Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 6/20 | 0.69 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.47 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.44 |
| ▸ | TSHR | P16473 | 2/20 | 0.44 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.44 |
| ▸ | GLA | P06280 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13444950 | 0.92 | ALDH1A1 (0.73) | ALDH1A1SMN1; SMN2TDP1TSHRMAPK1 | |
| SCHEMBL7526417 | 0.91 | ALDH1A1 (0.69) | ALDH1A1SMN1; SMN2TDP1TSHRMAPK1 | |
| SCHEMBL7520729 | 0.89 | ALDH1A1 (0.61) | ALDH1A1SMN1; SMN2TDP1TSHRMAPK1 | |
| SCHEMBL7521567 | 0.86 | ALDH1A1 (0.58) | ALDH1A1SMN1; SMN2TDP1TSHRMAPK1 | |
| SCHEMBL7518395 | 0.85 | ALDH1A1 (0.65) | ALDH1A1SMN1; SMN2TDP1TSHRMAPK1 | |
| SCHEMBL28560049 | 0.85 | ALDH1A1 (0.81) | ALDH1A1SMN1; SMN2TDP1TSHRMAPK1 | |
| SCHEMBL14440373 | 0.85 | ALDH1A1 (0.65) | ALDH1A1SMN1; SMN2TDP1TSHRMAPK1 | |
| SCHEMBL24542211 | 0.83 | ALDH1A1 (0.73) | ALDH1A1SMN1; SMN2TDP1TSHRMAPK1 | |
| SCHEMBL27071140 | 0.83 | ALDH1A1 (0.63) | ALDH1A1SMN1; SMN2TDP1TSHRMAPK1 | |
| SCHEMBL65567 | 0.83 | ALDH1A1 (0.60) | ALDH1A1SMN1; SMN2TDP1TSHRMAPK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4393720-A1 | PHOSPHINE OXIDE-BASED PHOTOINITIATORS | ARKEMA FRANCE (FR) | 2024-07-03 | — | — | EP | disclosed |
| EP-4393963-A1 | METHODS FOR PREPARING MULTISTAGE POLYMER PARTICLE COMPOSITIONS AND CURABLE FORMULATIONS FOR THREE-DIMENSIONAL PRINTING | ARKEMA FRANCE (FR) | 2024-07-03 | — | — | EP | disclosed |
| EP-4393982-A1 | MULTISTAGE POLYMER COMPOSITIONS AND COATINGS COMPRISING CURED MULTISTAGE POLYMER COMPOSITIONS | ARKEMA FRANCE (FR) | 2024-07-03 | — | — | EP | disclosed |
| CN-117795002-A | Epoxy resin composition, liquid compression molding material, top encapsulation material, and semiconductor device | 纳美仕有限公司 | 2024-03-29 | — | — | CN | disclosed |
| EP-3620481-B1 | LIQUID RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT APPARATUS | RESONAC CORP (JP) | 2024-03-27 | — | — | EP | disclosed |
| WO-2024018039-A1 | ACRYLIC COPOLYMERS IMPARTING LOW YELLOWING AFTER PHOTOCURING | ARKEMA FRANCE (FR) | 2024-01-25 | — | — | WO | disclosed |
| WO-2024018041-A1 | OLIGOMERS COMPRISING POLYMERIZED HIGH-TG MONOMERS | ARKEMA FRANCE (FR) | 2024-01-25 | — | — | WO | disclosed |
| US-20230399479-A1 | LAMINATED FILM AND FLEXIBLE DEVICE | DAICEL CORPORATION (JP) | 2023-12-14 | — | — | US | disclosed |
| EP-4289886-A1 | CONTINUOUS OR SEMI-CONTINUOUS PROCESS FOR PRODUCING A PRE-ACTIVATED ORGANOGELATOR PASTE | ARKEMA FRANCE (FR) | 2023-12-13 | — | — | EP | disclosed |
| CN-116438066-A | Laminated film and flexible device | 株式会社大赛璐 | 2023-07-14 | — | — | CN | disclosed |
| WO-2021261064-A1 | LIQUID COMPRESSION MOLDING MATERIAL | ナミックス株式会社 | 2021-12-30 | — | — | WO | disclosed |
| US-20200194325-A1 | LIQUID RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT APPARATUS | RESONAC CORPORATION (JP) | 2020-06-18 | — | — | US | disclosed |
| US-20200181392-A1 | LIQUID RESIN COMPOSITION FOR COMPRESSION MOLDING AND ELECTRONIC COMPONENT APPARATUS | RESONAC CORPORATION (JP) | 2020-06-11 | — | — | US | disclosed |
| EP-3636688-A1 | LIQUID RESIN COMPOSITION FOR COMPRESSION MOLDING AND ELECTRONIC COMPONENT DEVICE | Hitachi Chemical Company, Ltd. (JP) | 2020-04-15 | — | — | EP | disclosed |
| EP-3620481-A1 | LIQUID RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT DEVICE | Hitachi Chemical Company, Ltd. (JP) | 2020-03-11 | — | — | EP | disclosed |
| CN-110785451-A | Liquid resin composition for sealing and electronic component device | 日立化成株式会社 | 2020-02-11 | — | — | CN | disclosed |
| CN-110770275-A | Liquid resin composition for compression molding and electronic component device | 日立化成株式会社 | 2020-02-07 | — | — | CN | disclosed |
| EP-0911326-B1 | DIGLYCIDYL ETHERS | KYOWA YUKA KK (JP) | 2002-01-30 | — | — | EP | disclosed |
| US-6048956-A | DIGLYCIDYL ETHERS OF DIOLS | KYOWA YUKA CO., LTD. (JP) | 2000-04-11 | — | — | US | disclosed |
| EP-0911326-A1 | DIGLYCIDYL ETHERS | Kyowa Yuka Co., Ltd. (JP) | 1999-04-28 | — | — | EP | disclosed |