SCHEMBL7622073

SCHEMBL7622073

CCCCCCCCCCCCCCCCCCOc1ccc(OS(=O)(=O)C(F)(F)F)c(Cc2ccccc2)c1.CCS

nearest known ligand 0.44

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
THRA P10827 1/20 0.44
PTGES O14684 1/20 0.41
ALOX5 P09917 1/20 0.41
PPARG P37231 1/20 0.41
DHFR P00374 6/20 0.41
PDK2 Q15119 1/20 0.40
PTPN11 Q06124 1/20 0.39
PLA2G4B P0C869 1/20 0.39
GGPS1 O95749 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7625930 0.97 THRA (0.45) THRAPTGESALOX5PPARGDHFR
Iodide SCHEMBL7620798 0.96 THRA (0.45) THRAPTGESALOX5PPARGDHFR
Hydrogen Sulfide SCHEMBL7625091 0.96 THRA (0.45) THRAPTGESALOX5PPARGDHFR
Iodomethane SCHEMBL4620308 0.95 THRA (0.45) THRAPTGESALOX5PPARGDHFR
SCHEMBL4617897 0.94 THRA (0.44) THRAPTGESALOX5PPARGDHFR
Trifluoromethanesulfonic Acid SCHEMBL7625092 0.81 PDK2 (0.43) THRAPTGESALOX5PPARGDHFR
SCHEMBL7043778 0.80 MTNR1A (0.45)
Trifluoromethanesulfonic Acid SCHEMBL7620803 0.78 PDK2 (0.43) THRAPTGESALOX5PPARGDHFR
Trifluoromethanesulfonic Acid SCHEMBL4620311 0.77 PDK2 (0.40) DHFRPDK2PTPN11PLA2G4BGGPS1
Trifluoromethanesulfonic Acid SCHEMBL4617899 0.76 PDK2 (0.39) THRADHFRPDK2PTPN11PLA2G4B

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6437090-B1 ORGANOMETALLIC COMPOUND CAPABLE OF REVERSIBLY DISSOLVING AND PRECIPITATING THROUGH HEATING AND COOLING; ORGANOSILICON COMPOUND; ONE LIGAND CONTAINS AN ALKYL GROUP HAVING 10 OR MORE CARBON ATOMS; EPOXY RESIN; STORAGE STABLE; ONLY CURES ON HEAT KABUSHIKI KAISHA TOSHIBA (JP) 2002-08-20 US disclosed