SCHEMBL3911129

SCHEMBL3911129

CCCCCCCCCOC(=O)CC(O)C(=O)OCCCCCCCCC

nearest known ligand 0.70

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 1/20 0.66
NPSR1 Q6W5P4 2/20 0.51
RAD52 P43351 1/20 0.51
MAPT P10636 2/20 0.51
MAPK1 P28482 1/20 0.51
L3MBTL1 Q9Y468 1/20 0.51
FAAH O00519 2/20 0.50
DGKA P23743 1/20 0.50
HTR2C P28335 1/20 0.49
EPHX1 P07099 1/20 0.47
TSHR P16473 2/20 0.46
PRSS1 P07477 1/20 0.44
PRSS2 P07478 1/20 0.44
PRSS3 P35030 1/20 0.44
HCAR2 Q8TDS4 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2231096 1.00 NAAA (0.66) NAAANPSR1RAD52MAPTMAPK1
SCHEMBL1055187 1.00 NAAA (0.66) NAAANPSR1RAD52MAPTMAPK1
SCHEMBL1053266 1.00 NAAA (0.66) NAAANPSR1RAD52MAPTMAPK1
SCHEMBL33595 1.00 NAAA (0.66) NAAANPSR1RAD52MAPTMAPK1
SCHEMBL9099483 1.00 NAAA (0.66) NAAANPSR1RAD52MAPTMAPK1
SCHEMBL9242191 1.00 NAAA (0.66) NAAANPSR1RAD52MAPTMAPK1
SCHEMBL9099743 1.00 NAAA (0.66) NAAANPSR1RAD52MAPTMAPK1
SCHEMBL1069145 1.00 NAAA (0.66) NAAANPSR1RAD52MAPTMAPK1
SCHEMBL749593 1.00 NAAA (0.66) NAAANPSR1RAD52MAPTMAPK1
SCHEMBL8416064 1.00 NAAA (0.66) NAAANPSR1RAD52MAPTMAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 58 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2026105628-A1 COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 日産化学株式会社 2026-05-21 WO disclosed
WO-2026105630-A1 COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 日産化学株式会社 2026-05-21 WO disclosed
US-20250362609-A1 SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING POLYFUNCTIONAL SULFONIC ACID NISSAN CHEMICAL CORPORATION (JP) 2025-11-27 US disclosed
US-12344758-B2 Chemical solution-resistant protective film forming composition containing polymerization product having diol structure at terminal thereof NISSAN CHEMICAL CORPORATION (JP) 2025-07-01 US disclosed
US-20250130498-A1 RESIST UNDERLAYER FILM FORMATION COMPOSITION, RESIST PATTERN FORMATION METHOD, FORMATION METHOD FOR RESIST UNDERLAYER FILM PATTERN, AND PATTERN FORMATION METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2025-04-24 US disclosed
US-12221556-B2 Hard-mask forming composition, method for manufacturing electronic component, and compound and resin TOKYO OHKA KOGYO CO., LTD. (JP) 2025-02-11 US disclosed
US-20240427238-A1 RESIST UNDERLAYER FILM-FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2024-12-26 US disclosed
US-20240419073-A1 ADDITIVE-CONTAINING SILICON-CONTAINING RESIST UNDERLAYER FILM FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2024-12-19 US disclosed
US-20240393693-A1 SILICON-CONTAINING RESIST UNDERLAYER FILM FORMING COMPOSITION, LAMINATE USING THE COMPOSITION, AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT NISSAN CHEMICAL CORPORATION (JP) 2024-11-28 US disclosed
US-20240295819-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM NISSAN CHEMICAL CORPORATION (JP) 2024-09-05 US disclosed
US-8709978-B2 Herbicide composition having improved effectiveness, method of preparation and use AGRO INDUSTRIE RECHERCHES ET DEVELOPPEMENTS (A.R.D.) (FR) 2014-04-29 US disclosed
US-20130035234-A1 HERBICIDE COMPOSITION HAVING IMPROVED EFFECTIVENESS, METHOD OF PREPARATION AND USE AGRO INDUSTRIE RECHERCHES ET DEVELOPPEMENTS (A.R.D.) (FR) 2013-02-07 US disclosed
EP-2554049-A1 Herbicidal composition with improved efficiency, preparation method and use AGRO INDUSTRIE RECHERCHES ET DEVELOPPEMENTS (A.R.D.) (FR) 2013-02-06 EP disclosed
CN-102754034-A Composition for formation of resist underlayer film containing silicon having nitrogen-containing ring NISSAN CHEMICAL IND LTD 2012-10-24 CN disclosed
EP-1315045-B1 LITHOGRAPHIC GAP-FILLER FORMING COMPOSITION NISSAN CHEMICAL IND LTD (JP) 2012-09-05 EP disclosed
US-7517633-B2 Composition for forming gap-filling material for lithography NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2009-04-14 US disclosed
US-7378373-B2 Color former, developer, binder resin, and plasticizer; improved performance KABUSHIKI KAISHA TOSHIBA (JP) 2008-05-27 US disclosed
US-20070072771-A1 ERASABLE IMAGE FORMING MATERIAL KABUSHIKI KAISHA TOSHIBA (JP) 2007-03-29 US disclosed
US-20030146416-A1 Lithographic gap-filler forming composition NISSAN CHEMICAL INDUSTRIES LTD (JP) 2003-08-07 US disclosed
EP-1315045-A1 LITHOGRAPHIC GAP-FILLER FORMING COMPOSITION Nissan Chemical Industries, Ltd. (JP) 2003-05-28 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20130035234-A1 HERBICIDE COMPOSITION HAVING IMPROVED EFFECTIVENESS, METHOD OF PREPARATION AND USE DDT, HDHD5, PAOX NAAA 47/4885NPSR1 2443/4885RAD52 3491/4885
US-12221556-B2 Hard-mask forming composition, method for manufacturing electronic component, and compound and resin RER1, SEM1, POP1 NAAA 4122/4885NPSR1 3501/4885RAD52 781/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.