SCHEMBL7543934

SCHEMBL7543934

CCOc1ccc(C=COC(C)C)cc1

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
RELA Q04206 1/20 0.58
ESR1 P03372 2/20 0.51
AHR P35869 1/20 0.51
NQO1 P15559 1/20 0.50
TAS1R3 Q7RTX0 1/20 0.49
TAS1R1 Q7RTX1 1/20 0.49
NPC1 O15118 3/20 0.49
RAB9A P51151 3/20 0.49
MAPT P10636 2/20 0.49
TP53 P04637 1/20 0.49
SMN1; SMN2 Q16637 1/20 0.49
PTGS2 P35354 1/20 0.49
TUBB4A P04350 1/20 0.47
TUBB P07437 1/20 0.47
TUBA3C P0DPH7 1/20 0.47
TUBA1B P68363 1/20 0.47
TUBA4A P68366 1/20 0.47
TUBB4B P68371 1/20 0.47
TUBB3 Q13509 1/20 0.47
TUBB2A Q13885 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10623831 0.80 RELA (0.83) RELAESR1AHRNQO1NPC1
SCHEMBL10623834 0.80 RELA (0.83) RELAESR1AHRNQO1NPC1
SCHEMBL5023790 0.80 KDM4E (0.56) RELAESR1AHRTP53SMN1; SMN2
SCHEMBL5026274 0.79 KDM4E (0.55) RELAESR1AHRNPC1RAB9A
SCHEMBL5604535 0.79 RELA (0.63) RELAESR1AHRNQO1NPC1
SCHEMBL2622560 0.77 RELA (0.70) RELAESR1AHRNQO1NPC1
SCHEMBL7270826 0.75 RELA (0.58) RELAESR1AHRNQO1NPC1
SCHEMBL13476090 0.75 RELA (0.58) RELAESR1AHRNQO1TAS1R3
SCHEMBL10601861 0.75 RELA (0.68) RELAESR1AHRNQO1NPC1
SCHEMBL10601858 0.75 RELA (0.68) RELAESR1AHRNQO1NPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20020015906-A1 Polymer for photoresist, method of production thereof and photoresist composition containing polymer SAMSUNG ELECTRONICS CO., LTD. (KR) 2002-02-07 US disclosed
EP-0520642-B1 Resist material and pattern formation process WAKO PURE CHEM IND LTD (JP) 1998-10-28 EP disclosed
US-5670299-A COATING A PHOTORESISTS POLYMER ON A SUBSTRATE, DEVELOPMENT AND HEAT TREATMENT WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 1997-09-23 US disclosed
US-5468589-A Heat resistant, photosensitive patterns WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 1995-11-21 US disclosed
EP-0520642-A1 Resist material and pattern formation process WAKO PURE CHEMICAL INDUSTRIES LTD (JP) 1992-12-30 EP disclosed