SCHEMBL7593787

SCHEMBL7593787

NC(=S)NCl.[Cu]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3644519 0.96
Water SCHEMBL28223847 0.92
SCHEMBL28760527 0.88
Thiosemicarbazide SCHEMBL19183587 0.70
Thiosemicarbazide SCHEMBL28669413 0.70 ALDH1A1 (0.91)
SCHEMBL7175552 0.67
Thiourea SCHEMBL2928082 0.66
SCHEMBL16002354 0.64
SCHEMBL11502193 0.64
SCHEMBL7026469 0.64

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0926265-B1 Method and compositions for producing copper surfaces for improved bonding and articles made therefrom ATOTECH DEUTSCHLAND GMBH (DE) 2002-11-13 EP disclosed