SCHEMBL766976

SCHEMBL766976

C=C1C[CH]CC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1927972 0.81
SCHEMBL420893 0.79
SCHEMBL1403443 0.71
SCHEMBL3224682 0.60
SCHEMBL9335399 0.60
SCHEMBL290556 0.60
SCHEMBL5247536 0.60
SCHEMBL22721286 0.60
SCHEMBL42375 0.59
SCHEMBL1401055 0.58

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 442 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240231230-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM NISSAN CHEMICAL CORPORATION (JP) 2024-07-11 US disclosed
EP-4398285-A1 ADHESIVE COMPOSITION, MULTILAYER BODY, AND METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE Nissan Chemical Corporation (JP) 2024-07-10 EP disclosed
CN-118295212-A Composition for forming resist underlayer film containing glycol structure 日产化学株式会社 2024-07-05 CN disclosed
US-20240218293-A1 CLEANING AGENT COMPOSITION AND CLEANING METHOD NISSAN CHEMICAL CORPORATION (JP) 2024-07-04 US disclosed
US-12025916-B2 Resist underlayer film-forming composition that contains triaryldiamine-containing novolac resin to which aromatic vinyl compound is added NISSAN CHEMICAL CORPORATION (JP) 2024-07-02 US disclosed
US-20240201592-A1 COMPOSITION FOR FORMING RESIST UNDERLAYER FILM NISSAN CHEMICAL CORPORATION (JP) 2024-06-20 US disclosed
US-20240201593-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM NISSAN CHEMICAL CORPORATION (JP) 2024-06-20 US disclosed
WO-2024128199-A1 RELEASER COMPOSITION FOR PHOTOIRRADIATION RELEASE, AND ADHESIVE COMPOSITION FOR PHOTOIRRADIATION RELEASE 日産化学株式会社 2024-06-20 WO disclosed
WO-2024122488-A1 COMPOSITION FOR FORMING PROTECTIVE FILM 日産化学株式会社 2024-06-13 WO disclosed
CN-118159910-A Additive-containing silicon-containing resist underlayer film forming composition 日产化学株式会社 2024-06-07 CN disclosed
US-20100137445-A1 PLANT DISEASE CONTROL AGENT, AND PLANT DISEASE CONTROL METHOD SUMITOMO CHEMICAL COMPANY ,LIMITED 2010-06-03 US disclosed
EP-2179651-A1 PLANT DISEASE CONTROL AGENT, AND PLANT DISEASE CONTROL METHOD Sumitomo Chemical Company, Limited (JP) 2010-04-28 EP disclosed
EP-2174931-A1 AMIDE COMPOUND AND METHOD FOR CONTROLLING PLANT DISEASE USING THE SAME Sumitomo Chemical Company, Limited (JP) 2010-04-14 EP disclosed
US-20100022089-A1 Method for manufacturing semiconductor device using quadruple-layer laminate NISSIAN CHEMICAL INDUSTRIES, LTD. (JP) 2010-01-28 US disclosed
US-20090311624-A1 RESIST UNDERLAYER FILM FORMING COMPOSITION CONTAINING LIQUID ADDITIVE NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2009-12-17 US disclosed
US-20090281200-A1 ORGANOSOL OF FLUORIDE COLLOID PARTICLE AND METHOD FOR PRODUCTION THEREOF NISSAN CHEMICAL INDUSTRIAL, LTD. (JP) 2009-11-12 US disclosed
CN-101523292-A Method for manufacturing semiconductor device using quadruple-layer laminate NISSAN CHEMICAL IND LTD (JP) 2009-09-02 CN disclosed
CN-101506736-A Resist underlayer film forming composition containing liquid additive NISSAN CHEMICAL IND LTD (JP) 2009-08-12 CN disclosed
EP-2085823-A1 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING QUADRUPLE-LAYER LAMINATE Nissan Chemical Industries, Ltd. (JP) 2009-08-05 EP disclosed
EP-2085435-A1 ORGANOSOL OF FLUORIDE COLLOID PARTICLE AND METHOD FOR PRODUCTION THEREOF Nissan Chemical Industries, Ltd. (JP) 2009-08-05 EP disclosed