Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CES2 | O00748 | 3/20 | 0.49 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.37 |
| ▸ | TSHR | P16473 | 2/20 | 0.34 |
| ▸ | EPHX2 | P34913 | 1/20 | 0.33 |
| ▸ | FAAH | O00519 | 4/20 | 0.32 |
| ▸ | ATM | Q13315 | 1/20 | 0.32 |
| ▸ | PLA2G4B | P0C869 | 2/20 | 0.31 |
| ▸ | CES1 | P23141 | 3/20 | 0.31 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4622979 | 0.86 | CES2 (0.40) | CES2 | |
| SCHEMBL2383658 | 0.83 | CA1 (0.36) | CES2ALDH1A1FAAHATMCES1 | |
| SCHEMBL28373334 | 0.83 | CES2 (0.51) | CES2ALDH1A1TSHREPHX2FAAH | |
| SCHEMBL7112242 | 0.82 | CES2 (0.47) | CES2ALDH1A1TSHRFAAHATM | |
| SCHEMBL29017482 | 0.80 | CES2 (0.45) | CES2ALDH1A1TSHR | |
| SCHEMBL106135 | 0.79 | CA1 (0.36) | CES2ALDH1A1FAAHATMCES1 | |
| SCHEMBL107477 | 0.79 | CA1 (0.36) | CES2ALDH1A1FAAHATMCES1 | |
| SCHEMBL105786 | 0.79 | CA1 (0.36) | CES2ALDH1A1FAAHATMCES1 | |
| SCHEMBL7108185 | 0.78 | CES2 (0.46) | CES2ALDH1A1TSHRFAAHATM | |
| SCHEMBL4534558 | 0.78 | CES2 (0.46) | CES2ALDH1A1TSHREPHX2ATM |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0844283-B1 | Curable resin composition and cured products | JSR CORP (JP) | 2002-10-09 | — | — | EP | disclosed |
| US-6313233-B1 | CAN BE CURED AND FABRICATED WITHOUT PRODUCING NO CRACKS INTO A CURED PRODUCT SUCH AS A SEMICONDUCTOR DEVICE HAVING A LOW DIELECTRIC CONSTANT, HIGH HEAT RESISTANCE AND MOISTURE RESISTANCE, SUPERIOR ADHESION TO VARIOUS SUBSTRATE MATERIALS | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 2001-11-06 | — | — | US | disclosed |
| US-6011123-A | ORGANOSILANE COMPOUND; POLYAMIC ACIDS HAVING A HYDROLYZABLE SILYL GROUP OR CARBOXYLIC ACID ANHYDRIDE GROUP, OR BOTH, AND POLYIMIDES HAVING A HYDROLYZABLE SILYL GROUP OR CARBOXYLIC ACID ANHYDRIDE GROUP, OR BOTH. | JSR CORPORATION (JP) | 2000-01-04 | — | — | US | disclosed |
| EP-0844283-A1 | Curable resin composition and cured products | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1998-05-27 | — | — | EP | disclosed |