1RAD52MAPTMAPK1
SCHEMBL8416064 1.00 NAAA (0.66) NAAANPSR1RAD52MAPTMAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2021065946-A1 MOLDING RESIN COMPOSITION AND MOLDED ARTICLE 積水化学工業株式会社 2021-04-08 WO disclosed
WO-2021065941-A1 RESIN COMPOSITION FOR MOLDING AND MOLDED ARTICLE 積水化学工業株式会社 2021-04-08 WO disclosed
WO-2020203858-A1 CHLORINATED VINYL CHLORIDE RESIN 積水化学工業株式会社 2020-10-08 WO disclosed
WO-2020203840-A1 CHLORINATED VINYL-CHLORIDE-BASED RESIN 積水化学工業株式会社 2020-10-08 WO disclosed
WO-2020203835-A1 CHLORINATED VINYL CHLORIDE-BASED RESIN 積水化学工業株式会社 2020-10-08 WO disclosed
WO-2020203828-A1 CHLORINATED VINYL CHLORIDE RESIN 積水化学工業株式会社 2020-10-08 WO disclosed
WO-2020203839-A1 CHLORINATED VINYL CHLORIDE RESIN 積水化学工業株式会社 2020-10-08 WO disclosed
WO-2020203862-A1 CHLORINATED VINYL-CHLORIDE-BASED RESIN 積水化学工業株式会社 2020-10-08 WO disclosed
WO-2020196153-A1 POLYVINYL CHLORIDE-BASED CARBON FIBER REINFORCED COMPOSITE MATERIAL 積水化学工業株式会社 2020-10-01 WO disclosed
EP-2886568-B1 REACTANT OF SILICON RESIN POLYCONDENSATE PARTICLES AND POLYVINYL CHLORIDE, METHOD FOR MANUFACTURING SAID REACTANT, VINYL CHLORIDE RESIN COMPOSITION, AND METHOD FOR MANUFACTURING VINYL CHLORIDE RESIN COMPOSITION SEKISUI CHEMICAL CO LTD (JP) 2017-03-22 EP disclosed
WO-2010131782-A1 A PERCHLORATE SOLUTION IMPROVED IN SAFETY, AND A METHOD FOR HEAT-STABILIZING CHLORINE-CONTAINING RESIN COMPOSITIONS AKISHIMA CHEMICAL INDUSTRIES CO., LTD. (JP) 2010-11-18 WO disclosed
CN-1934187-B Flame-retardant styrene resin composition DAI ICHI KOGYO SEIYAKU CO LTD 2010-10-06 CN disclosed
CN-101727045-A Electrostatic charging member, electrostatic charging device, process cartridge and image forming apparatus FUJI XEROX CO LTD 2010-06-09 CN disclosed
US-20090299017-A1 One-Part Type Moisture Curable Composition SIKA TECHNOLOGY AG (CH) 2009-12-03 US disclosed
EP-1991595-A2 ONE-PART TYPE MOISTURE CURABLE COMPOSITION Sika Technology AG (CH) 2008-11-19 EP disclosed
WO-2007090867-A2 ONE-PART TYPE MOISTURE CURABLE COMPOSITION SIKA TECHNOLOGY AG (CH) 2007-08-16 WO disclosed
CN-1934187-A Flame-retardant styrene resin composition DAI ICHI KOGYO SEIYAKU CO LTD (JP) 2007-03-21 CN disclosed
CN-1243067-C Resin composition for water-based coating material DAIKIN IND LTD (JP) 2006-02-22 CN disclosed
CN-1501966-A Resin composition for water-based coating material 大金工业株式会社 2004-06-02 CN disclosed
EP-0032753-B1 VINYL CHLORIDE RESIN COMPOSITION, METHOD FOR ITS PRODUCTION AND COMPOSITION CONTAINING IT KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1984-08-29 EP disclosed