Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 7/20 | 0.41 |
| ▸ | HSP90AA1 | P07900 | 2/20 | 0.38 |
| ▸ | LMNA | P02545 | 2/20 | 0.38 |
| ▸ | ATM | Q13315 | 2/20 | 0.38 |
| ▸ | MEN1 | O00255 | 1/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.38 |
| ▸ | PKM | P14618 | 1/20 | 0.38 |
| ▸ | HPGD | P15428 | 1/20 | 0.38 |
| ▸ | HTT | P42858 | 1/20 | 0.38 |
| ▸ | CCR6 | P51684 | 1/20 | 0.38 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.38 |
| ▸ | G6PD | P11413 | 1/20 | 0.36 |
| ▸ | TLR9 | Q9NR96 | 1/20 | 0.36 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.34 |
| ▸ | PTGS2 | P35354 | 1/20 | 0.34 |
| ▸ | FAAH | O00519 | 3/20 | 0.34 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.34 |
| ▸ | RAB9A | P51151 | 1/20 | 0.34 |
| ▸ | NR3C1 | P04150 | 1/20 | 0.33 |
| ▸ | FFAR1 | O14842 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30793053 | 1.00 | MGLL (0.41) | MGLLHSP90AA1LMNAATMMEN1 | |
| SCHEMBL8729999 | 0.93 | MGLL (0.44) | MGLLHSP90AA1LMNAATMMEN1 | |
| SCHEMBL30793023 | 0.91 | MGLL (0.49) | MGLLHSP90AA1LMNAATMMEN1 | |
| SCHEMBL29191799 | 0.89 | MGLL (0.40) | MGLLHSP90AA1LMNAATMMEN1 | |
| SCHEMBL28221672 | 0.88 | MGLL (0.41) | MGLLHSP90AA1LMNAATMMEN1 | |
| SCHEMBL29191798 | 0.86 | TLR9 (0.43) | MGLLHSP90AA1LMNAATMMEN1 | |
| SCHEMBL30793038 | 0.86 | TLR9 (0.43) | MGLLHSP90AA1LMNAATMMEN1 | |
| SCHEMBL27819277 | 0.84 | MGLL (0.56) | MGLLHSP90AA1LMNAATMMEN1 | |
| SCHEMBL8730168 | 0.82 | MGLL (0.44) | MGLLHSP90AA1LMNAATMMEN1 | |
| SCHEMBL94319 | 0.82 | MGLL (0.60) | MGLLHSP90AA1LMNAATMMEN1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117645771-A | Solvent-free high-low temperature resistant bulletproof composite matrix resin and preparation method thereof | 上海鑫丰泰新材料科技有限公司 | 2024-03-05 | — | — | CN | claimed |
| EP-0449292-B1 | Multilayer printed circuit board and production thereof | HITACHI LTD (JP) | 1997-08-20 | — | — | EP | claimed |
| US-5478918-A | Low stress polyimide composition and precursor composition solution of same | CENTRAL GLASS COMPANY, LIMITED (JP) | 1995-12-26 | — | — | US | claimed |
| JP-2085238-A | — | — | None | — | — | JP | disclosed |
| CN-117645771-A | Solvent-free high-low temperature resistant bulletproof composite matrix resin and preparation method thereof | 上海鑫丰泰新材料科技有限公司 | 2024-03-05 | — | — | CN | disclosed |
| US-20020151659-A1 | Formed from 6,6'-bis(2-(4-fluorophenyl)-4- phenylquinoline) and 4,4'-(1,1,1,3,3,3-hexafluoro-2,2-propylidene)bisphenol and 2,2-bis((4-maleimidophenoxy)phenyl)propane; dielectrics | HITACHI CHEMICAL CO., LTD. (JP) | 2002-10-17 | — | — | US | disclosed |
| US-6462148-B1 | RESIN COMPOSITION COMPRISING A POLYMER CONTAINING A QUINOLINE RING AND A THERMOSETTING RESIN, AN INSULATING MATERIAL CONSTITUTED BY SAID RESIN COMPOSITION AND AN ADHESIVE FILM, PARTICULARLY A RESIN FOR AN INTERLAYER INSULATION FILM | HITACHI CHEMICAL CO., LTD. (JP) | 2002-10-08 | — | — | US | disclosed |
| EP-0449292-B1 | Multilayer printed circuit board and production thereof | HITACHI LTD (JP) | 1997-08-20 | — | — | EP | disclosed |
| EP-0364785-B1 | Thermosetting resin composition, printed circuit board using the resin composition and process for producing printed circuit board | HITACHI LTD (JP) | 1995-03-01 | — | — | EP | disclosed |
| US-5352762-A | Fluorine-containing biscyanamide thermosetting resin, heat resistance, adhesion | HITACHI, LTD. (JP) | 1994-10-04 | — | — | US | disclosed |
| US-5194518-A | Polyimides, prepregs, fluoropolymers | NITTO DENKO CORPORATION (JP) | 1993-03-16 | — | — | US | disclosed |
| US-5098971-A | Heat resistant molding materials for wiring boards and insulation layers | HITACHI, LTD. (JP) | 1992-03-24 | — | — | US | disclosed |
| US-5089628-A | Heat resistance, moisture resistance, low dielectric constants | CENTRAL GLASS COMPANY, LIMITED (JP) | 1992-02-18 | — | — | US | disclosed |
| EP-0449292-A2 | Multilayer printed circuit board and production thereof | HITACHI, LTD. (JP) | 1991-10-02 | — | — | EP | disclosed |
| US-5045381-A | Containing (iso)cyanate compound and poly(p-hydroxystyrene) derivative | HITACHI, LTD. (JP) | 1991-09-03 | — | — | US | disclosed |
| EP-0422379-A2 | Thermosetting resin composition, resin sheet, prepreg and laminated sheet | NITTO DENKO CORPORATION (JP) | 1991-04-17 | — | — | EP | disclosed |
| EP-0364785-A1 | Thermosetting resin composition, printed circuit board using the resin composition and process for producing printed circuit board | HITACHI, LTD. (JP) | 1990-04-25 | — | — | EP | disclosed |
| JP-H0285238-A | FLUORINE-CONTAINING BISMALEAMIC ACID AND BISMALEIMIDE | CENTRAL GLASS CO LTD | 1990-03-26 | — | — | JP | disclosed |