SCHEMBL757019

SCHEMBL757019

CSc1nc(N)n[nH]1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL29169695 0.98 — —
SCHEMBL156748 0.79 ALDH1A1 (0.37) —
SCHEMBL7212164 0.77 ALPL (0.34) —
SCHEMBL168083 0.75 — —
SCHEMBL175731 0.75 ALDH1A1 (0.34) —
SCHEMBL11584118 0.75 — —
SCHEMBL4577350 0.72 — —
SCHEMBL14498872 0.72 — —
SCHEMBL11584813 0.72 KMT2A (0.40) —
SCHEMBL175730 0.71 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 474 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260043144-A1 COPPER ETCHANT MEC COMPANY LTD. (JP) 2026-02-12 — — US claimed
US-12550694-B2 Selective deposition for integrated circuit interconnect structures TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) 2026-02-10 — — US claimed
US-20250320340-A1 PROCESSES FOR PRODUCING FILLED POLYOL COMPOSITIONS COVESTRO LLC (US) 2025-10-16 — — US claimed
EP-4624628-A1 COPPER ETCHANT MEC COMPANY., LTD. (JP) 2025-10-01 — — EP claimed
CN-120006293-A Microetching super-roughening liquid for enhancing bonding force between copper surface of PCB and resin and application thereof 中山大学 2025-05-16 — — CN claimed
US-12278143-B2 Method of providing a workpiece including low resistance interconnect low-resistance interconnect TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) 2025-04-15 — — US claimed
EP-4419619-A1 SELECTIVE WET ETCH COMPOSITION AND METHOD Entegris, Inc. (US) 2024-08-28 — — EP claimed
US-20240258166-A1 SELECTIVE DEPOSITION FOR INTEGRATED CIRCUIT INTERCONNECT STRUCTURES TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) 2024-08-01 — — US claimed
EP-4396253-A1 FILLED POLYOL COMPOSITIONS THAT INCLUDE A TRIAZOLE Covestro LLC (US) 2024-07-10 — — EP claimed
CN-118256249-A Etching composition and application thereof 宁波安集微电子科技有限公司 2024-06-28 — — CN claimed
EP-0673783-B1 Recording sheets containing purine, pyrimidine, benzimidazole, imidazolidine, urazole, pyrazole, triazole, benzotriazole, tetrazole, and pyrazine compounds XEROX CORP (US) 2000-07-05 — — EP claimed
US-5659348-A APPLYING TO A SUBSTRATE XEROX CORPORATION (US) 1997-08-19 — — US claimed
EP-0743574-A2 Migration imaging members XEROX CORPORATION (US) 1996-11-20 — — EP claimed
EP-0743573-A2 Method for obtaining image contrast migration imaging members XEROX CORPORATION (US) 1996-11-20 — — EP claimed
US-5563014-A SOFTENABLE LAYER CONTAINIG PHOTOSENSITIVE MARKING MATERIAL; TRANSPARENTIZING AGENT XEROX CORPORATION (US) 1996-10-08 — — US claimed
US-5514505-A SELECTIVE TRANSPARENTIZATION OF PHOTOSENSITIVE MIGRATION MARKING PARTICLES EMBEDDED NEAR THE SURFACE OF A SOFTENABLE LAYER SUPPORTED BY AN ELECTROCONDUCTIVE SUBSTRATE XEROX CORPORATION (US) 1996-05-07 — — US claimed
EP-0673783-A2 Recording sheets containing purine, pyrimidine, benzimidazole, imidazolidine, urazole, pyrazole, triazole, benzotriazole, tetrazole, and pyrazine compounds XEROX CORPORATION (US) 1995-09-27 — — EP claimed
US-5191080-A Method for preparing tetraazaindenes EASTMAN KODAK COMPANY (US) 1993-03-02 — — US claimed
EP-0487687-A1 PROCESS AND INTERMEDIATES FOR THE PREPARATION OF TETRAAZAINDENES USEFUL IN PHOTOGRAPHY EASTMAN KODAK COMPANY (US) 1992-06-03 — — EP claimed
WO-1992000291-A1 PROCESS AND INTERMEDIATES FOR THE PREPARATION OF TETRAAZAINDENES USEFUL IN PHOTOGRAPHY EASTMAN KODAK COMPANY (US) 1992-01-09 — — WO claimed
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