SCHEMBL757019

SCHEMBL757019

CSc1nc(N)n[nH]1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL29169695 0.98
SCHEMBL156748 0.79 ALDH1A1 (0.37)
SCHEMBL7212164 0.77 ALPL (0.34)
SCHEMBL168083 0.75
SCHEMBL175731 0.75 ALDH1A1 (0.34)
SCHEMBL11584118 0.75
SCHEMBL14498872 0.72
SCHEMBL4577350 0.72
SCHEMBL11584813 0.72 KMT2A (0.40)
SCHEMBL175730 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 474 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260043144-A1 COPPER ETCHANT MEC COMPANY LTD. (JP) 2026-02-12 US claimed
US-12550694-B2 Selective deposition for integrated circuit interconnect structures TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) 2026-02-10 US claimed
US-20250320340-A1 PROCESSES FOR PRODUCING FILLED POLYOL COMPOSITIONS COVESTRO LLC (US) 2025-10-16 US claimed
EP-4624628-A1 COPPER ETCHANT MEC COMPANY., LTD. (JP) 2025-10-01 EP claimed
CN-120006293-A Microetching super-roughening liquid for enhancing bonding force between copper surface of PCB and resin and application thereof 中山大学 2025-05-16 CN claimed
US-12278143-B2 Method of providing a workpiece including low resistance interconnect low-resistance interconnect TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) 2025-04-15 US claimed
EP-4419619-A1 SELECTIVE WET ETCH COMPOSITION AND METHOD Entegris, Inc. (US) 2024-08-28 EP claimed
US-20240258166-A1 SELECTIVE DEPOSITION FOR INTEGRATED CIRCUIT INTERCONNECT STRUCTURES TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) 2024-08-01 US claimed
EP-4396253-A1 FILLED POLYOL COMPOSITIONS THAT INCLUDE A TRIAZOLE Covestro LLC (US) 2024-07-10 EP claimed
CN-118256249-A Etching composition and application thereof 宁波安集微电子科技有限公司 2024-06-28 CN claimed
EP-0673783-B1 Recording sheets containing purine, pyrimidine, benzimidazole, imidazolidine, urazole, pyrazole, triazole, benzotriazole, tetrazole, and pyrazine compounds XEROX CORP (US) 2000-07-05 EP claimed
US-5659348-A APPLYING TO A SUBSTRATE XEROX CORPORATION (US) 1997-08-19 US claimed
EP-0743574-A2 Migration imaging members XEROX CORPORATION (US) 1996-11-20 EP claimed
EP-0743573-A2 Method for obtaining image contrast migration imaging members XEROX CORPORATION (US) 1996-11-20 EP claimed
US-5563014-A SOFTENABLE LAYER CONTAINIG PHOTOSENSITIVE MARKING MATERIAL; TRANSPARENTIZING AGENT XEROX CORPORATION (US) 1996-10-08 US claimed
US-5514505-A SELECTIVE TRANSPARENTIZATION OF PHOTOSENSITIVE MIGRATION MARKING PARTICLES EMBEDDED NEAR THE SURFACE OF A SOFTENABLE LAYER SUPPORTED BY AN ELECTROCONDUCTIVE SUBSTRATE XEROX CORPORATION (US) 1996-05-07 US claimed
EP-0673783-A2 Recording sheets containing purine, pyrimidine, benzimidazole, imidazolidine, urazole, pyrazole, triazole, benzotriazole, tetrazole, and pyrazine compounds XEROX CORPORATION (US) 1995-09-27 EP claimed
US-5191080-A Method for preparing tetraazaindenes EASTMAN KODAK COMPANY (US) 1993-03-02 US claimed
EP-0487687-A1 PROCESS AND INTERMEDIATES FOR THE PREPARATION OF TETRAAZAINDENES USEFUL IN PHOTOGRAPHY EASTMAN KODAK COMPANY (US) 1992-06-03 EP claimed
WO-1992000291-A1 PROCESS AND INTERMEDIATES FOR THE PREPARATION OF TETRAAZAINDENES USEFUL IN PHOTOGRAPHY EASTMAN KODAK COMPANY (US) 1992-01-09 WO claimed