SCHEMBL7519409

SCHEMBL7519409

CCCOC1OC1C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL811045 0.85
SCHEMBL4458651 0.84
SCHEMBL4639776 0.82 GBA1 (0.43)
SCHEMBL6673402 0.80 GBA1 (0.47)
SCHEMBL11847042 0.80 GBA1 (0.47)
SCHEMBL9814204 0.80 GBA1 (0.47)
SCHEMBL6473381 0.80 IGF2R (0.31)
SCHEMBL11309850 0.78 IGF2R (0.33)
SCHEMBL3604551 0.77
SCHEMBL28374435 0.76

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115536981-B Epoxy resin material and preparation method thereof 江苏中科科化新材料股份有限公司 2024-08-06 CN claimed
CN-117844176-A Epoxy resin composition, epoxy resin material, and preparation method and application thereof 江苏中科科化新材料股份有限公司 2024-04-09 CN claimed
CN-117777654-A Raw material composition for preparing epoxy plastic package material, and preparation method and application thereof 江苏中科科化新材料股份有限公司 2024-03-29 CN claimed
CN-109467880-B Method for improving reliability of semiconductor device packaged by epoxy resin composition 江苏科化新材料科技有限公司 2024-01-12 CN claimed
US-4560704-A SILANE ANCUORING;ATTACHING LIGAUD TO MATRIX PURDUE RESEARCH FOUNDATION (US) 1985-12-24 US claimed
CN-115536981-B Epoxy resin material and preparation method thereof 江苏中科科化新材料股份有限公司 2024-08-06 CN disclosed
CN-117844176-A Epoxy resin composition, epoxy resin material, and preparation method and application thereof 江苏中科科化新材料股份有限公司 2024-04-09 CN disclosed
CN-117777654-A Raw material composition for preparing epoxy plastic package material, and preparation method and application thereof 江苏中科科化新材料股份有限公司 2024-03-29 CN disclosed
CN-109467880-B Method for improving reliability of semiconductor device packaged by epoxy resin composition 江苏科化新材料科技有限公司 2024-01-12 CN disclosed
CN-116589945-A Hot melt adhesive for packaging and preparation method thereof 绍兴沈绍化工有限公司 2023-08-15 CN disclosed
CN-116199861-A Oxidized polyethylene wax modified curing agent, preparation method thereof, epoxy plastic package material and application thereof 江苏中科科化新材料股份有限公司 2023-06-02 CN disclosed
CN-116023411-A Preparation method of organic phosphorus compound, epoxy plastic packaging material and application thereof 江苏中科科化新材料股份有限公司 2023-04-28 CN disclosed
WO-2000066575-A2 POLYFLUORINATED EPOXIDES AND ASSOCIATED POLYMERS AND PROCESSES E.I. DU PONT DE NEMOURS AND COMPANY (US) 2000-11-09 WO disclosed
EP-0125344-B1 A GELLATION RESISTANT AQUEOUS GLYCOL COMPOSITION TEXACO DEVELOPMENT CORPORATION (US) 1988-03-16 EP disclosed
US-4560704-A SILANE ANCUORING;ATTACHING LIGAUD TO MATRIX PURDUE RESEARCH FOUNDATION (US) 1985-12-24 US disclosed
US-4485025-A Polyalkylpolyalkoxypolysiloxane stabilizers for inorganic silicates in antifreeze/coolant formulations TEXACO INC. (US) 1984-11-27 US disclosed
EP-0125344-A2 A gellation resistant aqueous glycol composition TEXACO DEVELOPMENT CORPORATION (US) 1984-11-21 EP disclosed
US-4462921-A SOLUBILIZED POLYMETHYLHYDROGENSILOXANE; GELLATION INHIBITION TEXACO INC. (US) 1984-07-31 US disclosed
US-4233214-A FOR POLYACRYLONITRILE AND ACID-MODIFIED POLYESTERS OR POLYAMIDES BAYER AKTIENGESELLSCHAFT (DE) 1980-11-11 US disclosed
US-4036826-A Cationic azo dyestuffs with a hydroxyalkylated ammonium group BAYER AKTIENGESELLSCHAFT (DT) 1977-07-19 US disclosed