SCHEMBL766127

SCHEMBL766127

CCCC[N+](CCCC)(CCCC)CCCC[N+](CCCC)(CCCC)CCCC

nearest known ligand 0.93

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
▸ SLC22A1 O15245 3/20 0.92
▸ SLC22A2 O15244 1/20 0.92
▸ ALDH1A1 P00352 1/20 0.80
▸ TP53 P04637 1/20 0.80
▸ CYP3A4 P08684 1/20 0.80
▸ ALOX15 P16050 1/20 0.80
▸ TSHR P16473 1/20 0.80
▸ ALOX12 P18054 1/20 0.80
▸ SMN1; SMN2 Q16637 1/20 0.80
▸ HIF1A Q16665 1/20 0.80
▸ HSD17B10 Q99714 1/20 0.80
▸ DNM1 Q05193 8/20 0.71

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1063806 1.00 SLC22A1 (0.92) SLC22A1SLC22A2ALDH1A1TP53CYP3A4
SCHEMBL964558 1.00 SLC22A1 (0.92) SLC22A1SLC22A2ALDH1A1TP53CYP3A4
Tetrapentylammonium SCHEMBL9859800 1.00 SLC22A1 (0.92) SLC22A1SLC22A2ALDH1A1TP53CYP3A4
SCHEMBL16649235 1.00 SLC22A1 (0.92) SLC22A1SLC22A2ALDH1A1TP53CYP3A4
Tetrahexylammonium SCHEMBL2521928 0.96 SLC22A1 (0.93) SLC22A1SLC22A2ALDH1A1TP53CYP3A4
SCHEMBL13567361 0.96 SLC22A1 (0.93) SLC22A1SLC22A2ALDH1A1TP53CYP3A4
SCHEMBL4059060 0.96 SLC22A1 (0.93) SLC22A1SLC22A2ALDH1A1TP53CYP3A4
SCHEMBL1060273 0.96 SLC22A1 (0.93) SLC22A1SLC22A2ALDH1A1TP53CYP3A4
SCHEMBL158607 0.96 SLC22A1 (0.93) SLC22A1SLC22A2ALDH1A1TP53CYP3A4
SCHEMBL4059099 0.96 SLC22A1 (0.93) SLC22A1SLC22A2ALDH1A1TP53CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1848824-A4 SELECTED COMPACTION AGENTS AND METHODS AND COMPOSITIONS FOR BIOTECHNICAL SEPARATIONS TECHNOLOGY LICENSING CO LLC (US) 2008-07-09 — — EP claimed
EP-1848824-A1 SELECTED COMPACTION AGENTS AND METHODS AND COMPOSITIONS FOR BIOTECHNICAL SEPARATIONS Technology Licensing Co, Llc. (US) 2007-10-31 — — EP claimed
WO-2006083962-A1 SELECTED COMPACTION AGENTS AND METHODS AND COMPOSITIONS FOR BIOTECHNICAL SEPARATIONS TECHNOLOGY LICENSING CO. LLC (US) 2006-08-10 — — WO claimed
US-9275899-B2 Chemical mechanical polishing composition and method for polishing tungsten ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (US) 2016-03-01 — — US disclosed
US-20150380295-A1 CHEMICAL MECHANICAL POLISHING COMPOSITION AND METHOD FOR POLISHING TUNGSTEN U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2015-12-31 — — US disclosed
US-8865013-B2 Method for chemical mechanical polishing tungsten ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (US) 2014-10-21 — — US disclosed
US-8568610-B2 Stabilized, concentratable chemical mechanical polishing composition and method of polishing a substrate ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (US) 2013-10-29 — — US disclosed
US-8513126-B2 Slurry composition having tunable dielectric polishing selectivity and method of polishing a substrate ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (US) 2013-08-20 — — US disclosed
US-8440094-B1 Method of polishing a substrate ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (US) 2013-05-14 — — US disclosed
US-8435420-B1 Method of polishing using tunable polishing formulation ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (US) 2013-05-07 — — US disclosed
US-20130109182-A1 Method Of Polishing Using Tunable Polishing Formulation ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. 2013-05-02 — — US disclosed
US-20120070990-A1 Slurry Composition Having Tunable Dielectric Polishing Selectivity And Method Of Polishing A Substrate ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. 2012-03-22 — — US disclosed
US-20120070989-A1 Stabilized, Concentratable Chemical Mechanical Polishing Composition And Method Of Polishing A Substrate ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. 2012-03-22 — — US disclosed
US-7914965-B2 Resist composition and method of pattern formation with the same FUJIFILM CORPORATION (JP) 2011-03-29 — — US disclosed
US-7914965-B2 Resist composition and method of pattern formation with the same FUJIFILM CORPORATION (JP) 2011-03-29 — — US disclosed
US-7569347-B2 Apparatus, methods and compositions for biotechnical separations TECHNOLOGY LICENSING CO. LLC (US) 2009-08-04 — — US disclosed
US-20060141521-A1 Apparatus, methods and compositions for biotechnical separations TECHNOLOGY LICENSING CO. LLC 2006-06-29 — — US disclosed
US-5576459-A Quaternary nitrogen or phosphorus chirates SACHEM, INC. (US) 1996-11-19 — — US disclosed
US-3966566-A Electrolytic hydrodimerization process improvement MONSANTO COMPANY (US) 1976-06-29 — — US disclosed
US-3960679-A Process for hydrodimerizing olefinic compounds MONSANTO COMPANY (US) 1976-06-01 — — US disclosed
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