SCHEMBL94319

SCHEMBL94319

O=C1C=CC(=O)N1c1ccc(Oc2ccc(C(c3ccc(Oc4ccc(N5C(=O)C=CC5=O)cc4)cc3)(C(F)(F)F)C(F)(F)F)cc2)cc1

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 14/20 0.60
HSP90AA1 P07900 4/20 0.50
PKM P14618 2/20 0.50
ALDH1A1 P00352 2/20 0.50
LMNA P02545 2/20 0.50
CCR6 P51684 2/20 0.50
MEN1 O00255 1/20 0.50
HPGD P15428 1/20 0.50
HTT P42858 1/20 0.50
KMT2A Q03164 1/20 0.50
ATM Q13315 1/20 0.50
FAAH O00519 5/20 0.48
TDP1 Q9NUW8 2/20 0.42
MAPK1 P28482 1/20 0.42
NPSR1 Q6W5P4 1/20 0.42
DDAH1 O94760 1/20 0.39
BCHE P06276 1/20 0.38
CACNA1B Q00975 1/20 0.38
APBA1 Q02410 1/20 0.38
APOBEC3G Q9HC16 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8766700 0.93 MGLL (0.53) MGLLHSP90AA1PKMALDH1A1LMNA
SCHEMBL1155772 0.90 MGLL (0.60) MGLLHSP90AA1PKMALDH1A1LMNA
SCHEMBL24208354 0.87 MGLL (0.47) MGLLHSP90AA1PKMALDH1A1LMNA
SCHEMBL332102 0.87 MGLL (0.53) MGLLHSP90AA1PKMALDH1A1LMNA
SCHEMBL30170475 0.87 MGLL (0.53) MGLLHSP90AA1PKMALDH1A1LMNA
SCHEMBL8766785 0.86 MGLL (0.44) MGLLHSP90AA1PKMALDH1A1LMNA
SCHEMBL13819247 0.85 MGLL (0.48) MGLLHSP90AA1PKMALDH1A1LMNA
SCHEMBL10297376 0.84 MGLL (0.57) MGLLHSP90AA1PKMALDH1A1LMNA
SCHEMBL28596008 0.84 MGLL (0.57) MGLLHSP90AA1PKMALDH1A1LMNA
SCHEMBL9578406 0.84 MGLL (0.60) MGLLHSP90AA1PKMALDH1A1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 377 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113121879-B Bismaleimide cross-linking agent for low loss dielectrics 罗门哈斯电子材料有限责任公司 2023-05-23 CN claimed
CN-115926379-A Non-covalent modified boron nitride/epoxy resin heat-conducting and insulating composite material and preparation method thereof 江南大学 2023-04-07 CN claimed
CN-113845775-B Preparation method of hyperbranched polymer modified boron nitride heat-conducting and insulating composite material 江南大学 2022-06-21 CN claimed
CN-113845775-A Preparation method of hyperbranched polymer modified boron nitride heat-conducting and insulating composite material 江南大学 2021-12-28 CN claimed
CN-113121879-A Bismaleimide crosslinkers for low loss dielectrics 罗门哈斯电子材料有限责任公司 2021-07-16 CN claimed
US-20210198396-A1 BISMALEIMIDE CROSS-LINKER FOR LOW LOSS DIELECTRIC ROHM AND HAAS ELECTRONIC MATERIALS LLC 2021-07-01 US claimed
US-9136559-B2 Non-aqueous electrolyte and lithium secondary battery including the same INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2015-09-15 US claimed
US-20120172558-A1 META-STABLE STATE NITROGEN-CONTAINING POLYMER INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2012-07-05 US claimed
US-20120171579-A1 NON-AQUEOUS ELECTROLYTE AND LITHIUM SECONDARY BATTERY INCLUDING THE SAME INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2012-07-05 US claimed
EP-0449292-B1 Multilayer printed circuit board and production thereof HITACHI LTD (JP) 1997-08-20 EP claimed
US-5478918-A Low stress polyimide composition and precursor composition solution of same CENTRAL GLASS COMPANY, LIMITED (JP) 1995-12-26 US claimed
JP-3281630-A None JP disclosed
JP-2051529-A None JP disclosed
US-20260071011-A1 COMPOUND, RESIN COMPOSITION, PREPREG, RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE RESONAC CORP (JP) 2026-03-12 US disclosed
US-12504687-B2 Curable photosensitive resin composition, cured product, resist pattern, method of producing resist pattern, semiconductor device and electronic device ARAKAWA CHEMICAL INDUSTRIES, LTD. (JP) 2025-12-23 US disclosed
US-5045381-A Containing (iso)cyanate compound and poly(p-hydroxystyrene) derivative HITACHI, LTD. (JP) 1991-09-03 US disclosed
EP-0422379-A2 Thermosetting resin composition, resin sheet, prepreg and laminated sheet NITTO DENKO CORPORATION (JP) 1991-04-17 EP disclosed
EP-0364785-A1 Thermosetting resin composition, printed circuit board using the resin composition and process for producing printed circuit board HITACHI, LTD. (JP) 1990-04-25 EP disclosed
JP-H0251529-A RESIN COMPOSITION FUJITSU LTD 1990-02-21 JP disclosed
US-4900807-A HEAT RESISTANT, ELECTRONICS HITACHI, LTD. (JP) 1990-02-13 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260071011-A1 COMPOUND, RESIN COMPOSITION, PREPREG, RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE CD79B, C1R, TGFBR1 MGLL 3867/4885HSP90AA1 3849/4885PKM 3058/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.